The Effects of Plating Current, Grain Size, and Electrolyte on Stress Evolution in Electrodeposited Ni

Rao, Z.; Hearne, S. J.; Chason, E.

doi:10.1149/2.0261901jes

Title: The Effects of Plating Current, Grain Size, and Electrolyte on Stress Evolution in Electrodeposited Ni

Journal Article · 06 December 2018 · Journal of the Electrochemical Society

DOI: https://doi.org/10.1149/2.0261901jes · OSTI ID:1484836

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; Chason, E.

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Sponsoring Organization:: USDOE National Nuclear Security Administration (NNSA)

Grant/Contract Number:: NA0003525

OSTI ID:: 1484836

Journal Information:: Journal of the Electrochemical Society, Journal Name: Journal of the Electrochemical Society Journal Issue: 1 Vol. 166; ISSN 0013-4651

Publisher:: The Electrochemical SocietyCopyright Statement

Country of Publication:: United States

Language:: English

References (28)

Origins of saccharin-induced stress reduction based on observed fracture behavior of electrodeposited Ni films Soni, Sumit K.; Sheldon, Brian W.; Hearne, Sean J. Journal of Materials Science, Vol. 49, Issue 3 https://doi.org/10.1007/s10853-013-7824-5	journal	October 2013
Microstructural and mechanical properties investigation of electrodeposited and annealed LIGA nickel structures Buchheit, Thomas E.; Michael, Joseph R.; Christenson, Todd R. Metallurgical and Materials Transactions A, Vol. 33, Issue 3 https://doi.org/10.1007/s11661-002-0116-3	journal	March 2002
Stresses in thin films: The relevance of grain boundaries and impurities Hoffman, R. W. Thin Solid Films, Vol. 34, Issue 2 https://doi.org/10.1016/0040-6090(76)90453-3	journal	May 1976
Measurements of the intrinsic stress in thin metal films Abermann, R. Vacuum, Vol. 41, Issue 4-6 https://doi.org/10.1016/0042-207X(90)93933-A	journal	January 1990
Interfaces and stresses in thin films Spaepen, F. Acta Materialia, Vol. 48, Issue 1 https://doi.org/10.1016/S1359-6454(99)00286-4	journal	January 2000
Grain growth and complex stress evolution during Volmer–Weber growth of polycrystalline thin films Yu, Hang Z.; Thompson, Carl V. Acta Materialia, Vol. 67 https://doi.org/10.1016/j.actamat.2013.12.031	journal	April 2014
Mechanics of compressive stress evolution during thin film growth Guduru, P. R.; Chason, E.; Freund, L. B. Journal of the Mechanics and Physics of Solids, Vol. 51, Issue 11-12 https://doi.org/10.1016/j.jmps.2003.09.013	journal	November 2003
Origins of residual stress in thin films: Interaction between microstructure and growth kinetics Engwall, A. M.; Rao, Z.; Chason, E. Materials & Design, Vol. 110 https://doi.org/10.1016/j.matdes.2016.07.089	journal	November 2016
Influence of lower current densities on the residual stress and structure of thick nickel electrodeposits Pathak, Siddhartha; Guinard, Marion; Vernooij, Martine G. C. Surface and Coatings Technology, Vol. 205, Issue 12 https://doi.org/10.1016/j.surfcoat.2011.01.012	journal	March 2011
A kinetic analysis of residual stress evolution in polycrystalline thin films Chason, Eric Thin Solid Films, Vol. 526 https://doi.org/10.1016/j.tsf.2012.11.001	journal	December 2012
Thin Film Materials Freund, L. B.; Suresh, S. https://doi.org/10.1017/CBO9780511754715	book	July 2010
Mechanisms inducing compressive stress during electrodeposition of Ni Hearne, Sean J.; Floro, Jerry A. Journal of Applied Physics, Vol. 97, Issue 1 https://doi.org/10.1063/1.1819972	journal	January 2005
Measurements of stress during vapor deposition of copper and silver thin films and multilayers Shull, Alison L.; Spaepen, Frans Journal of Applied Physics, Vol. 80, Issue 11 https://doi.org/10.1063/1.363701	journal	December 1996
Tutorial: Understanding residual stress in polycrystalline thin films through real-time measurements and physical models Chason, Eric; Guduru, Pradeep R. Journal of Applied Physics, Vol. 119, Issue 19 https://doi.org/10.1063/1.4949263	journal	May 2016
Kinetic model for thin film stress including the effect of grain growth Chason, Eric; Engwall, A. M.; Rao, Z. Journal of Applied Physics, Vol. 123, Issue 18 https://doi.org/10.1063/1.5030740	journal	May 2018
Stresses and deformation processes in thin films on substrates Doerner, Mary F.; Nix, William D. Critical Reviews in Solid State and Materials Sciences, Vol. 14, Issue 3 https://doi.org/10.1080/10408438808243734	journal	January 1988
The intrinsic stress of polycrystalline and epitaxial thin metal films Koch, R. Journal of Physics: Condensed Matter, Vol. 6, Issue 45 https://doi.org/10.1088/0953-8984/6/45/005	journal	November 1994
Compressive Stress Generation in Sn Thin Films and the Role of Grain Boundary Diffusion Shin, Jae Wook; Chason, Eric Physical Review Letters, Vol. 103, Issue 5 https://doi.org/10.1103/PhysRevLett.103.056102	journal	July 2009
Origin of Compressive Residual Stress in Polycrystalline Thin Films Chason, E.; Sheldon, B. W.; Freund, L. B. Physical Review Letters, Vol. 88, Issue 15, Article No. 156103 https://doi.org/10.1103/PhysRevLett.88.156103	journal	March 2002
Compressive Stress in Polycrystalline Volmer-Weber Films Koch, R.; Hu, Dongzhi; Das, A. K. Physical Review Letters, Vol. 94, Issue 14 https://doi.org/10.1103/PhysRevLett.94.146101	journal	April 2005
Influence of apparatus geometry and deposition conditions on the structure and topography of thick sputtered coatings Thornton, John A. Journal of Vacuum Science and Technology, Vol. 11, Issue 4 https://doi.org/10.1116/1.1312732	journal	July 1974
Grain Growth and Stress Relief in Thin Films Chaudhari, P. Journal of Vacuum Science and Technology, Vol. 9, Issue 1 https://doi.org/10.1116/1.1316674	journal	January 1972
Microstructural evolution during film growth Petrov, I.; Barna, P. B.; Hultman, L. Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films, Vol. 21, Issue 5 https://doi.org/10.1116/1.1601610	journal	September 2003
Boric Acid as a Catalyst in Nickel Plating Solutions Hoare, James P. Journal of The Electrochemical Society, Vol. 134, Issue 12 https://doi.org/10.1149/1.2100348	journal	January 1987
On the Role of Boric Acid in the Watts Bath Hoare, James P. Journal of The Electrochemical Society, Vol. 133, Issue 12 https://doi.org/10.1149/1.2108456	journal	January 1986
Effects of Process Conditions on Properties of Electroplated Ni Thin Films for Microsystem Applications Luo, J. K.; Pritschow, M.; Flewitt, A. J. Journal of The Electrochemical Society, Vol. 153, Issue 10 https://doi.org/10.1149/1.2223302	journal	January 2006
Microstructural Origins of Saccharin-Induced Stress Reduction in Electrodeposited Ni Bhandari, Abhinav; Hearne, Sean J.; Sheldon, Brian W. Journal of The Electrochemical Society, Vol. 156, Issue 8 https://doi.org/10.1149/1.3142363	journal	January 2009
Residual Stress in Electrodeposited Cu Thin Films: Understanding the Combined Effects of Growth Rate and Grain Size Engwall, A. M.; Rao, Z.; Chason, E. Journal of The Electrochemical Society, Vol. 164, Issue 13 https://doi.org/10.1149/2.0921713jes	journal	January 2017

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