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Title: Insights into Tungsten Chemical Mechanical Planarization: Part I. Surface Micro-Texture Evolution during Pad Break-In

Authors:
ORCiD logo; ORCiD logo; ORCiD logo; ; ORCiD logo;
Publication Date:
Sponsoring Org.:
USDOE
OSTI Identifier:
1504522
Resource Type:
Published Article
Journal Name:
ECS Journal of Solid State Science and Technology
Additional Journal Information:
Journal Name: ECS Journal of Solid State Science and Technology Journal Volume: 8 Journal Issue: 5; Journal ID: ISSN 2162-8769
Publisher:
The Electrochemical Society
Country of Publication:
United States
Language:
English

Citation Formats

Mariscal, Juan Cristobal, McAllister, Jeffrey, Sampurno, Yasa, Suarez, Jon Sierra, Borucki, Leonard, and Philipossian, Ara. Insights into Tungsten Chemical Mechanical Planarization: Part I. Surface Micro-Texture Evolution during Pad Break-In. United States: N. p., 2019. Web. doi:10.1149/2.0141905jss.
Mariscal, Juan Cristobal, McAllister, Jeffrey, Sampurno, Yasa, Suarez, Jon Sierra, Borucki, Leonard, & Philipossian, Ara. Insights into Tungsten Chemical Mechanical Planarization: Part I. Surface Micro-Texture Evolution during Pad Break-In. United States. doi:10.1149/2.0141905jss.
Mariscal, Juan Cristobal, McAllister, Jeffrey, Sampurno, Yasa, Suarez, Jon Sierra, Borucki, Leonard, and Philipossian, Ara. Tue . "Insights into Tungsten Chemical Mechanical Planarization: Part I. Surface Micro-Texture Evolution during Pad Break-In". United States. doi:10.1149/2.0141905jss.
@article{osti_1504522,
title = {Insights into Tungsten Chemical Mechanical Planarization: Part I. Surface Micro-Texture Evolution during Pad Break-In},
author = {Mariscal, Juan Cristobal and McAllister, Jeffrey and Sampurno, Yasa and Suarez, Jon Sierra and Borucki, Leonard and Philipossian, Ara},
abstractNote = {},
doi = {10.1149/2.0141905jss},
journal = {ECS Journal of Solid State Science and Technology},
number = 5,
volume = 8,
place = {United States},
year = {2019},
month = {4}
}

Journal Article:
Free Publicly Available Full Text
Publisher's Version of Record
DOI: 10.1149/2.0141905jss

Citation Metrics:
Cited by: 2 works
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Works referenced in this record:

Optical and Mechanical Characterization of Chemical Mechanical Planarization Pad Surfaces
journal, April 2010

  • Sun, Ting; Zhuang, Yun; Borucki, Leonard
  • Japanese Journal of Applied Physics, Vol. 49, Issue 4
  • DOI: 10.1143/JJAP.49.046501

CMP Pad Break-in Time Reduction in Silicon Wafer Polishing
journal, January 2007


Effects of pad properties on material removal in chemical mechanical polishing
journal, June 2007


Chemical mechanical planarization for microelectronics applications
journal, October 2004

  • Zantye, Parshuram B.; Kumar, Ashok; Sikder, A. K.
  • Materials Science and Engineering: R: Reports, Vol. 45, Issue 3-6
  • DOI: 10.1016/j.mser.2004.06.002

Erratum: Synthesis of Pt/TiO2 Nanotube Catalysts for Cathodic Oxygen Reduction [J. Electrochem. Soc., 155, B915 (2008)]
journal, January 2010

  • Lee, Woo-Jin; Alhoshan, Mansour; Yohe, Sara L.
  • Journal of The Electrochemical Society, Vol. 157, Issue 6
  • DOI: 10.1149/1.3377120

Effect of Conditioning Downforce and Pad Break-In Time on Pad Surface Micro-Texture
journal, January 2018

  • McAllister, Jeffrey; Stuffle, Calliandra; Sampurno, Yasa
  • ECS Journal of Solid State Science and Technology, Vol. 7, Issue 5
  • DOI: 10.1149/2.0271805jss

CMP Active Diamond Characterization and Conditioner Wear
journal, January 2007


The Impact of Diamond Conditioning on Surface Contact in CMP Pads
journal, January 2007


Investigating the effect of diamond size and conditioning force on chemical mechanical planarization pad topography
journal, April 2010


Effect of Conditioner Type and Downforce, and Pad Break-In Time, on Pad Surface Micro-Texture in Chemical Mechanical Planarization
journal, January 2018

  • McAllister, Jeffrey; Stuffle, Calliandra; Sampurno, Yasa
  • ECS Journal of Solid State Science and Technology, Vol. 7, Issue 11
  • DOI: 10.1149/2.0261811jss

Effect of pad surface micro-texture on dishing and erosion during shallow trench isolation chemical mechanical planarization
journal, July 2014

  • Liao, Xiaoyan; Zhuang, Yun; Borucki, Leonard J.
  • Japanese Journal of Applied Physics, Vol. 53, Issue 8
  • DOI: 10.7567/JJAP.53.086501

Pad roughness evolution during break-in and its abrasion due to the pad-wafer contact in oxide CMP
journal, November 2013