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Title: The Effects of Plating Current, Grain Size, and Electrolyte on Stress Evolution in Electrodeposited Ni

Authors:
ORCiD logo ; ORCiD logo ;
Publication Date:
Grant/Contract Number:
NA-0003525
Type:
Published Article
Journal Name:
Journal of the Electrochemical Society
Additional Journal Information:
Journal Name: Journal of the Electrochemical Society Journal Volume: 166 Journal Issue: 1; Journal ID: ISSN 0013-4651
Publisher:
The Electrochemical Society
Sponsoring Org:
USDOE National Nuclear Security Administration (NNSA)
Country of Publication:
United States
Language:
English
OSTI Identifier:
1484836

Rao, Z., Hearne, S. J., and Chason, E.. The Effects of Plating Current, Grain Size, and Electrolyte on Stress Evolution in Electrodeposited Ni. United States: N. p., Web. doi:10.1149/2.0261901jes.
Rao, Z., Hearne, S. J., & Chason, E.. The Effects of Plating Current, Grain Size, and Electrolyte on Stress Evolution in Electrodeposited Ni. United States. doi:10.1149/2.0261901jes.
Rao, Z., Hearne, S. J., and Chason, E.. 2018. "The Effects of Plating Current, Grain Size, and Electrolyte on Stress Evolution in Electrodeposited Ni". United States. doi:10.1149/2.0261901jes.
@article{osti_1484836,
title = {The Effects of Plating Current, Grain Size, and Electrolyte on Stress Evolution in Electrodeposited Ni},
author = {Rao, Z. and Hearne, S. J. and Chason, E.},
abstractNote = {},
doi = {10.1149/2.0261901jes},
journal = {Journal of the Electrochemical Society},
number = 1,
volume = 166,
place = {United States},
year = {2018},
month = {12}
}

Works referenced in this record:

Origin of Compressive Residual Stress in Polycrystalline Thin Films
journal, March 2002