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Title: Epitaxial integration and properties of SrRuO3 on silicon

Journal Article · · APL Materials
DOI: https://doi.org/10.1063/1.5041940 · OSTI ID:1501523
 [1];  [2]; ORCiD logo [2];  [3];  [4];  [5];  [2];  [4];  [5];  [6];  [7]
  1. Cornell Univ., Ithaca, NY (United States). School of Applied and Engineering Physics; Department of Materials Science and Engineering, Cornell University, Ithaca, New York 14853, USA
  2. Cornell Univ., Ithaca, NY (United States). Dept. of Materials Science and Engineering
  3. Samsung Electronics, Milpitas, CA (United States). 3New Memory Technology Lab, Semiconductor R&D Center
  4. Samsung Electronics, Yeongtong-gu, Suwon-si (South Korea). Samsung Advanced Inst. of Technology (SAIT), Platform Technology Lab.
  5. Samsung Semiconductor R&D Center 1, Samsungjeonja-ro, Hwaseong-si (South Korea)
  6. Cornell Univ., Ithaca, NY (United States). School of Applied and Engineering Physics; Kavli Inst. at Cornell for Nanoscale Science, Ithaca, NY (United States)
  7. Cornell Univ., Ithaca, NY (United States). Dept. of Materials Science and Engineering; Kavli Inst. at Cornell for Nanoscale Science, Ithaca, NY (United States)

We report the integration of SrRuO3, one of the most widely used oxide electrode materials in functional oxide heterostructures, with silicon using molecular-beam epitaxy and an SrTiO3 buffer layer. The resulting SrRuO3 film has a rocking curve full width at half maximum of 0.01°, a resistivity at room temperature of 250 μΩ cm, a residual resistivity ratio (ρ300 K/ρ4 K) of 11, and a paramagnetic-to-ferromagnetic transition temperature of ~160 K. These structural, electrical, and magnetic properties compare favorably to the best reported values for SrRuO3 films on silicon and rival those of epitaxial SrRuO3 films produced directly on SrTiO3 single crystals by thin film growth techniques other than molecular-beam epitaxy. These high quality SrRuO3 films with metallic conductivity on silicon are relevant to integrating multi-functional oxides with the workhorse of semiconductor technology, silicon.

Research Organization:
Krell Institute, Inc., Ames, IA (United States)
Sponsoring Organization:
USDOE
Grant/Contract Number:
FG02-97ER25308
OSTI ID:
1501523
Journal Information:
APL Materials, Journal Name: APL Materials Journal Issue: 8 Vol. 6; ISSN 2166-532X
Publisher:
American Institute of Physics (AIP)Copyright Statement
Country of Publication:
United States
Language:
English

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