Special Section on InterPACK 2017—Part 1

Mysore, Kaushik; Narumanchi, Sreekant; Dede, Ercan; Khiabani, Reza

doi:10.1115/1.4039090

Title: Special Section on InterPACK 2017—Part 1

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Abstract

InterPACK is a premier international forum for exchange of state-of-the-art knowledge in research, development, manufacturing, and applications of micro-electronics packaging. It is the flagship conference of the ASME Electronic and Photonic Packaging Division (EPPD) founded in 1992 as an ASME-JSME joint biannual conference. Rapid changes in the semiconductor landscape together with findings from InterPACK Pathfinding workshop (IPW) in 2016 led to a significant reset of InterPACK conference priorities and focus to comprehensively address needs of the InterPACK community. As a result, starting in 2017, InterPACK has become an annual conference and the scope of the conference has increased significantly together with a systems-focus to include some of the most cutting-edge topics in electronics packaging, device integration, and reliability. These topics are organized across five different tracks: (1) heterogeneous integration: microsystems with diverse functionality, (2) servers of the future, (3) structural and physical health monitoring, (4) energy conversion and storage, and (5) transportation: autonomous and electric vehicles.

Authors:

Mysore, Kaushik ^[1]; Narumanchi, Sreekant ^[2]; Dede, Ercan ^[3]; Khiabani, Reza ^[4]

Advanced Micro Devices, Inc., Austin, TX (United States)
National Renewable Energy Lab. (NREL), Golden, CO (United States)
Toyota Research Inst. of North America, Ann Arbor, MI (United States)
Google, Mountain View, CA (United States)

Publication Date:: 2018-03-02

Research Org.:: National Renewable Energy Lab. (NREL), Golden, CO (United States)

Sponsoring Org.:: USDOE Office of Energy Efficiency and Renewable Energy (EERE), Vehicle Technologies Office (EE-3V)

OSTI Identifier:: 1427971

Report Number(s):: NREL/JA-5400-70930
Journal ID: ISSN 1043-7398

Grant/Contract Number:: AC36-08GO28308

Resource Type:: Accepted Manuscript

Journal Name:: Journal of Electronic Packaging

Additional Journal Information:: Journal Volume: 140; Journal Issue: 1; Journal ID: ISSN 1043-7398

Publisher:: ASME

Country of Publication:: United States

Language:: English

Subject:: 71 CLASSICAL AND QUANTUM MECHANICS, GENERAL PHYSICS; advanced interconnect technologies; 3D-printing; microscale heat transfer; data center cooling technologies; automotive electronics reliability sensors

Citation Formats


                    Mysore, Kaushik, Narumanchi, Sreekant, Dede, Ercan, and Khiabani, Reza. Special Section on InterPACK 2017—Part 1.  United States: N. p., 2018. 
Web.  doi:10.1115/1.4039090.

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                    Mysore, Kaushik, Narumanchi, Sreekant, Dede, Ercan, & Khiabani, Reza. Special Section on InterPACK 2017—Part 1.  United States.  https://doi.org/10.1115/1.4039090

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                    Mysore, Kaushik, Narumanchi, Sreekant, Dede, Ercan, and Khiabani, Reza. Fri .  
"Special Section on InterPACK 2017—Part 1".  United States.  https://doi.org/10.1115/1.4039090.  https://www.osti.gov/servlets/purl/1427971.

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@article{osti_1427971,

  title        = {Special Section on InterPACK 2017—Part 1},

  author       = {Mysore, Kaushik and Narumanchi, Sreekant and Dede, Ercan and Khiabani, Reza},

  abstractNote = {InterPACK is a premier international forum for exchange of state-of-the-art knowledge in research, development, manufacturing, and applications of micro-electronics packaging. It is the flagship conference of the ASME Electronic and Photonic Packaging Division (EPPD) founded in 1992 as an ASME-JSME joint biannual conference. Rapid changes in the semiconductor landscape together with findings from InterPACK Pathfinding workshop (IPW) in 2016 led to a significant reset of InterPACK conference priorities and focus to comprehensively address needs of the InterPACK community. As a result, starting in 2017, InterPACK has become an annual conference and the scope of the conference has increased significantly together with a systems-focus to include some of the most cutting-edge topics in electronics packaging, device integration, and reliability. These topics are organized across five different tracks: (1) heterogeneous integration: microsystems with diverse functionality, (2) servers of the future, (3) structural and physical health monitoring, (4) energy conversion and storage, and (5) transportation: autonomous and electric vehicles.},

  doi          = {10.1115/1.4039090},

  journal      = {Journal of Electronic Packaging},

  number       = 1,

  volume       = 140,

  place        = {United States},

  year         = {2018},

  month        = {3}

}

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