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This content will become publicly available on May 10, 2019

Title: Kinetic model for thin film stress including the effect of grain growth

Authors:
ORCiD logo [1] ;  [1] ;  [1] ;  [1]
  1. School of Engineering, Brown University, Providence, Rhode Island 02912, USA
Publication Date:
Grant/Contract Number:
SC0008799
Type:
Publisher's Accepted Manuscript
Journal Name:
Journal of Applied Physics
Additional Journal Information:
Journal Volume: 123; Journal Issue: 18; Related Information: CHORUS Timestamp: 2018-05-10 13:35:33; Journal ID: ISSN 0021-8979
Publisher:
American Institute of Physics
Sponsoring Org:
USDOE
Country of Publication:
United States
Language:
English
OSTI Identifier:
1436833