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Title: Impact of Heat Dissipation Profiles on Power Electronics Packaging Design

Abstract

This work focuses on understanding the thermal impacts of using discrete power devices and limitations of applying conventional thermal design methods. Empirically, a thermal system is designed based on selecting a heat sink with the required thermal resistance from the manufacturer datasheet. This method, as an approximate estimation, has been proven effective as a rough design of Si-based power module. However, wide bandgap (WBG) bare dies bring additional thermal design concerns that have been overlooked. The benefits of WBG devices, such as smaller chip sizes and higher power ratings, on the other hand, lead to thermal concentration issues. Detailed analyses and impacts of the thermal concentration are presented in this paper. Finally, a more accurate model involving Finite Element Analysis (FEA) and Genetic Algorithm optimization is also proposed for a more accurate thermal design.

Authors:
ORCiD logo [1]; ORCiD logo [2]
  1. Univ. of Tennessee, Knoxville, TN (United States). Bredesen Center
  2. Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States). Power Electronics and Electric Machinery Research Center
Publication Date:
Research Org.:
Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
1474615
Grant/Contract Number:  
AC05-00OR22725
Resource Type:
Accepted Manuscript
Journal Name:
IEEE Transportation Electrification Conference and Expo
Additional Journal Information:
Journal Volume: 29; Journal Issue: 1
Country of Publication:
United States
Language:
English
Subject:
42 ENGINEERING; 36 MATERIALS SCIENCE; Thermal management; Junction temperature; TEC; Modeling; Thermal coupling

Citation Formats

Wu, Tong, and Ozpineci, Burak. Impact of Heat Dissipation Profiles on Power Electronics Packaging Design. United States: N. p., 2018. Web. doi:10.1109/ITEC.2018.8450200.
Wu, Tong, & Ozpineci, Burak. Impact of Heat Dissipation Profiles on Power Electronics Packaging Design. United States. doi:10.1109/ITEC.2018.8450200.
Wu, Tong, and Ozpineci, Burak. Thu . "Impact of Heat Dissipation Profiles on Power Electronics Packaging Design". United States. doi:10.1109/ITEC.2018.8450200. https://www.osti.gov/servlets/purl/1474615.
@article{osti_1474615,
title = {Impact of Heat Dissipation Profiles on Power Electronics Packaging Design},
author = {Wu, Tong and Ozpineci, Burak},
abstractNote = {This work focuses on understanding the thermal impacts of using discrete power devices and limitations of applying conventional thermal design methods. Empirically, a thermal system is designed based on selecting a heat sink with the required thermal resistance from the manufacturer datasheet. This method, as an approximate estimation, has been proven effective as a rough design of Si-based power module. However, wide bandgap (WBG) bare dies bring additional thermal design concerns that have been overlooked. The benefits of WBG devices, such as smaller chip sizes and higher power ratings, on the other hand, lead to thermal concentration issues. Detailed analyses and impacts of the thermal concentration are presented in this paper. Finally, a more accurate model involving Finite Element Analysis (FEA) and Genetic Algorithm optimization is also proposed for a more accurate thermal design.},
doi = {10.1109/ITEC.2018.8450200},
journal = {IEEE Transportation Electrification Conference and Expo},
number = 1,
volume = 29,
place = {United States},
year = {2018},
month = {8}
}

Journal Article:
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