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Title: Acoustic Mismatch Model for Thermal Contact Conductance of Van Der Waals Contacts Under Static Force

Abstract

We report that Van der Waals interfaces play a major role in technology today. Thermal transport in material systems with van der Waals interfaces is mainly limited by the contact conductance. Although the effects of static force, such as pressure or the electrostatic part of hydrogen bonds, on the thermal contact conductance of van der Waals interfaces have been examined in a few studies, the focus was either on numerical simulation using techniques such as molecular dynamics or on experimental investigation. In this article, an analytical model of thermal contact conductance that accounts for the effects of static force and adhesion energy is presented. The application of static forces is found to cause a decrease in the intermolecular distance, which leads to increased interatomic forces across the interfaces and thus higher thermal conductance. The model is in good agreement with experimental data on the effect of pressure on thermal conductance collected by Gotsmann and Lantz (Nature Materials, Vol. 12, p. 59–65, 2012).

Authors:
 [1]
  1. Lawrence Berkeley National Lab. (LBNL), Berkeley, CA (United States); Univ. of California, Berkeley, CA (United States)
Publication Date:
Research Org.:
Lawrence Berkeley National Lab. (LBNL), Berkeley, CA (United States)
Sponsoring Org.:
USDOE Office of Energy Efficiency and Renewable Energy (EERE), Building Technologies Office (EE-5B)
OSTI Identifier:
1508056
Grant/Contract Number:  
AC02-05CH11231
Resource Type:
Accepted Manuscript
Journal Name:
Nanoscale and Microscale Thermophysical Engineering
Additional Journal Information:
Journal Volume: 22; Journal Issue: 1; Journal ID: ISSN 1556-7265
Publisher:
Taylor & Francis
Country of Publication:
United States
Language:
English
Subject:
36 MATERIALS SCIENCE; 42 ENGINEERING; Van der Waals interface; phonon thermal contact resistance; phonon thermal contact conductance; hard and soft interface; thermal transport at hydrogen bonds

Citation Formats

Prasher, Ravi. Acoustic Mismatch Model for Thermal Contact Conductance of Van Der Waals Contacts Under Static Force. United States: N. p., 2017. Web. doi:10.1080/15567265.2017.1391905.
Prasher, Ravi. Acoustic Mismatch Model for Thermal Contact Conductance of Van Der Waals Contacts Under Static Force. United States. doi:10.1080/15567265.2017.1391905.
Prasher, Ravi. Thu . "Acoustic Mismatch Model for Thermal Contact Conductance of Van Der Waals Contacts Under Static Force". United States. doi:10.1080/15567265.2017.1391905. https://www.osti.gov/servlets/purl/1508056.
@article{osti_1508056,
title = {Acoustic Mismatch Model for Thermal Contact Conductance of Van Der Waals Contacts Under Static Force},
author = {Prasher, Ravi},
abstractNote = {We report that Van der Waals interfaces play a major role in technology today. Thermal transport in material systems with van der Waals interfaces is mainly limited by the contact conductance. Although the effects of static force, such as pressure or the electrostatic part of hydrogen bonds, on the thermal contact conductance of van der Waals interfaces have been examined in a few studies, the focus was either on numerical simulation using techniques such as molecular dynamics or on experimental investigation. In this article, an analytical model of thermal contact conductance that accounts for the effects of static force and adhesion energy is presented. The application of static forces is found to cause a decrease in the intermolecular distance, which leads to increased interatomic forces across the interfaces and thus higher thermal conductance. The model is in good agreement with experimental data on the effect of pressure on thermal conductance collected by Gotsmann and Lantz (Nature Materials, Vol. 12, p. 59–65, 2012).},
doi = {10.1080/15567265.2017.1391905},
journal = {Nanoscale and Microscale Thermophysical Engineering},
number = 1,
volume = 22,
place = {United States},
year = {2017},
month = {11}
}

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Table 1 Table 1: Physical properties of taC used for calculations

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Works referenced in this record:

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