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This content will become publicly available on April 12, 2019

Title: Assessing failure in epitaxially encapsulated micro-scale sensors using micro and nano x-ray computed tomography

Millions of micro electro mechanical system sensors are fabricated each year using an ultra-clean process that allows for a vacuum-encapsulated cavity. These devices have a multi-layer structure that contains hidden layers with highly doped silicon, which makes common imaging techniques ineffective. Thus, examining device features post-fabrication, and testing, is a significant challenge. Here in this paper, we use a combination of micro- and nano-scale x-ray computed tomography to study device features and assess failure mechanisms in such devices without destroying the ultra-clean cavity. This provides a unique opportunity to examine surfaces and trace failure mechanisms to specific steps in the fabrication process.
Authors:
ORCiD logo [1] ;  [1] ;  [1] ;  [1] ;  [1] ;  [1] ;  [1]
  1. Stanford Univ., CA (United States). Dept. of Mechanical Engineering
Publication Date:
Grant/Contract Number:
AC02-76SF00515; N66001-12-1-4260; ECS-9731293
Type:
Accepted Manuscript
Journal Name:
MRS Communications
Additional Journal Information:
Journal Volume: 8; Journal Issue: 02; Journal ID: ISSN 2159-6859
Publisher:
Materials Research Society - Cambridge University Press
Research Org:
SLAC National Accelerator Lab., Menlo Park, CA (United States)
Sponsoring Org:
USDOE Office of Science (SC), Basic Energy Sciences (BES) (SC-22); Defense Advanced Research Projects Agency (DARPA)
Country of Publication:
United States
Language:
English
Subject:
42 ENGINEERING
OSTI Identifier:
1461954