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Title: Review of Polymer‐Based Nanodielectric Exploration and Film Scale‐Up for Advanced Capacitors

Authors:
ORCiD logo [1]
  1. Technion Israel Institute of Technology and Guangdong Technion Israel Institute of Technology 241 Daxue Road, Jinping District Shantou Guangdong 515063 China
Publication Date:
Sponsoring Org.:
USDOE
OSTI Identifier:
1507172
Grant/Contract Number:  
DEEE0006433
Resource Type:
Publisher's Accepted Manuscript
Journal Name:
Advanced Functional Materials
Additional Journal Information:
Journal Name: Advanced Functional Materials Journal Volume: 30 Journal Issue: 18; Journal ID: ISSN 1616-301X
Publisher:
Wiley Blackwell (John Wiley & Sons)
Country of Publication:
Germany
Language:
English

Citation Formats

Tan, Daniel Q. Review of Polymer‐Based Nanodielectric Exploration and Film Scale‐Up for Advanced Capacitors. Germany: N. p., 2019. Web. doi:10.1002/adfm.201808567.
Tan, Daniel Q. Review of Polymer‐Based Nanodielectric Exploration and Film Scale‐Up for Advanced Capacitors. Germany. doi:10.1002/adfm.201808567.
Tan, Daniel Q. Mon . "Review of Polymer‐Based Nanodielectric Exploration and Film Scale‐Up for Advanced Capacitors". Germany. doi:10.1002/adfm.201808567.
@article{osti_1507172,
title = {Review of Polymer‐Based Nanodielectric Exploration and Film Scale‐Up for Advanced Capacitors},
author = {Tan, Daniel Q.},
abstractNote = {},
doi = {10.1002/adfm.201808567},
journal = {Advanced Functional Materials},
number = 18,
volume = 30,
place = {Germany},
year = {2019},
month = {4}
}

Journal Article:
Free Publicly Available Full Text
Publisher's Version of Record
DOI: 10.1002/adfm.201808567

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