skip to main content
DOE PAGES title logo U.S. Department of Energy
Office of Scientific and Technical Information

Title: Shear-induced softening of nanocrystalline metal interfaces at cryogenic temperatures

Abstract

We demonstrate inverse Hall-Petch behavior (softening) in pure copper sliding contacts at cryogenic temperatures. By kinetically limiting grain growth, it is possible to generate a quasi-stable ultra-nanocrystalline surface layer with reduced strength. In situ electrical contact resistance measurements were used to determine grain size evolution at the interface, in agreement with reports of softening in highly nanotwinned copper. We also show evidence of a direct correlation between surface grain size and friction coefficient, validating a model linking friction in pure metals and the transition from dislocation mediated plasticity to grain boundary sliding.

Authors:
 [1];  [1];  [1];  [1];  [1];  [1];  [1];  [2];  [1]
  1. Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)
  2. Sandia National Lab. (SNL-CA), Livermore, CA (United States)
Publication Date:
Research Org.:
Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)
Sponsoring Org.:
USDOE National Nuclear Security Administration (NNSA)
OSTI Identifier:
1469657
Report Number(s):
[SAND2017-11200J]
[Journal ID: ISSN 1359-6462; PII: S1359646217305183]
Grant/Contract Number:  
[AC04-94AL85000]
Resource Type:
Accepted Manuscript
Journal Name:
Scripta Materialia
Additional Journal Information:
[ Journal Volume: 143; Journal Issue: C]; Journal ID: ISSN 1359-6462
Publisher:
Elsevier
Country of Publication:
United States
Language:
English
Subject:
36 MATERIALS SCIENCE

Citation Formats

Chandross, Michael, Curry, John F., Babuska, Tomas F., Lu, Ping, Furnish, Timothy A., Kustas, Andrew B., Nation, Brendan L., Staats, Wayne L., and Argibay, Nicolas. Shear-induced softening of nanocrystalline metal interfaces at cryogenic temperatures. United States: N. p., 2017. Web. doi:10.1016/j.scriptamat.2017.09.006.
Chandross, Michael, Curry, John F., Babuska, Tomas F., Lu, Ping, Furnish, Timothy A., Kustas, Andrew B., Nation, Brendan L., Staats, Wayne L., & Argibay, Nicolas. Shear-induced softening of nanocrystalline metal interfaces at cryogenic temperatures. United States. doi:10.1016/j.scriptamat.2017.09.006.
Chandross, Michael, Curry, John F., Babuska, Tomas F., Lu, Ping, Furnish, Timothy A., Kustas, Andrew B., Nation, Brendan L., Staats, Wayne L., and Argibay, Nicolas. Mon . "Shear-induced softening of nanocrystalline metal interfaces at cryogenic temperatures". United States. doi:10.1016/j.scriptamat.2017.09.006. https://www.osti.gov/servlets/purl/1469657.
@article{osti_1469657,
title = {Shear-induced softening of nanocrystalline metal interfaces at cryogenic temperatures},
author = {Chandross, Michael and Curry, John F. and Babuska, Tomas F. and Lu, Ping and Furnish, Timothy A. and Kustas, Andrew B. and Nation, Brendan L. and Staats, Wayne L. and Argibay, Nicolas},
abstractNote = {We demonstrate inverse Hall-Petch behavior (softening) in pure copper sliding contacts at cryogenic temperatures. By kinetically limiting grain growth, it is possible to generate a quasi-stable ultra-nanocrystalline surface layer with reduced strength. In situ electrical contact resistance measurements were used to determine grain size evolution at the interface, in agreement with reports of softening in highly nanotwinned copper. We also show evidence of a direct correlation between surface grain size and friction coefficient, validating a model linking friction in pure metals and the transition from dislocation mediated plasticity to grain boundary sliding.},
doi = {10.1016/j.scriptamat.2017.09.006},
journal = {Scripta Materialia},
number = [C],
volume = [143],
place = {United States},
year = {2017},
month = {9}
}

Journal Article:
Free Publicly Available Full Text
Publisher's Version of Record

Citation Metrics:
Cited by: 5 works
Citation information provided by
Web of Science

Save / Share: