The Effects of Plating Current, Grain Size, and Electrolyte on Stress Evolution in Electrodeposited Ni

Rao, Z.; Hearne, S. J.; Chason, E.

doi:10.1149/2.0261901jes

Title: The Effects of Plating Current, Grain Size, and Electrolyte on Stress Evolution in Electrodeposited Ni

Authors:

;

; Chason, E.

Publication Date:: 2018-12-06

Sponsoring Org.:: USDOE National Nuclear Security Administration (NNSA)

OSTI Identifier:: 1484836

Grant/Contract Number:: NA-0003525

Resource Type:: Published Article

Journal Name:: Journal of the Electrochemical Society

Additional Journal Information:: Journal Name: Journal of the Electrochemical Society Journal Volume: 166 Journal Issue: 1; Journal ID: ISSN 0013-4651

Publisher:: The Electrochemical Society

Country of Publication:: United States

Language:: English

Citation Formats


                    Rao, Z., Hearne, S. J., and Chason, E.. The Effects of Plating Current, Grain Size, and Electrolyte on Stress Evolution in Electrodeposited Ni.  United States: N. p., 2018. 
Web.  doi:10.1149/2.0261901jes.

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                    Rao, Z., Hearne, S. J., & Chason, E.. The Effects of Plating Current, Grain Size, and Electrolyte on Stress Evolution in Electrodeposited Ni.  United States.  https://doi.org/10.1149/2.0261901jes

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                    Rao, Z., Hearne, S. J., and Chason, E.. Thu .  
"The Effects of Plating Current, Grain Size, and Electrolyte on Stress Evolution in Electrodeposited Ni".  United States.  https://doi.org/10.1149/2.0261901jes.

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@article{osti_1484836,

  title        = {The Effects of Plating Current, Grain Size, and Electrolyte on Stress Evolution in Electrodeposited Ni},

  author       = {Rao, Z. and Hearne, S. J. and Chason, E.},

  abstractNote = {},

  doi          = {10.1149/2.0261901jes},

  journal      = {Journal of the Electrochemical Society},

  number       = 1,

  volume       = 166,

  place        = {United States},

  year         = {2018},

  month        = {12}

}

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Title: The Effects of Plating Current, Grain Size, and Electrolyte on Stress Evolution in Electrodeposited Ni

Citation Formats

Microstructural evolution during film growth journal, September 2003

Microstructural Origins of Saccharin-Induced Stress Reduction in Electrodeposited Ni journal, January 2009

Mechanics of compressive stress evolution during thin film growth journal, November 2003

On the Role of Boric Acid in the Watts Bath journal, January 1986

Tutorial: Understanding residual stress in polycrystalline thin films through real-time measurements and physical models journal, May 2016

The intrinsic stress of polycrystalline and epitaxial thin metal films journal, November 1994

Origins of saccharin-induced stress reduction based on observed fracture behavior of electrodeposited Ni films journal, October 2013

Compressive Stress Generation in Sn Thin Films and the Role of Grain Boundary Diffusion journal, July 2009

A kinetic analysis of residual stress evolution in polycrystalline thin films journal, December 2012

Measurements of stress during vapor deposition of copper and silver thin films and multilayers journal, December 1996

Mechanisms inducing compressive stress during electrodeposition of Ni journal, January 2005

Compressive Stress in Polycrystalline Volmer-Weber Films journal, April 2005

Microstructural and mechanical properties investigation of electrodeposited and annealed LIGA nickel structures journal, March 2002

Stresses and deformation processes in thin films on substrates journal, January 1988

Origin of Compressive Residual Stress in Polycrystalline Thin Films journal, March 2002

Influence of lower current densities on the residual stress and structure of thick nickel electrodeposits journal, March 2011

Interfaces and stresses in thin films journal, January 2000

Effects of Process Conditions on Properties of Electroplated Ni Thin Films for Microsystem Applications journal, January 2006

Measurements of the intrinsic stress in thin metal films journal, January 1990

Influence of apparatus geometry and deposition conditions on the structure and topography of thick sputtered coatings journal, July 1974

Kinetic model for thin film stress including the effect of grain growth journal, May 2018

Stresses in thin films: The relevance of grain boundaries and impurities journal, May 1976

Grain Growth and Stress Relief in Thin Films journal, January 1972

Origins of residual stress in thin films: Interaction between microstructure and growth kinetics journal, November 2016

Grain growth and complex stress evolution during Volmer–Weber growth of polycrystalline thin films journal, April 2014

Residual Stress in Electrodeposited Cu Thin Films: Understanding the Combined Effects of Growth Rate and Grain Size journal, January 2017

Boric Acid as a Catalyst in Nickel Plating Solutions journal, January 1987

Microstructural evolution during film growth
journal, September 2003

Microstructural Origins of Saccharin-Induced Stress Reduction in Electrodeposited Ni
journal, January 2009

Mechanics of compressive stress evolution during thin film growth
journal, November 2003

On the Role of Boric Acid in the Watts Bath
journal, January 1986

Tutorial: Understanding residual stress in polycrystalline thin films through real-time measurements and physical models
journal, May 2016

The intrinsic stress of polycrystalline and epitaxial thin metal films
journal, November 1994

Origins of saccharin-induced stress reduction based on observed fracture behavior of electrodeposited Ni films
journal, October 2013

Compressive Stress Generation in Sn Thin Films and the Role of Grain Boundary Diffusion
journal, July 2009

A kinetic analysis of residual stress evolution in polycrystalline thin films
journal, December 2012

Measurements of stress during vapor deposition of copper and silver thin films and multilayers
journal, December 1996

Mechanisms inducing compressive stress during electrodeposition of Ni
journal, January 2005

Compressive Stress in Polycrystalline Volmer-Weber Films
journal, April 2005

Microstructural and mechanical properties investigation of electrodeposited and annealed LIGA nickel structures
journal, March 2002

Stresses and deformation processes in thin films on substrates
journal, January 1988

Origin of Compressive Residual Stress in Polycrystalline Thin Films
journal, March 2002

Influence of lower current densities on the residual stress and structure of thick nickel electrodeposits
journal, March 2011

Interfaces and stresses in thin films
journal, January 2000

Effects of Process Conditions on Properties of Electroplated Ni Thin Films for Microsystem Applications
journal, January 2006

Measurements of the intrinsic stress in thin metal films
journal, January 1990

Influence of apparatus geometry and deposition conditions on the structure and topography of thick sputtered coatings
journal, July 1974

Kinetic model for thin film stress including the effect of grain growth
journal, May 2018

Stresses in thin films: The relevance of grain boundaries and impurities
journal, May 1976

Grain Growth and Stress Relief in Thin Films
journal, January 1972

Origins of residual stress in thin films: Interaction between microstructure and growth kinetics
journal, November 2016

Grain growth and complex stress evolution during Volmer–Weber growth of polycrystalline thin films
journal, April 2014

Residual Stress in Electrodeposited Cu Thin Films: Understanding the Combined Effects of Growth Rate and Grain Size
journal, January 2017

Boric Acid as a Catalyst in Nickel Plating Solutions
journal, January 1987