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This content will become publicly available on April 4, 2019

Title: Grain-Boundary Resistance in Copper Interconnects: From an Atomistic Model to a Neural Network

Authors:
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Publication Date:
Grant/Contract Number:
FC52-08NA28617
Type:
Publisher's Accepted Manuscript
Journal Name:
Physical Review Applied
Additional Journal Information:
Journal Volume: 9; Journal Issue: 4; Related Information: CHORUS Timestamp: 2018-04-05 18:41:41; Journal ID: ISSN 2331-7019
Publisher:
American Physical Society
Sponsoring Org:
USDOE National Nuclear Security Administration (NNSA)
Country of Publication:
United States
Language:
English
OSTI Identifier:
1431399