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Title: Liquid-Cooled Aluminum Silicon Carbide Heat Sinks for Reliable Power Electronics Packages

Abstract

With recent advances in the state-of-the-art of power electronic devices, packaging has become one of the critical factors limiting the performance and durability of power electronics. To this end, this study investigates the feasibility of a novel integrated package assembly, which consists of copper circuit layer on an aluminum nitride (AlN) dielectric layer that is bonded to an aluminum silicon carbide (AlSiC) substrate. The entire assembly possesses a low coefficient of thermal expansion (CTE) mismatch which aids in the thermal cycling reliability of the structure. The new assembly can serve as a replacement for the conventionally used direct bonded copper (DBC) - Cu base plate - Al heat sink assembly. While improvements in thermal cycling stability of more than a factor of 18 has been demonstrated, the use of AlSiC can result in increased thermal resistance when compared to thick copper heat spreaders. To address this issue, we demonstrate that the integration of single phase liquid cooling in the AlSiC layer can result in improved thermal performance, matching that of copper heat spreading layers. This is aided by the use of heat transfer enhancement features built into the AlSiC layer. It is found that, for a given pumping power andmore » through analytical optimization of geometries, either microchannels, pin fins and jets can be designed to yield a heat transfer coefficients of up to 65000 W m -2 K -1, which can result in competitive device temperatures as Cu-baseplate designs, but with added reliability.« less

Authors:
 [1];  [2];  [2];  [3];  [3];  [3];  [3];  [1]
  1. Georgia Inst. of Technology, Atlanta, GA (United States)
  2. Army Research Lab., Adelphi, MD (United States)
  3. National Renewable Energy Lab. (NREL), Golden, CO (United States)
Publication Date:
Research Org.:
National Renewable Energy Lab. (NREL), Golden, CO (United States)
Sponsoring Org.:
USDOE National Renewable Energy Laboratory (NREL), Laboratory Directed Research and Development (LDRD) Program
OSTI Identifier:
1507288
Report Number(s):
NREL/JA-5400-71792
Journal ID: ISSN 1043-7398
Grant/Contract Number:  
AC36-08GO28308
Resource Type:
Accepted Manuscript
Journal Name:
Journal of Electronic Packaging
Additional Journal Information:
Journal Volume: 141; Journal Issue: 4; Journal ID: ISSN 1043-7398
Publisher:
ASME
Country of Publication:
United States
Language:
English
Subject:
30 DIRECT ENERGY CONVERSION; 47 OTHER INSTRUMENTATION; aluminum; heat sinks; silicon; electronic packages; copper; manufacturing; reliability; jets; durability; optimization

Citation Formats

Pahinkar, Darshan, Boteler, Lauren, Ibitayo, Dimeji, Narumanchi, Sreekant, Paret, Paul, DeVoto, Douglas, Major, Joshua, and Graham, Samuel. Liquid-Cooled Aluminum Silicon Carbide Heat Sinks for Reliable Power Electronics Packages. United States: N. p., 2019. Web. doi:10.1115/1.4043406.
Pahinkar, Darshan, Boteler, Lauren, Ibitayo, Dimeji, Narumanchi, Sreekant, Paret, Paul, DeVoto, Douglas, Major, Joshua, & Graham, Samuel. Liquid-Cooled Aluminum Silicon Carbide Heat Sinks for Reliable Power Electronics Packages. United States. doi:10.1115/1.4043406.
Pahinkar, Darshan, Boteler, Lauren, Ibitayo, Dimeji, Narumanchi, Sreekant, Paret, Paul, DeVoto, Douglas, Major, Joshua, and Graham, Samuel. Wed . "Liquid-Cooled Aluminum Silicon Carbide Heat Sinks for Reliable Power Electronics Packages". United States. doi:10.1115/1.4043406.
@article{osti_1507288,
title = {Liquid-Cooled Aluminum Silicon Carbide Heat Sinks for Reliable Power Electronics Packages},
author = {Pahinkar, Darshan and Boteler, Lauren and Ibitayo, Dimeji and Narumanchi, Sreekant and Paret, Paul and DeVoto, Douglas and Major, Joshua and Graham, Samuel},
abstractNote = {With recent advances in the state-of-the-art of power electronic devices, packaging has become one of the critical factors limiting the performance and durability of power electronics. To this end, this study investigates the feasibility of a novel integrated package assembly, which consists of copper circuit layer on an aluminum nitride (AlN) dielectric layer that is bonded to an aluminum silicon carbide (AlSiC) substrate. The entire assembly possesses a low coefficient of thermal expansion (CTE) mismatch which aids in the thermal cycling reliability of the structure. The new assembly can serve as a replacement for the conventionally used direct bonded copper (DBC) - Cu base plate - Al heat sink assembly. While improvements in thermal cycling stability of more than a factor of 18 has been demonstrated, the use of AlSiC can result in increased thermal resistance when compared to thick copper heat spreaders. To address this issue, we demonstrate that the integration of single phase liquid cooling in the AlSiC layer can result in improved thermal performance, matching that of copper heat spreading layers. This is aided by the use of heat transfer enhancement features built into the AlSiC layer. It is found that, for a given pumping power and through analytical optimization of geometries, either microchannels, pin fins and jets can be designed to yield a heat transfer coefficients of up to 65000 W m-2 K-1, which can result in competitive device temperatures as Cu-baseplate designs, but with added reliability.},
doi = {10.1115/1.4043406},
journal = {Journal of Electronic Packaging},
number = 4,
volume = 141,
place = {United States},
year = {2019},
month = {5}
}

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This content will become publicly available on May 8, 2020
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