Assessing failure in epitaxially encapsulated micro-scale sensors using micro and nano x-ray computed tomography

Comenencia Ortiz, Lizmarie; Heinz, David B.; Flader, Ian B.; Alter, Anne L.; Shin, Dongsuk D.; Chen, Yunhan; Kenny, Thomas W.

doi:10.1557/mrc.2018.70

Title: Assessing failure in epitaxially encapsulated micro-scale sensors using micro and nano x-ray computed tomography

Journal Article · 12 April 2018 · MRS Communications

DOI: https://doi.org/10.1557/mrc.2018.70 · OSTI ID:1461954

^[1]; Heinz, David B. ^[1]; Flader, Ian B. ^[1]; Alter, Anne L. ^[1]; Shin, Dongsuk D. ^[1]; Chen, Yunhan ^[1]; Kenny, Thomas W. ^[1]

Stanford Univ., CA (United States). Dept. of Mechanical Engineering

Millions of micro electro mechanical system sensors are fabricated each year using an ultra-clean process that allows for a vacuum-encapsulated cavity. These devices have a multi-layer structure that contains hidden layers with highly doped silicon, which makes common imaging techniques ineffective. Thus, examining device features post-fabrication, and testing, is a significant challenge. Here in this paper, we use a combination of micro- and nano-scale x-ray computed tomography to study device features and assess failure mechanisms in such devices without destroying the ultra-clean cavity. This provides a unique opportunity to examine surfaces and trace failure mechanisms to specific steps in the fabrication process.

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Research Organization:: SLAC National Accelerator Laboratory (SLAC), Menlo Park, CA (United States)

Sponsoring Organization:: USDOE Office of Science (SC), Basic Energy Sciences (BES) (SC-22); Defense Advanced Research Projects Agency (DARPA)

Grant/Contract Number:: AC02-76SF00515

OSTI ID:: 1461954

Journal Information:: MRS Communications, Journal Name: MRS Communications Journal Issue: 02 Vol. 8; ISSN 2159-6859; ISSN applab

Publisher:: Materials Research Society - Cambridge University PressCopyright Statement

Country of Publication:: United States

Language:: English

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