Insights into Tungsten Chemical Mechanical Planarization: Part II. Effect of Pad Surface Micro-Texture on Frictional, Thermal and Kinetic Aspects of the Process

doi:10.1149/2.0251905jss

Title: Insights into Tungsten Chemical Mechanical Planarization: Part II. Effect of Pad Surface Micro-Texture on Frictional, Thermal and Kinetic Aspects of the Process

Authors:

;

; Suarez, Jon Sierra;

; Philipossian, Ara

Publication Date:: 2019-04-24

Sponsoring Org.:: USDOE

OSTI Identifier:: 1508689

Resource Type:: Published Article

Journal Name:: ECS Journal of Solid State Science and Technology

Additional Journal Information:: Journal Name: ECS Journal of Solid State Science and Technology Journal Volume: 8 Journal Issue: 5; Journal ID: ISSN 2162-8769

Publisher:: The Electrochemical Society

Country of Publication:: United States

Language:: English

Citation Formats


                    Mariscal, Juan Cristobal, McAllister, Jeffrey, Sampurno, Yasa, Suarez, Jon Sierra, Borucki, Leonard, and Philipossian, Ara. Insights into Tungsten Chemical Mechanical Planarization: Part II. Effect of Pad Surface Micro-Texture on Frictional, Thermal and Kinetic Aspects of the Process.  United States: N. p., 2019. 
        Web.  doi:10.1149/2.0251905jss.

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                    Mariscal, Juan Cristobal, McAllister, Jeffrey, Sampurno, Yasa, Suarez, Jon Sierra, Borucki, Leonard, & Philipossian, Ara. Insights into Tungsten Chemical Mechanical Planarization: Part II. Effect of Pad Surface Micro-Texture on Frictional, Thermal and Kinetic Aspects of the Process.  United States.  doi:10.1149/2.0251905jss.

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                    Mariscal, Juan Cristobal, McAllister, Jeffrey, Sampurno, Yasa, Suarez, Jon Sierra, Borucki, Leonard, and Philipossian, Ara. Wed .  
        "Insights into Tungsten Chemical Mechanical Planarization: Part II. Effect of Pad Surface Micro-Texture on Frictional, Thermal and Kinetic Aspects of the Process".  United States.  doi:10.1149/2.0251905jss.

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@article{osti_1508689,

  title        = {Insights into Tungsten Chemical Mechanical Planarization: Part II. Effect of Pad Surface Micro-Texture on Frictional, Thermal and Kinetic Aspects of the Process},

  author       = {Mariscal, Juan Cristobal and McAllister, Jeffrey and Sampurno, Yasa and Suarez, Jon Sierra and Borucki, Leonard and Philipossian, Ara},

  abstractNote = {},

  doi          = {10.1149/2.0251905jss},

  journal      = {ECS Journal of Solid State Science and Technology},

  number       = 5,

  volume       = 8,

  place        = {United States},

  year         = {2019},

  month        = {4}

}

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DOI: 10.1149/2.0251905jss

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Works referenced in this record:

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Real-Time Shear and Normal Force Trends in Tungsten Chemical Mechanical Planarization with Different Conditioning Discs
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ECS Journal of Solid State Science and Technology, Vol. 7, Issue 5
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Investigating Effect of Conditioner Aggressiveness on Removal Rate during Interlayer Dielectric Chemical Mechanical Planarization through Confocal Microscopy and Dual Emission Ultraviolet-Enhanced Fluorescence Imaging
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Effect of Pad Surface Micro-Texture on Tribological, Thermal and Kinetic Characterizations during Copper Chemical Mechanical Planarization
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Insights into Tungsten Chemical Mechanical Planarization: Part I. Surface Micro-Texture Evolution during Pad Break-In
journal, January 2019

Mariscal, Juan Cristobal; McAllister, Jeffrey; Sampurno, Yasa
ECS Journal of Solid State Science and Technology, Vol. 8, Issue 5
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Title: Insights into Tungsten Chemical Mechanical Planarization: Part II. Effect of Pad Surface Micro-Texture on Frictional, Thermal and Kinetic Aspects of the Process

Citation Formats

Optical and Mechanical Characterization of Chemical Mechanical Planarization Pad Surfaces journal, April 2010

Surface Kinetics Model for SiLK Chemical Mechanical Polishing journal, January 2002

Revisiting the Removal Rate Model for Oxide CMP journal, June 2005

Real-Time Shear and Normal Force Trends in Tungsten Chemical Mechanical Planarization with Different Conditioning Discs journal, January 2018

Investigating Effect of Conditioner Aggressiveness on Removal Rate during Interlayer Dielectric Chemical Mechanical Planarization through Confocal Microscopy and Dual Emission Ultraviolet-Enhanced Fluorescence Imaging journal, February 2010

CMP Pad Break-in Time Reduction in Silicon Wafer Polishing journal, January 2007

Effects of pad properties on material removal in chemical mechanical polishing journal, June 2007

Effect of CVD-Coated Diamond Discs on Pad Surface Micro-Texture and Polish Performance in Copper CMP journal, January 2018

Chemical mechanical planarization for microelectronics applications journal, October 2004

Real-Time Shear and Normal Force Trends in Copper Chemical Mechanical Planarization with Different Conditioning Discs journal, January 2018

Erratum: Synthesis of Pt/TiO2 Nanotube Catalysts for Cathodic Oxygen Reduction [J. Electrochem. Soc., 155, B915 (2008)] journal, January 2010

Effect of Conditioning Downforce and Pad Break-In Time on Pad Surface Micro-Texture journal, January 2018

Effect of Pad Surface Micro-Texture on Tribological, Thermal and Kinetic Characterizations during Copper Chemical Mechanical Planarization journal, January 2017

The Impact of Diamond Conditioning on Surface Contact in CMP Pads journal, January 2007

Investigating the effect of diamond size and conditioning force on chemical mechanical planarization pad topography journal, April 2010

Effect of Conditioner Type and Downforce, and Pad Break-In Time, on Pad Surface Micro-Texture in Chemical Mechanical Planarization journal, January 2018

Effect of pad surface micro-texture on dishing and erosion during shallow trench isolation chemical mechanical planarization journal, July 2014

Pad roughness evolution during break-in and its abrasion due to the pad-wafer contact in oxide CMP journal, November 2013

Occam's Razor journal, April 1987

Tribological, Thermal, and Kinetic Characterization of 300-mm Copper Chemical Mechanical Planarization Process journal, May 2011

Ockham's razor journal, January 1999

Insights into Tungsten Chemical Mechanical Planarization: Part I. Surface Micro-Texture Evolution during Pad Break-In journal, January 2019

Optical and Mechanical Characterization of Chemical Mechanical Planarization Pad Surfaces
journal, April 2010

Surface Kinetics Model for SiLK Chemical Mechanical Polishing
journal, January 2002

Revisiting the Removal Rate Model for Oxide CMP
journal, June 2005

Real-Time Shear and Normal Force Trends in Tungsten Chemical Mechanical Planarization with Different Conditioning Discs
journal, January 2018

Investigating Effect of Conditioner Aggressiveness on Removal Rate during Interlayer Dielectric Chemical Mechanical Planarization through Confocal Microscopy and Dual Emission Ultraviolet-Enhanced Fluorescence Imaging
journal, February 2010

CMP Pad Break-in Time Reduction in Silicon Wafer Polishing
journal, January 2007

Effects of pad properties on material removal in chemical mechanical polishing
journal, June 2007

Effect of CVD-Coated Diamond Discs on Pad Surface Micro-Texture and Polish Performance in Copper CMP
journal, January 2018

Chemical mechanical planarization for microelectronics applications
journal, October 2004

Real-Time Shear and Normal Force Trends in Copper Chemical Mechanical Planarization with Different Conditioning Discs
journal, January 2018

Erratum: Synthesis of Pt/TiO2 Nanotube Catalysts for Cathodic Oxygen Reduction [J. Electrochem. Soc., 155, B915 (2008)]
journal, January 2010

Effect of Conditioning Downforce and Pad Break-In Time on Pad Surface Micro-Texture
journal, January 2018

Effect of Pad Surface Micro-Texture on Tribological, Thermal and Kinetic Characterizations during Copper Chemical Mechanical Planarization
journal, January 2017

The Impact of Diamond Conditioning on Surface Contact in CMP Pads
journal, January 2007

Investigating the effect of diamond size and conditioning force on chemical mechanical planarization pad topography
journal, April 2010

Effect of Conditioner Type and Downforce, and Pad Break-In Time, on Pad Surface Micro-Texture in Chemical Mechanical Planarization
journal, January 2018

Effect of pad surface micro-texture on dishing and erosion during shallow trench isolation chemical mechanical planarization
journal, July 2014

Pad roughness evolution during break-in and its abrasion due to the pad-wafer contact in oxide CMP
journal, November 2013

Occam's Razor
journal, April 1987

Tribological, Thermal, and Kinetic Characterization of 300-mm Copper Chemical Mechanical Planarization Process
journal, May 2011

Ockham's razor
journal, January 1999

Insights into Tungsten Chemical Mechanical Planarization: Part I. Surface Micro-Texture Evolution during Pad Break-In
journal, January 2019