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This content will become publicly available on May 10, 2019

Title: Kinetic model for thin film stress including the effect of grain growth

Authors:
ORCiD logo [1] ;  [1] ;  [1] ;  [1]
  1. School of Engineering, Brown University, Providence, Rhode Island 02912, USA
Publication Date:
Grant/Contract Number:
SC0008799
Type:
Publisher's Accepted Manuscript
Journal Name:
Journal of Applied Physics
Additional Journal Information:
Journal Name: Journal of Applied Physics Journal Volume: 123 Journal Issue: 18; Journal ID: ISSN 0021-8979
Publisher:
American Institute of Physics
Sponsoring Org:
USDOE
Country of Publication:
United States
Language:
English
OSTI Identifier:
1436833

Chason, Eric, Engwall, A. M., Rao, Z., and Nishimura, T.. Kinetic model for thin film stress including the effect of grain growth. United States: N. p., Web. doi:10.1063/1.5030740.
Chason, Eric, Engwall, A. M., Rao, Z., & Nishimura, T.. Kinetic model for thin film stress including the effect of grain growth. United States. doi:10.1063/1.5030740.
Chason, Eric, Engwall, A. M., Rao, Z., and Nishimura, T.. 2018. "Kinetic model for thin film stress including the effect of grain growth". United States. doi:10.1063/1.5030740.
@article{osti_1436833,
title = {Kinetic model for thin film stress including the effect of grain growth},
author = {Chason, Eric and Engwall, A. M. and Rao, Z. and Nishimura, T.},
abstractNote = {},
doi = {10.1063/1.5030740},
journal = {Journal of Applied Physics},
number = 18,
volume = 123,
place = {United States},
year = {2018},
month = {5}
}

Works referenced in this record:

Origin of Compressive Residual Stress in Polycrystalline Thin Films
journal, March 2002