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Title: Grain-Boundary Resistance in Copper Interconnects: From an Atomistic Model to a Neural Network

Authors:
; ; ; ; ; ;
Publication Date:
Sponsoring Org.:
USDOE National Nuclear Security Administration (NNSA)
OSTI Identifier:
1431399
Grant/Contract Number:  
FC52-08NA28617
Resource Type:
Publisher's Accepted Manuscript
Journal Name:
Physical Review Applied
Additional Journal Information:
Journal Name: Physical Review Applied Journal Volume: 9 Journal Issue: 4; Journal ID: ISSN 2331-7019
Publisher:
American Physical Society
Country of Publication:
United States
Language:
English

Citation Formats

Valencia, Daniel, Wilson, Evan, Jiang, Zhengping, Valencia-Zapata, Gustavo A., Wang, Kuang-Chung, Klimeck, Gerhard, and Povolotskyi, Michael. Grain-Boundary Resistance in Copper Interconnects: From an Atomistic Model to a Neural Network. United States: N. p., 2018. Web. doi:10.1103/PhysRevApplied.9.044005.
Valencia, Daniel, Wilson, Evan, Jiang, Zhengping, Valencia-Zapata, Gustavo A., Wang, Kuang-Chung, Klimeck, Gerhard, & Povolotskyi, Michael. Grain-Boundary Resistance in Copper Interconnects: From an Atomistic Model to a Neural Network. United States. doi:10.1103/PhysRevApplied.9.044005.
Valencia, Daniel, Wilson, Evan, Jiang, Zhengping, Valencia-Zapata, Gustavo A., Wang, Kuang-Chung, Klimeck, Gerhard, and Povolotskyi, Michael. Wed . "Grain-Boundary Resistance in Copper Interconnects: From an Atomistic Model to a Neural Network". United States. doi:10.1103/PhysRevApplied.9.044005.
@article{osti_1431399,
title = {Grain-Boundary Resistance in Copper Interconnects: From an Atomistic Model to a Neural Network},
author = {Valencia, Daniel and Wilson, Evan and Jiang, Zhengping and Valencia-Zapata, Gustavo A. and Wang, Kuang-Chung and Klimeck, Gerhard and Povolotskyi, Michael},
abstractNote = {},
doi = {10.1103/PhysRevApplied.9.044005},
journal = {Physical Review Applied},
number = 4,
volume = 9,
place = {United States},
year = {2018},
month = {4}
}

Journal Article:
Free Publicly Available Full Text
Publisher's Version of Record
DOI: 10.1103/PhysRevApplied.9.044005

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Cited by: 1 work
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Works referenced in this record:

Lattice parameters, densities, expansion coefficients and perfection of structure of Cu and of Cu–In α phase
journal, November 1969


A paradigm for interconnect geometry to reduce grain boundary resistance
journal, December 2006


Analysis of granular flow in a pebble-bed nuclear reactor
journal, August 2006


Choosing ℓp norms in high-dimensional spaces based on hub analysis
journal, December 2015


Electrical Resistivity Model for Polycrystalline Films: the case of Specular Reflection at External Surfaces
journal, June 1969

  • Mayadas, A. F.; Shatzkes, M.; Janak, J. F.
  • Applied Physics Letters, Vol. 14, Issue 11
  • DOI: 10.1063/1.1652680

Accurate and transferable extended Hückel-type tight-binding parameters
journal, March 2000


Efficiency of ab-initio total energy calculations for metals and semiconductors using a plane-wave basis set
journal, July 1996


Ultrahigh Strength and High Electrical Conductivity in Copper
journal, April 2004


The conductivity of thin metallic films according to the electron theory of metals
journal, January 1938


Neural-network-assisted genetic algorithm applied to silicon clusters
journal, March 2003


Large Discrete Resistance Jump at Grain Boundary in Copper Nanowire
journal, August 2010

  • Kim, Tae-Hwan; Zhang, X. -G.; Nicholson, Don M.
  • Nano Letters, Vol. 10, Issue 8
  • DOI: 10.1021/nl101734h

Fast Parallel Algorithms for Short-Range Molecular Dynamics
journal, March 1995


Electrical-Resistivity Model for Polycrystalline Films: the Case of Arbitrary Reflection at External Surfaces
journal, February 1970


Resistivity dominated by surface scattering in sub-50 nm Cu wires
journal, January 2010

  • Graham, R. L.; Alers, G. B.; Mountsier, T.
  • Applied Physics Letters, Vol. 96, Issue 4
  • DOI: 10.1063/1.3292022

Calculated Resistances of Single Grain Boundaries in Copper
journal, October 2014


Influence of phonon, geometry, impurity, and grain size on Copper line resistivity
journal, September 2006

  • Plombon, J. J.; Andideh, Ebrahim; Dubin, Valery M.
  • Applied Physics Letters, Vol. 89, Issue 11
  • DOI: 10.1063/1.2355435

A chemical and theoretical way to look at bonding on surfaces
journal, July 1988


A new approach to potential fitting using neural networks
journal, February 2007

  • Bholoa, A.; Kenny, S. D.; Smith, R.
  • Nuclear Instruments and Methods in Physics Research Section B: Beam Interactions with Materials and Atoms, Vol. 255, Issue 1
  • DOI: 10.1016/j.nimb.2006.11.040

Structural stability and lattice defects in copper: Ab initio , tight-binding, and embedded-atom calculations
journal, May 2001


NEMO5: A Parallel Multiscale Nanoelectronics Modeling Tool
journal, November 2011

  • Steiger, Sebastian; Povolotskyi, Michael; Park, Hong-Hyun
  • IEEE Transactions on Nanotechnology, Vol. 10, Issue 6
  • DOI: 10.1109/TNANO.2011.2166164

Simulation of grain boundary effects on electronic transport in metals, and detailed causes of scattering
journal, June 2010

  • Feldman, Baruch; Park, Seongjun; Haverty, Michael
  • physica status solidi (b), Vol. 247, Issue 7
  • DOI: 10.1002/pssb.201046133

Generalized Bloch theorem for complex periodic potentials: A powerful application to quantum transport calculations
journal, July 2007


Density-functional method for nonequilibrium electron transport
journal, March 2002

  • Brandbyge, Mads; Mozos, José-Luis; Ordejón, Pablo
  • Physical Review B, Vol. 65, Issue 16, Article No. 165401
  • DOI: 10.1103/PhysRevB.65.165401

Small sample size effects in statistical pattern recognition: recommendations for practitioners
journal, March 1991

  • Raudys, S. J.; Jain, A. K.
  • IEEE Transactions on Pattern Analysis and Machine Intelligence, Vol. 13, Issue 3
  • DOI: 10.1109/34.75512

An ab initio investigation on boundary resistance for metallic grains
journal, August 2010


The structure of high-angle (001) CSL twist boundaries in f.c.c. metals
journal, November 1978


Single and multiband modeling of quantum electron transport through layered semiconductor devices
journal, June 1997

  • Lake, Roger; Klimeck, Gerhard; Bowen, R. Chris
  • Journal of Applied Physics, Vol. 81, Issue 12
  • DOI: 10.1063/1.365394