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This content will become publicly available on May 21, 2019

Title: Micro-architecture embedding ultra-thin interlayer to bond diamond and silicon via direct fusion

Authors:
 [1] ;  [2] ;  [3] ;  [4] ;  [5] ;  [6] ;  [7] ;  [7] ;  [5]
  1. Department of Materials Science and Engineering, Korea University, 145 Anam-dong Seongbuk-gu, Seoul 02841, South Korea, Department of Materials Science and Engineering, University of Florida, Gainesville, Florida 32611, USA
  2. Korea Institute of Science and Technology, 5, Hwarang-ro 14-gil, Seongbuk-gu, Seoul 02792, South Korea
  3. National High Magnetic Field Laboratory, Florida State University, Tallahassee, Florida 32310, USA
  4. SK Hynix, 2091, Gyeongchung-daero, Budal-eup, Icheon-si, Gyeonggi-do 17336, South Korea
  5. Department of Materials Science and Engineering, Korea University, 145 Anam-dong Seongbuk-gu, Seoul 02841, South Korea
  6. Department of Mechanical and Aerospace Engineering, University of Florida, Gainesville, Florida 32611, USA
  7. Department of Materials Science and Engineering, University of Florida, Gainesville, Florida 32611, USA
Publication Date:
Grant/Contract Number:
SC000-6438; SC000-7740
Type:
Publisher's Accepted Manuscript
Journal Name:
Applied Physics Letters
Additional Journal Information:
Journal Volume: 112; Journal Issue: 21; Related Information: CHORUS Timestamp: 2018-05-21 11:42:41; Journal ID: ISSN 0003-6951
Publisher:
American Institute of Physics
Sponsoring Org:
USDOE
Country of Publication:
United States
Language:
English
OSTI Identifier:
1438071