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Title: Failure stress comparison of different pairings of Ag-plating and reflow-oven-processed pressureless-sintered-Ag interconnects

Abstract

Here, sintered-silver is a candidate material to supplant solders for interconnects in power electronic packaging for many reasons including its desirably high electrical and thermal conductivities and compliance to Restriction of Hazardous Substances (RoHS) guidelines. The shear failure stress of interconnects though is limited by whatever constituent is the weakest, and that includes any employed plating. In the present study, silver-platings were processed electrolytically, electrolessly, and through sputter deposition and their influence on the entire “interconnect system” shear strength was examined. Test sets employing gold plating and no plating were included for comparison and to aid interpretation. Ambient-air, reflow-oven-processed, pressureless-sintered-silver interconnects were identically fabricated with all plating test sets. It was found that all considered silver-plating methods produced consistently strong (characteristic failure stresses > 55 MPa) sintered-silver interconnects. Because failures tended to be adhesive in all six sets, differences in failure stress among the silver-plated sets and the gold-plated or unplated sets were likely due to differences in the adhesive strength of the sintered silver with silver-plating, gold-plating, or direct bonding with copper.

Authors:
ORCiD logo [1];  [2]; ORCiD logo [2];  [1];  [2]
  1. Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States)
  2. Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States); Oak Ridge Associated Univ., Oak Ridge, TN (United States)
Publication Date:
Research Org.:
Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States)
Sponsoring Org.:
USDOE Office of Energy Efficiency and Renewable Energy (EERE)
OSTI Identifier:
1480634
Grant/Contract Number:  
AC05-00OR22725
Resource Type:
Accepted Manuscript
Journal Name:
Journal of Materials Science Materials in Electronics
Additional Journal Information:
Journal Volume: 29; Journal Issue: 23; Journal ID: ISSN 0957-4522
Publisher:
Springer
Country of Publication:
United States
Language:
English
Subject:
36 MATERIALS SCIENCE; Sintered-silver interconnects; pressureless sintering; electrolytic plating; electroless plating; physical vapor deposition

Citation Formats

Wereszczak, Andrew A., Chen, Branndon R., Oistad, Brian A., Waters, Shirley B., and Mayville, Alicia T. Failure stress comparison of different pairings of Ag-plating and reflow-oven-processed pressureless-sintered-Ag interconnects. United States: N. p., 2018. Web. doi:10.1007/s10854-018-0151-5.
Wereszczak, Andrew A., Chen, Branndon R., Oistad, Brian A., Waters, Shirley B., & Mayville, Alicia T. Failure stress comparison of different pairings of Ag-plating and reflow-oven-processed pressureless-sintered-Ag interconnects. United States. doi:10.1007/s10854-018-0151-5.
Wereszczak, Andrew A., Chen, Branndon R., Oistad, Brian A., Waters, Shirley B., and Mayville, Alicia T. Sat . "Failure stress comparison of different pairings of Ag-plating and reflow-oven-processed pressureless-sintered-Ag interconnects". United States. doi:10.1007/s10854-018-0151-5. https://www.osti.gov/servlets/purl/1480634.
@article{osti_1480634,
title = {Failure stress comparison of different pairings of Ag-plating and reflow-oven-processed pressureless-sintered-Ag interconnects},
author = {Wereszczak, Andrew A. and Chen, Branndon R. and Oistad, Brian A. and Waters, Shirley B. and Mayville, Alicia T.},
abstractNote = {Here, sintered-silver is a candidate material to supplant solders for interconnects in power electronic packaging for many reasons including its desirably high electrical and thermal conductivities and compliance to Restriction of Hazardous Substances (RoHS) guidelines. The shear failure stress of interconnects though is limited by whatever constituent is the weakest, and that includes any employed plating. In the present study, silver-platings were processed electrolytically, electrolessly, and through sputter deposition and their influence on the entire “interconnect system” shear strength was examined. Test sets employing gold plating and no plating were included for comparison and to aid interpretation. Ambient-air, reflow-oven-processed, pressureless-sintered-silver interconnects were identically fabricated with all plating test sets. It was found that all considered silver-plating methods produced consistently strong (characteristic failure stresses > 55 MPa) sintered-silver interconnects. Because failures tended to be adhesive in all six sets, differences in failure stress among the silver-plated sets and the gold-plated or unplated sets were likely due to differences in the adhesive strength of the sintered silver with silver-plating, gold-plating, or direct bonding with copper.},
doi = {10.1007/s10854-018-0151-5},
journal = {Journal of Materials Science Materials in Electronics},
number = 23,
volume = 29,
place = {United States},
year = {2018},
month = {10}
}

Journal Article:
Free Publicly Available Full Text
Publisher's Version of Record

Figures / Tables:

Figure 1 Figure 1: Examined platings on direct bonded copper substrates. 1: electrolytic silver finish plating (with electrolytic nickel preplating), 2: sputter-deposited silver finish plating (with sputtered titanium preplating), 3: electroless silver plating, 4: electroless silver plating (copper-contaminated), 5: electroless gold finish plating (with nickel-immersion preplating), and 6: un-plated or bare coppermore » cladding.« less

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