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Title: Liquid crystal polymer receiver modules for electron cyclotron emission imaging on the DIII-D tokamak

Abstract

A new generation of millimeter-wave heterodyne imaging receiver arrays has been developed and demonstrated on the DIII-D electron cyclotron emission imaging (ECEI) system. Improved circuit integration, improved noise performance, and enhanced shielding from out-of-band emission are made possible by using advanced liquid crystal polymer (LCP) substrates and monolithic microwave integrated circuit (MMIC) receiver chips. This array exhibits ~15 dB additional gain and >30× reduction in noise temperature compared to previous generation ECEI arrays. Each LCP horn-waveguide module houses a 3 × 3 mm GaAs MMIC receiver chip, which consists of a low noise millimeter-wave preamplifier, balanced mixer, and IF amplifier together with a local oscillator multiplier chain driven at ~12 GHz. A proof-of-principle partial LCP instrument with 5 poloidal channels was installed on DIII-D in 2017, with a full proof-of-principle system (20 poloidal × 8 radial channels) installed and commissioned in early 2018. The enhanced shielding of the LCP modules is seen to greatly reduce the sensitivity of ECEI signals to out-of-band microwave noise which has plagued previous ECEI studies on DIII-D. As a result, the LCP ECEI system is expected to be a valuable diagnostic tool for pedestal region measurements, focusing particularly on electron temperature evolution during edge localizedmore » mode bursting.« less

Authors:
 [1];  [1];  [1];  [2];  [1];  [1];  [1]; ORCiD logo [1];  [3];  [3];  [3];  [3];  [1]; ORCiD logo [1];  [1]
  1. Univ. of California, Davis, CA (United States)
  2. Los Alamos National Lab. (LANL), Los Alamos, NM (United States)
  3. Princeton Plasma Physics Lab. (PPPL), Princeton, NJ (United States)
Publication Date:
Research Org.:
Princeton Plasma Physics Lab. (PPPL), Princeton, NJ (United States); Univ. of California, Davis, CA (United States)
Sponsoring Org.:
USDOE Office of Science (SC)
OSTI Identifier:
1487098
Alternate Identifier(s):
OSTI ID: 1476966; OSTI ID: 1597416
Grant/Contract Number:  
AC02-09CH11466; FC02-04ER54698; FG02-99ER54531
Resource Type:
Accepted Manuscript
Journal Name:
Review of Scientific Instruments
Additional Journal Information:
Journal Volume: 89; Journal Issue: 10; Conference: 22. High-Temperature Plasma Diagnostics (HTPD 2018) Conference, San Diego, CA (United States), 15-19 Apr 2018; Journal ID: ISSN 0034-6748
Publisher:
American Institute of Physics (AIP)
Country of Publication:
United States
Language:
English
Subject:
70 PLASMA PHYSICS AND FUSION TECHNOLOGY; Electron Cyclotron Emission Imaging; DIII-D; monolithic microwave integrated circuit; edge localized mode; Electron Cyclotron Emission Imaging, DIII-D, monolithic microwave integrated circuit, edge localized mode

Citation Formats

Zhu, Y., Ye, Y., Yu, J. -H., Tobias, B., Pham, A. -V., Wang, Y., Luo, C., Domier, C. W., Kramer, G., Ren, Y., Diallo, A., Nazikian, R., Chen, M., Yu, G., and Luhmann, Jr., N. C. Liquid crystal polymer receiver modules for electron cyclotron emission imaging on the DIII-D tokamak. United States: N. p., 2018. Web. doi:10.1063/1.5035373.
Zhu, Y., Ye, Y., Yu, J. -H., Tobias, B., Pham, A. -V., Wang, Y., Luo, C., Domier, C. W., Kramer, G., Ren, Y., Diallo, A., Nazikian, R., Chen, M., Yu, G., & Luhmann, Jr., N. C. Liquid crystal polymer receiver modules for electron cyclotron emission imaging on the DIII-D tokamak. United States. doi:https://doi.org/10.1063/1.5035373
Zhu, Y., Ye, Y., Yu, J. -H., Tobias, B., Pham, A. -V., Wang, Y., Luo, C., Domier, C. W., Kramer, G., Ren, Y., Diallo, A., Nazikian, R., Chen, M., Yu, G., and Luhmann, Jr., N. C. Wed . "Liquid crystal polymer receiver modules for electron cyclotron emission imaging on the DIII-D tokamak". United States. doi:https://doi.org/10.1063/1.5035373. https://www.osti.gov/servlets/purl/1487098.
@article{osti_1487098,
title = {Liquid crystal polymer receiver modules for electron cyclotron emission imaging on the DIII-D tokamak},
author = {Zhu, Y. and Ye, Y. and Yu, J. -H. and Tobias, B. and Pham, A. -V. and Wang, Y. and Luo, C. and Domier, C. W. and Kramer, G. and Ren, Y. and Diallo, A. and Nazikian, R. and Chen, M. and Yu, G. and Luhmann, Jr., N. C.},
abstractNote = {A new generation of millimeter-wave heterodyne imaging receiver arrays has been developed and demonstrated on the DIII-D electron cyclotron emission imaging (ECEI) system. Improved circuit integration, improved noise performance, and enhanced shielding from out-of-band emission are made possible by using advanced liquid crystal polymer (LCP) substrates and monolithic microwave integrated circuit (MMIC) receiver chips. This array exhibits ~15 dB additional gain and >30× reduction in noise temperature compared to previous generation ECEI arrays. Each LCP horn-waveguide module houses a 3 × 3 mm GaAs MMIC receiver chip, which consists of a low noise millimeter-wave preamplifier, balanced mixer, and IF amplifier together with a local oscillator multiplier chain driven at ~12 GHz. A proof-of-principle partial LCP instrument with 5 poloidal channels was installed on DIII-D in 2017, with a full proof-of-principle system (20 poloidal × 8 radial channels) installed and commissioned in early 2018. The enhanced shielding of the LCP modules is seen to greatly reduce the sensitivity of ECEI signals to out-of-band microwave noise which has plagued previous ECEI studies on DIII-D. As a result, the LCP ECEI system is expected to be a valuable diagnostic tool for pedestal region measurements, focusing particularly on electron temperature evolution during edge localized mode bursting.},
doi = {10.1063/1.5035373},
journal = {Review of Scientific Instruments},
number = 10,
volume = 89,
place = {United States},
year = {2018},
month = {10}
}

Journal Article:
Free Publicly Available Full Text
Publisher's Version of Record

Figures / Tables:

FIG. 1 FIG. 1: (a) The side view of the LCP module shows the entire printed circuit board which was installed in the individual shielding module with machined pyramidal horn antenna. (b) Schematic of LCP electronics including PCB layer and MMIC layer. (c) Photo of the MMIC shows the RF and LOmore » inputs and IF output signal.« less

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    Figures/Tables have been extracted from DOE-funded journal article accepted manuscripts.