Failure stress comparison of different pairings of Ag-plating and reflow-oven-processed pressureless-sintered-Ag interconnects

Wereszczak, Andrew A.; Chen, Branndon R.; Oistad, Brian A.; Waters, Shirley B.; Mayville, Alicia T.

doi:10.1007/s10854-018-0151-5

Title: Failure stress comparison of different pairings of Ag-plating and reflow-oven-processed pressureless-sintered-Ag interconnects

Journal Article · 05 October 2018 · Journal of Materials Science. Materials in Electronics

DOI: https://doi.org/10.1007/s10854-018-0151-5 · OSTI ID:1480634

^[1]; Chen, Branndon R. ^[2];

^[2]; Waters, Shirley B. ^[1]; Mayville, Alicia T. ^[2]

Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States)
Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States); Oak Ridge Associated Univ., Oak Ridge, TN (United States)

Here, sintered-silver is a candidate material to supplant solders for interconnects in power electronic packaging for many reasons including its desirably high electrical and thermal conductivities and compliance to Restriction of Hazardous Substances (RoHS) guidelines. The shear failure stress of interconnects though is limited by whatever constituent is the weakest, and that includes any employed plating. In the present study, silver-platings were processed electrolytically, electrolessly, and through sputter deposition and their influence on the entire “interconnect system” shear strength was examined. Test sets employing gold plating and no plating were included for comparison and to aid interpretation. Ambient-air, reflow-oven-processed, pressureless-sintered-silver interconnects were identically fabricated with all plating test sets. It was found that all considered silver-plating methods produced consistently strong (characteristic failure stresses > 55 MPa) sintered-silver interconnects. Because failures tended to be adhesive in all six sets, differences in failure stress among the silver-plated sets and the gold-plated or unplated sets were likely due to differences in the adhesive strength of the sintered silver with silver-plating, gold-plating, or direct bonding with copper.

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Research Organization:: Oak Ridge National Laboratory (ORNL), Oak Ridge, TN (United States)

Sponsoring Organization:: USDOE Office of Energy Efficiency and Renewable Energy (EERE)

Grant/Contract Number:: AC05-00OR22725

OSTI ID:: 1480634

Journal Information:: Journal of Materials Science. Materials in Electronics, Journal Name: Journal of Materials Science. Materials in Electronics Journal Issue: 23 Vol. 29; ISSN 0957-4522

Publisher:: SpringerCopyright Statement

Country of Publication:: United States

Language:: English

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Title: Failure stress comparison of different pairings of Ag-plating and reflow-oven-processed pressureless-sintered-Ag interconnects

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