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Title: Transient Liquid Phase Bonding of AlN to AlSiC for Durable Power Electronic Packages

Abstract

Conventional power electronic modules employ a direct bonded copper (DBC) substrate and multiple interface layers to dissipate heat. However, reliability issues arise due to the coefficient of thermal expansion (CTE) mismatch that exists between the metal, ceramic, and semiconductor materials in the conventional module. Significant performance enhancement can be achieved by eliminating the DBC and developing an integrated substrate/cold plate with a low CTE mismatch throughout the package. To address this need, we have demonstrated the ability to directly bond the aluminum nitride (AlN) substrate to an AlSiC heat sink through transient liquid phase bonding using a Cu-Al binary system. Fabricated samples are found to have good interfacial adhesion. The novel bond material exhibits properties analogous to AlSiC and is analyzed for thermal, mechanical, and metallographic properties. The novel structure demonstrated in this work will enable smaller, lighter, and more reliable power modules, when compared to traditional configurations.

Authors:
 [1];  [1];  [1];  [2];  [2];  [3];  [3];  [3];  [3]
  1. Georgia Inst. of Technology, Atlanta, GA (United States)
  2. Army Research Lab., Adelphi, MD (United States)
  3. National Renewable Energy Lab. (NREL), Golden, CO (United States)
Publication Date:
Research Org.:
National Renewable Energy Lab. (NREL), Golden, CO (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
1479868
Report Number(s):
NREL/JA-5400-71786
Journal ID: ISSN 1438-1656
Grant/Contract Number:  
AC36-08GO28308
Resource Type:
Accepted Manuscript
Journal Name:
Advanced Engineering Materials
Additional Journal Information:
Journal Volume: 20; Journal Issue: 10; Journal ID: ISSN 1438-1656
Publisher:
Wiley
Country of Publication:
United States
Language:
English
Subject:
42 ENGINEERING; power electronics; thermal management; transient liquid phase bonding; characterization

Citation Formats

Pahinkar, Darshan G., Puckett, Waylon, Graham, Samuel, Boteler, Lauren, Ibitayo, Dimeji, Narumanchi, Sreekant, Paret, Paul, DeVoto, Douglas, and Major, Joshua. Transient Liquid Phase Bonding of AlN to AlSiC for Durable Power Electronic Packages. United States: N. p., 2018. Web. doi:10.1002/adem.201800039.
Pahinkar, Darshan G., Puckett, Waylon, Graham, Samuel, Boteler, Lauren, Ibitayo, Dimeji, Narumanchi, Sreekant, Paret, Paul, DeVoto, Douglas, & Major, Joshua. Transient Liquid Phase Bonding of AlN to AlSiC for Durable Power Electronic Packages. United States. doi:10.1002/adem.201800039.
Pahinkar, Darshan G., Puckett, Waylon, Graham, Samuel, Boteler, Lauren, Ibitayo, Dimeji, Narumanchi, Sreekant, Paret, Paul, DeVoto, Douglas, and Major, Joshua. Tue . "Transient Liquid Phase Bonding of AlN to AlSiC for Durable Power Electronic Packages". United States. doi:10.1002/adem.201800039. https://www.osti.gov/servlets/purl/1479868.
@article{osti_1479868,
title = {Transient Liquid Phase Bonding of AlN to AlSiC for Durable Power Electronic Packages},
author = {Pahinkar, Darshan G. and Puckett, Waylon and Graham, Samuel and Boteler, Lauren and Ibitayo, Dimeji and Narumanchi, Sreekant and Paret, Paul and DeVoto, Douglas and Major, Joshua},
abstractNote = {Conventional power electronic modules employ a direct bonded copper (DBC) substrate and multiple interface layers to dissipate heat. However, reliability issues arise due to the coefficient of thermal expansion (CTE) mismatch that exists between the metal, ceramic, and semiconductor materials in the conventional module. Significant performance enhancement can be achieved by eliminating the DBC and developing an integrated substrate/cold plate with a low CTE mismatch throughout the package. To address this need, we have demonstrated the ability to directly bond the aluminum nitride (AlN) substrate to an AlSiC heat sink through transient liquid phase bonding using a Cu-Al binary system. Fabricated samples are found to have good interfacial adhesion. The novel bond material exhibits properties analogous to AlSiC and is analyzed for thermal, mechanical, and metallographic properties. The novel structure demonstrated in this work will enable smaller, lighter, and more reliable power modules, when compared to traditional configurations.},
doi = {10.1002/adem.201800039},
journal = {Advanced Engineering Materials},
number = 10,
volume = 20,
place = {United States},
year = {2018},
month = {6}
}

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Works referenced in this record:

Direct bonding of copper to aluminum nitride
journal, July 1996


Understanding AlN sintering through computational thermodynamics combined with experimental investigation
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Surface Preparation of Aluminum Nitride for Metallization: Effect of Temperature on Surface Reactivity
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Pulse Method of Measuring Thermal Diffusivity at High Temperatures
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