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This content will become publicly available on April 30, 2019

Title: Control of thermal expansion in a low-density framework modification of silicon

Authors:
 [1] ; ORCiD logo [2] ;  [3] ;  [1] ;  [1] ;  [4]
  1. Department of Physics, California Polytechnic State University, San Luis Obispo, California 93407, USA
  2. Department of Chemistry, Illinois Institute of Technology, Chicago, Illinois 60616, USA, Department of Physics, North Central College, Naperville, Illinois 60540, USA
  3. Materials Measurement Science Division, National Institute of Standards and Technology (NIST), Gaithersburg, Maryland 20899, USA
  4. Department of Physics, University of South Florida, Tampa, Florida 33620, USA
Publication Date:
Grant/Contract Number:
AC02-06CH11357
Type:
Publisher's Accepted Manuscript
Journal Name:
Applied Physics Letters
Additional Journal Information:
Journal Name: Applied Physics Letters Journal Volume: 112 Journal Issue: 18; Journal ID: ISSN 0003-6951
Publisher:
American Institute of Physics
Sponsoring Org:
USDOE
Country of Publication:
United States
Language:
English
OSTI Identifier:
1435392