skip to main content
DOE PAGES title logo U.S. Department of Energy
Office of Scientific and Technical Information

Title: Kinetic model for thin film stress including the effect of grain growth

Authors:
ORCiD logo [1];  [1];  [1];  [1]
  1. School of Engineering, Brown University, Providence, Rhode Island 02912, USA
Publication Date:
Sponsoring Org.:
USDOE
OSTI Identifier:
1436833
Grant/Contract Number:  
SC0008799
Resource Type:
Publisher's Accepted Manuscript
Journal Name:
Journal of Applied Physics
Additional Journal Information:
Journal Name: Journal of Applied Physics Journal Volume: 123 Journal Issue: 18; Journal ID: ISSN 0021-8979
Publisher:
American Institute of Physics
Country of Publication:
United States
Language:
English

Citation Formats

Chason, Eric, Engwall, A. M., Rao, Z., and Nishimura, T. Kinetic model for thin film stress including the effect of grain growth. United States: N. p., 2018. Web. doi:10.1063/1.5030740.
Chason, Eric, Engwall, A. M., Rao, Z., & Nishimura, T. Kinetic model for thin film stress including the effect of grain growth. United States. doi:10.1063/1.5030740.
Chason, Eric, Engwall, A. M., Rao, Z., and Nishimura, T. Mon . "Kinetic model for thin film stress including the effect of grain growth". United States. doi:10.1063/1.5030740.
@article{osti_1436833,
title = {Kinetic model for thin film stress including the effect of grain growth},
author = {Chason, Eric and Engwall, A. M. and Rao, Z. and Nishimura, T.},
abstractNote = {},
doi = {10.1063/1.5030740},
journal = {Journal of Applied Physics},
number = 18,
volume = 123,
place = {United States},
year = {2018},
month = {5}
}

Journal Article:
Free Publicly Available Full Text
Publisher's Version of Record
DOI: 10.1063/1.5030740

Citation Metrics:
Cited by: 4 works
Citation information provided by
Web of Science

Save / Share:

Works referenced in this record:

Microstructural evolution during film growth
journal, September 2003

  • Petrov, I.; Barna, P. B.; Hultman, L.
  • Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films, Vol. 21, Issue 5
  • DOI: 10.1116/1.1601610

Crystallite coalescence: A mechanism for intrinsic tensile stresses in thin films
journal, August 1999


Fast and slow stress evolution mechanisms during interruptions of Volmer-Weber growth
journal, January 2014

  • Yu, Hang Z.; Leib, Jeffrey S.; Boles, Steven T.
  • Journal of Applied Physics, Vol. 115, Issue 4
  • DOI: 10.1063/1.4863600

Mechanics of compressive stress evolution during thin film growth
journal, November 2003

  • Guduru, P. R.; Chason, E.; Freund, L. B.
  • Journal of the Mechanics and Physics of Solids, Vol. 51, Issue 11-12
  • DOI: 10.1016/j.jmps.2003.09.013

Understanding the relation between stress and surface morphology in sputtered films: Atomistic simulations and experiments
journal, October 2009

  • Zepeda-Ruiz, Luis A.; Chason, Eric; Gilmer, George H.
  • Applied Physics Letters, Vol. 95, Issue 15
  • DOI: 10.1063/1.3246791

Kinetic model for dependence of thin film stress on growth rate, temperature, and microstructure
journal, April 2012

  • Chason, E.; Shin, J. W.; Hearne, S. J.
  • Journal of Applied Physics, Vol. 111, Issue 8
  • DOI: 10.1063/1.4704683

Tutorial: Understanding residual stress in polycrystalline thin films through real-time measurements and physical models
journal, May 2016

  • Chason, Eric; Guduru, Pradeep R.
  • Journal of Applied Physics, Vol. 119, Issue 19
  • DOI: 10.1063/1.4949263

The intrinsic stress of polycrystalline and epitaxial thin metal films
journal, November 1994


Compressive Stress Generation in Sn Thin Films and the Role of Grain Boundary Diffusion
journal, July 2009


A kinetic analysis of residual stress evolution in polycrystalline thin films
journal, December 2012


Thermodynamics of deposition flux-dependent intrinsic film stress
journal, February 2016

  • Saedi, Amirmehdi; Rost, Marcel J.
  • Nature Communications, Vol. 7, Issue 1
  • DOI: 10.1038/ncomms10733

Mechanisms inducing compressive stress during electrodeposition of Ni
journal, January 2005

  • Hearne, Sean J.; Floro, Jerry A.
  • Journal of Applied Physics, Vol. 97, Issue 1
  • DOI: 10.1063/1.1819972

Grain boundary width, energy and self-diffusion in nickel: Effect of material purity
journal, August 2013


Compressive Stress in Polycrystalline Volmer-Weber Films
journal, April 2005


Effect of adatom surface diffusivity on microstructure and intrinsic stress evolutions during Ag film growth
journal, August 2012

  • Flötotto, D.; Wang, Z. M.; Jeurgens, L. P. H.
  • Journal of Applied Physics, Vol. 112, Issue 4
  • DOI: 10.1063/1.4746739

Stress and grain growth in thin films
journal, May 1996


Stress and microstructure evolution in thick sputtered films
journal, April 2009


Stresses and deformation processes in thin films on substrates
journal, January 1988

  • Doerner, Mary F.; Nix, William D.
  • Critical Reviews in Solid State and Materials Sciences, Vol. 14, Issue 3
  • DOI: 10.1080/10408438808243734

Origin of Compressive Residual Stress in Polycrystalline Thin Films
journal, March 2002


Atomistic and continuum studies of crack-like diffusion wedges and associated dislocation mechanisms in thin films on substrates
journal, November 2003

  • Buehler, Markus J.; Hartmaier, Alexander; Gao, Huajian
  • Journal of the Mechanics and Physics of Solids, Vol. 51, Issue 11-12
  • DOI: 10.1016/j.jmps.2003.09.024

Direct Evidence for Effects of Grain Structure on Reversible Compressive Deposition Stresses in Polycrystalline Gold Films
journal, June 2009


A theory of growing crystalline nanorods – Mode I
journal, August 2018


Measurements of the intrinsic stress in thin metal films
journal, January 1990


Influence of apparatus geometry and deposition conditions on the structure and topography of thick sputtered coatings
journal, July 1974

  • Thornton, John A.
  • Journal of Vacuum Science and Technology, Vol. 11, Issue 4
  • DOI: 10.1116/1.1312732

Stresses in thin films: The relevance of grain boundaries and impurities
journal, May 1976


Kinetics and magnitude of the reversible stress evolution during polycrystalline film growth interruptions
journal, August 2015

  • Flötotto, D.; Wang, Z. M.; Jeurgens, L. P. H.
  • Journal of Applied Physics, Vol. 118, Issue 5
  • DOI: 10.1063/1.4928162

Correlation of shape changes of grain surfaces and reversible stress evolution during interruptions of polycrystalline film growth
journal, April 2014

  • Yu, Hang Z.; Thompson, Carl V.
  • Applied Physics Letters, Vol. 104, Issue 14
  • DOI: 10.1063/1.4871214

Grain Growth and Stress Relief in Thin Films
journal, January 1972

  • Chaudhari, P.
  • Journal of Vacuum Science and Technology, Vol. 9, Issue 1
  • DOI: 10.1116/1.1316674

Model for stress generated upon contact of neighboring islands on the surface of a substrate
journal, May 2001

  • Freund, L. B.; Chason, Eric
  • Journal of Applied Physics, Vol. 89, Issue 9
  • DOI: 10.1063/1.1359437

Thin Film Compressive Stresses due to Adatom Insertion into Grain Boundaries
journal, July 2007


Origins of residual stress in thin films: Interaction between microstructure and growth kinetics
journal, November 2016


The dynamic competition between stress generation and relaxation mechanisms during coalescence of Volmer–Weber thin films
journal, May 2001

  • Floro, J. A.; Hearne, S. J.; Hunter, J. A.
  • Journal of Applied Physics, Vol. 89, Issue 9
  • DOI: 10.1063/1.1352563

Residual Stress in Electrodeposited Cu Thin Films: Understanding the Combined Effects of Growth Rate and Grain Size
journal, January 2017

  • Engwall, A. M.; Rao, Z.; Chason, E.
  • Journal of The Electrochemical Society, Vol. 164, Issue 13
  • DOI: 10.1149/2.0921713jes

Intrinsic Compressive Stress in Polycrystalline Films is Localized at Edges of the Grain Boundaries
journal, December 2017