Thermal Stability of Hole-Selective Tungsten Oxide: In Situ Transmission Electron Microscopy Study
Abstract
In this study, the thermal stability of a contact structure featuring hole-selective tungsten oxide (WOx) and aluminum deposited onto p-type crystalline silicon (c-Si/WOx/Al) was investigated using a combination of transmission line measurements (TLM) and in situ transmission electron microscopy (TEM) studies. The TEM images provide insight into why the charge carrier transport and recombination characteristics change as a function of temperature, particularly as the samples are annealed at temperatures above 500 °C. In the as-deposited state, a ≈ 2 nm silicon oxide (SiOx) interlayer forms at the c-Si/WOx interface and a ≈ 2–3 nm aluminum oxide (AlOx) interlayer at the WOx/Al interface. When annealing above 500 °C, Al diffusion begins, and above 600 °C complete intermixing of the SiOx, WOx, AlOx and Al layers occurs. This results in a large drop in the contact resistivity, but is the likely reason surface recombination increases at these high temperatures, since a c-Si/Al contact is basically being formed. This work provides some fundamental insight that can help in the development of WOx films as hole-selective rear contacts for p-type solar cells. Furthermore, this study demonstrates that in situ TEM can provide valuable information about thermal stability of transition metal oxides functioning as carrier-selectivemore »
- Authors:
- Publication Date:
- Research Org.:
- Univ. of Central Florida, Orlando, FL (United States); Univ. of California, Oakland, CA (United States); Lawrence Berkeley National Laboratory (LBNL), Berkeley, CA (United States)
- Sponsoring Org.:
- USDOE Office of Science (SC), Basic Energy Sciences (BES). Materials Sciences & Engineering Division; USDOE Office of Energy Efficiency and Renewable Energy (EERE), Renewable Power Office. Solar Energy Technologies Office
- OSTI Identifier:
- 1464976
- Alternate Identifier(s):
- OSTI ID: 1546082; OSTI ID: 1638981
- Grant/Contract Number:
- EE0007533; AC02- 05CH11231; AC02-05CH11231
- Resource Type:
- Published Article
- Journal Name:
- Scientific Reports
- Additional Journal Information:
- Journal Name: Scientific Reports Journal Volume: 8 Journal Issue: 1; Journal ID: ISSN 2045-2322
- Publisher:
- Nature Publishing Group
- Country of Publication:
- United Kingdom
- Language:
- English
- Subject:
- 36 MATERIALS SCIENCE
Citation Formats
Ali, Haider, Koul, Supriya, Gregory, Geoffrey, Bullock, James, Javey, Ali, Kushima, Akihiro, and Davis, Kristopher O. Thermal Stability of Hole-Selective Tungsten Oxide: In Situ Transmission Electron Microscopy Study. United Kingdom: N. p., 2018.
Web. doi:10.1038/s41598-018-31053-w.
Ali, Haider, Koul, Supriya, Gregory, Geoffrey, Bullock, James, Javey, Ali, Kushima, Akihiro, & Davis, Kristopher O. Thermal Stability of Hole-Selective Tungsten Oxide: In Situ Transmission Electron Microscopy Study. United Kingdom. https://doi.org/10.1038/s41598-018-31053-w
Ali, Haider, Koul, Supriya, Gregory, Geoffrey, Bullock, James, Javey, Ali, Kushima, Akihiro, and Davis, Kristopher O. Thu .
"Thermal Stability of Hole-Selective Tungsten Oxide: In Situ Transmission Electron Microscopy Study". United Kingdom. https://doi.org/10.1038/s41598-018-31053-w.
@article{osti_1464976,
title = {Thermal Stability of Hole-Selective Tungsten Oxide: In Situ Transmission Electron Microscopy Study},
author = {Ali, Haider and Koul, Supriya and Gregory, Geoffrey and Bullock, James and Javey, Ali and Kushima, Akihiro and Davis, Kristopher O.},
abstractNote = {In this study, the thermal stability of a contact structure featuring hole-selective tungsten oxide (WOx) and aluminum deposited onto p-type crystalline silicon (c-Si/WOx/Al) was investigated using a combination of transmission line measurements (TLM) and in situ transmission electron microscopy (TEM) studies. The TEM images provide insight into why the charge carrier transport and recombination characteristics change as a function of temperature, particularly as the samples are annealed at temperatures above 500 °C. In the as-deposited state, a ≈ 2 nm silicon oxide (SiOx) interlayer forms at the c-Si/WOx interface and a ≈ 2–3 nm aluminum oxide (AlOx) interlayer at the WOx/Al interface. When annealing above 500 °C, Al diffusion begins, and above 600 °C complete intermixing of the SiOx, WOx, AlOx and Al layers occurs. This results in a large drop in the contact resistivity, but is the likely reason surface recombination increases at these high temperatures, since a c-Si/Al contact is basically being formed. This work provides some fundamental insight that can help in the development of WOx films as hole-selective rear contacts for p-type solar cells. Furthermore, this study demonstrates that in situ TEM can provide valuable information about thermal stability of transition metal oxides functioning as carrier-selective contacts in silicon solar cells.},
doi = {10.1038/s41598-018-31053-w},
journal = {Scientific Reports},
number = 1,
volume = 8,
place = {United Kingdom},
year = {Thu Aug 23 00:00:00 EDT 2018},
month = {Thu Aug 23 00:00:00 EDT 2018}
}
https://doi.org/10.1038/s41598-018-31053-w
Web of Science
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