Mechanisms of adhesion degradation at the photovoltiac module's cell metallization-encapsulant interface

Bosco, Nick; Moffitt, Stephanie; Schelhas, Laura T.

doi:10.1002/pip.3106

Title: Mechanisms of adhesion degradation at the photovoltiac module's cell metallization-encapsulant interface

Abstract

Adhesion measurements and chemical characterization of the encapsulant/silver metallization interface of a photovoltaic (PV) module through temperature, humidity, and voltage bias exposures were conducted. Results demonstrate two independent degradation mechanisms: (a) with voltage bias, the ionic conduction of Na⁺ ions through the encapsulant results in the formation of sodium silicate at the silver metallization surface, thereby weakening that interface and (b) with moisture ingress, dissociation of the silane bonding to silver in the silver oxide similarly weakens this interface resulting in significantly lower debond energies.

Authors:

^[1]; Moffitt, Stephanie ^[2];

^[2]

National Renewable Energy Lab. (NREL), Golden, CO (United States)
SLAC National Accelerator Lab., Menlo Park, CA (United States). Applied Energy Division

Publication Date:: Wed Dec 26 00:00:00 EST 2018

Research Org.:: SLAC National Accelerator Laboratory (SLAC), Menlo Park, CA (United States); National Renewable Energy Laboratory (NREL), Golden, CO (United States)

Sponsoring Org.:: USDOE Office of Energy Efficiency and Renewable Energy (EERE), Renewable Power Office. Solar Energy Technologies Office; National Science Foundation (NSF)

OSTI Identifier:: 1528832

Alternate Identifier(s):: OSTI ID: 1490900; OSTI ID: 1494066

Report Number(s):: NREL/JA-5K00-72105
Journal ID: ISSN 1062-7995

Grant/Contract Number:: AC02-76SF00515; 30309; ECCS‐1542152; AC36-08GO28308

Resource Type:: Accepted Manuscript

Journal Name:: Progress in Photovoltaics

Additional Journal Information:: Journal Volume: 27; Journal Issue: 4; Journal ID: ISSN 1062-7995

Publisher:: Wiley

Country of Publication:: United States

Language:: English

Subject:: 14 SOLAR ENERGY; 36 MATERIALS SCIENCE; degradation; encapsulation; metallization; photovoltaic module; reliability; screen printing

Citation Formats


                    Bosco, Nick, Moffitt, Stephanie, and Schelhas, Laura T. Mechanisms of adhesion degradation at the photovoltiac module's cell metallization-encapsulant interface.  United States: N. p., 2018. 
Web.  doi:10.1002/pip.3106.

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                    Bosco, Nick, Moffitt, Stephanie, & Schelhas, Laura T. Mechanisms of adhesion degradation at the photovoltiac module's cell metallization-encapsulant interface.  United States.  https://doi.org/10.1002/pip.3106

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                    Bosco, Nick, Moffitt, Stephanie, and Schelhas, Laura T. Wed .  
"Mechanisms of adhesion degradation at the photovoltiac module's cell metallization-encapsulant interface".  United States.  https://doi.org/10.1002/pip.3106.  https://www.osti.gov/servlets/purl/1528832.

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@article{osti_1528832,

  title        = {Mechanisms of adhesion degradation at the photovoltiac module's cell metallization-encapsulant interface},

  author       = {Bosco, Nick and Moffitt, Stephanie and Schelhas, Laura T.},

  abstractNote = {Adhesion measurements and chemical characterization of the encapsulant/silver metallization interface of a photovoltaic (PV) module through temperature, humidity, and voltage bias exposures were conducted. Results demonstrate two independent degradation mechanisms: (a) with voltage bias, the ionic conduction of Na+ ions through the encapsulant results in the formation of sodium silicate at the silver metallization surface, thereby weakening that interface and (b) with moisture ingress, dissociation of the silane bonding to silver in the silver oxide similarly weakens this interface resulting in significantly lower debond energies.},

  doi          = {10.1002/pip.3106},

  journal      = {Progress in Photovoltaics},

  number       = 4,

  volume       = 27,

  place        = {United States},

  year         = {Wed Dec 26 00:00:00 EST 2018},

  month        = {Wed Dec 26 00:00:00 EST 2018}

}

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Works referenced in this record:

The effect of encapsulant delamination on electrical performance of PV module
conference, June 2011

Park, Nochang; Han, Changwoon; Hong, Wonsik
2011 37th IEEE Photovoltaic Specialists Conference (PVSC)
DOI: 10.1109/PVSC.2011.6186147

Microscopic Degradation Mechanisms in Silicon Photovoltaic Module under Long-Term Environmental Exposure
journal, October 2012

Matsuda, Keiko; Watanabe, Takeshi; Sakaguchi, Koichi
Japanese Journal of Applied Physics, Vol. 51, Issue 10S
DOI: 10.7567/JJAP.51.10NF07

Encapsulant Adhesion to Surface Metallization on Photovoltaic Cells
journal, November 2017

Tracy, Jared; Bosco, Nick; Dauskardt, Reinhold
IEEE Journal of Photovoltaics, Vol. 7, Issue 6
DOI: 10.1109/JPHOTOV.2017.2746572

Defining Threshold Values of Encapsulant and Backsheet Adhesion for PV Module Reliability
journal, November 2017

Bosco, Nick; Eafanti, Joshua; Kurtz, Sarah
IEEE Journal of Photovoltaics, Vol. 7, Issue 6
DOI: 10.1109/JPHOTOV.2017.2746682

In-Situ Monitoring of Moisture Ingress in PV Modules Using Digital Humidity Sensors
journal, September 2016

Jankovec, Marko; Galliano, Federico; Annigoni, Eleonora
IEEE Journal of Photovoltaics, Vol. 6, Issue 5
DOI: 10.1109/JPHOTOV.2016.2583779

Evaluation of performance parameters of PV modules deployed outdoors
journal, April 2005

Gxasheka, A. R.; van Dyk, E. E.; Meyer, E. L.
Renewable Energy, Vol. 30, Issue 4
DOI: 10.1016/j.renene.2004.06.005

XPS core level spectra and Auger parameters for some silver compounds
journal, June 1991

Kaushik, Vijay Kumar
Journal of Electron Spectroscopy and Related Phenomena, Vol. 56, Issue 3
DOI: 10.1016/0368-2048(91)85008-H

Environmental Influence on Module Delamination Rate
journal, March 2019

Bosco, Nick; Tracy, Jared; Dauskardt, Reinhold
IEEE Journal of Photovoltaics, Vol. 9, Issue 2
DOI: 10.1109/JPHOTOV.2018.2877436

Auger and photoelectron line energy relationships in aluminum–oxygen and silicon–oxygen compounds
journal, November 1982

Wagner, C. D.; Passoja, D. E.; Hillery, H. F.
Journal of Vacuum Science and Technology, Vol. 21, Issue 4
DOI: 10.1116/1.571870

Assessing the causes of encapsulant delamination in PV modules
conference, June 2016

Wohlgemuth, John H.; Hacke, Peter; Bosco, Nick
2016 IEEE 43rd Photovoltaic Specialists Conference (PVSC)
DOI: 10.1109/PVSC.2016.7749589

Development and first results of the width-tapered beam method for adhesion testing of photovoltaic material systems
conference, June 2016

Bosco, Nick; Tracy, Jared; Dauskardt, Reinhold
2016 IEEE 43rd Photovoltaic Specialists Conference (PVSC)
DOI: 10.1109/PVSC.2016.7749558

Bridging, non-bridging and free (O2–) oxygen in Na2O-SiO2 glasses: An X-ray Photoelectron Spectroscopic (XPS) and Nuclear Magnetic Resonance (NMR) study
journal, January 2011

Nesbitt, H. W.; Bancroft, G. M.; Henderson, G. S.
Journal of Non-Crystalline Solids, Vol. 357, Issue 1
DOI: 10.1016/j.jnoncrysol.2010.09.031

Electrochemical mechanisms of leakage-current-enhanced delamination and corrosion in Si photovoltaic modules
journal, December 2018

Li, Jichao; Shen, Yu-Chen; Hacke, Peter
Solar Energy Materials and Solar Cells, Vol. 188
DOI: 10.1016/j.solmat.2018.09.010

Evaluation of PV module field performance
conference, June 2015

Wohlgemuth, John; Silverman, Timothy; Miller, David C.
2015 IEEE 42nd Photovoltaic Specialists Conference (PVSC), 2015 IEEE 42nd Photovoltaic Specialist Conference (PVSC)
DOI: 10.1109/PVSC.2015.7356132

Defining Threshold Values of Encapsulant and Backsheet Adhesion for PV Module Reliability
conference, June 2017

Bosco, Nick; Eafanti, Joshua; Kurtz, Sarah
2017 IEEE 44th Photovoltaic Specialists Conference (PVSC), 2017 IEEE 44th Photovoltaic Specialist Conference (PVSC)
DOI: 10.1109/pvsc.2017.8366641

Encapsulant Adhesion to Surface Metallization on Photovoltaic Cells
conference, June 2017

Tracy, Jared; Bosco, Nick; Dauskardt, Reinhold
2017 IEEE 44th Photovoltaic Specialists Conference (PVSC), 2017 IEEE 44th Photovoltaic Specialist Conference (PVSC)
DOI: 10.1109/pvsc.2017.8366642

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Similar Records

Title: Mechanisms of adhesion degradation at the photovoltiac module's cell metallization-encapsulant interface

Abstract

Citation Formats

The effect of encapsulant delamination on electrical performance of PV module conference, June 2011

Microscopic Degradation Mechanisms in Silicon Photovoltaic Module under Long-Term Environmental Exposure journal, October 2012

Encapsulant Adhesion to Surface Metallization on Photovoltaic Cells journal, November 2017

Defining Threshold Values of Encapsulant and Backsheet Adhesion for PV Module Reliability journal, November 2017

In-Situ Monitoring of Moisture Ingress in PV Modules Using Digital Humidity Sensors journal, September 2016

Evaluation of performance parameters of PV modules deployed outdoors journal, April 2005

XPS core level spectra and Auger parameters for some silver compounds journal, June 1991

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Auger and photoelectron line energy relationships in aluminum–oxygen and silicon–oxygen compounds journal, November 1982

Assessing the causes of encapsulant delamination in PV modules conference, June 2016

Development and first results of the width-tapered beam method for adhesion testing of photovoltaic material systems conference, June 2016

Bridging, non-bridging and free (O2–) oxygen in Na2O-SiO2 glasses: An X-ray Photoelectron Spectroscopic (XPS) and Nuclear Magnetic Resonance (NMR) study journal, January 2011

Electrochemical mechanisms of leakage-current-enhanced delamination and corrosion in Si photovoltaic modules journal, December 2018

Evaluation of PV module field performance conference, June 2015

Defining Threshold Values of Encapsulant and Backsheet Adhesion for PV Module Reliability conference, June 2017

Encapsulant Adhesion to Surface Metallization on Photovoltaic Cells conference, June 2017

The effect of encapsulant delamination on electrical performance of PV module
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Microscopic Degradation Mechanisms in Silicon Photovoltaic Module under Long-Term Environmental Exposure
journal, October 2012

Encapsulant Adhesion to Surface Metallization on Photovoltaic Cells
journal, November 2017

Defining Threshold Values of Encapsulant and Backsheet Adhesion for PV Module Reliability
journal, November 2017

In-Situ Monitoring of Moisture Ingress in PV Modules Using Digital Humidity Sensors
journal, September 2016

Evaluation of performance parameters of PV modules deployed outdoors
journal, April 2005

XPS core level spectra and Auger parameters for some silver compounds
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