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Title: Special Section on InterPACK 2017—Part 2

InterPACK is a premier international forum for exchange of state-of-the-art knowledge in research, development, manufacturing, and applications of micro-electronics packaging. It is the flagship conference of the ASME Electronic and Photonic Packaging Division (EPPD) founded in 1992 as an ASME-JSME joint biannual conference. Here, rapid changes in the semiconductor landscape together with findings from InterPACK Pathfinding workshop (IPW) in 2016 led to a significant reset of InterPACK conference priorities and focus to comprehensively address needs of the InterPACK community. As a result, starting in 2017, InterPACK has become an annual conference and the scope of the conference has increased significantly together with a systems-focus to include some of the most cutting-edge topics in electronics packaging, device integration, and reliability.
Authors:
; ; ;
Publication Date:
Report Number(s):
NREL/JA-5400-70997
Journal ID: ISSN 1043-7398
Grant/Contract Number:
AC36-08GO28308
Type:
Accepted Manuscript
Journal Name:
Journal of Electronic Packaging
Additional Journal Information:
Journal Volume: 140; Journal Issue: 2; Journal ID: ISSN 1043-7398
Publisher:
ASME
Research Org:
National Renewable Energy Lab. (NREL), Golden, CO (United States)
Sponsoring Org:
USDOE Office of Energy Efficiency and Renewable Energy (EERE), Vehicle Technologies Office (EE-3V)
Country of Publication:
United States
Language:
English
Subject:
71 CLASSICAL AND QUANTUM MECHANICS, GENERAL PHYSICS; reliability; electronic packaging
OSTI Identifier:
1438383

Mysore, Kaushik, Narumanchi, Sreekant, Khiabani, Reza, and Dede, Ercan. Special Section on InterPACK 2017—Part 2. United States: N. p., Web. doi:10.1115/1.4039963.
Mysore, Kaushik, Narumanchi, Sreekant, Khiabani, Reza, & Dede, Ercan. Special Section on InterPACK 2017—Part 2. United States. doi:10.1115/1.4039963.
Mysore, Kaushik, Narumanchi, Sreekant, Khiabani, Reza, and Dede, Ercan. 2018. "Special Section on InterPACK 2017—Part 2". United States. doi:10.1115/1.4039963.
@article{osti_1438383,
title = {Special Section on InterPACK 2017—Part 2},
author = {Mysore, Kaushik and Narumanchi, Sreekant and Khiabani, Reza and Dede, Ercan},
abstractNote = {InterPACK is a premier international forum for exchange of state-of-the-art knowledge in research, development, manufacturing, and applications of micro-electronics packaging. It is the flagship conference of the ASME Electronic and Photonic Packaging Division (EPPD) founded in 1992 as an ASME-JSME joint biannual conference. Here, rapid changes in the semiconductor landscape together with findings from InterPACK Pathfinding workshop (IPW) in 2016 led to a significant reset of InterPACK conference priorities and focus to comprehensively address needs of the InterPACK community. As a result, starting in 2017, InterPACK has become an annual conference and the scope of the conference has increased significantly together with a systems-focus to include some of the most cutting-edge topics in electronics packaging, device integration, and reliability.},
doi = {10.1115/1.4039963},
journal = {Journal of Electronic Packaging},
number = 2,
volume = 140,
place = {United States},
year = {2018},
month = {5}
}