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Title: Synchrotron X-Ray Topography for Encapsulation Stress/Strain and Crack Detection in Crystalline Silicon Modules

Authors:
ORCiD logo [1];  [1];  [2];  [2]
  1. Brookhaven National Lab. (BNL), Upton, NY (United States)
  2. Stony Brook Univ., NY (United States)
Publication Date:
Research Org.:
Brookhaven National Lab. (BNL), Upton, NY (United States)
Sponsoring Org.:
USDOE Office of Energy Efficiency and Renewable Energy (EERE), Renewable Power Office. Solar Energy Technologies Office; BNL Program Development; USDOE Office of Science (SC), Basic Energy Sciences (BES)
OSTI Identifier:
1426792
Alternate Identifier(s):
OSTI ID: 1768775
Report Number(s):
BNL-113223-2016-JAAM; BNL-221103-2021-JAAM
Journal ID: ISSN 2156-3381
Grant/Contract Number:  
SC0012704
Resource Type:
Accepted Manuscript
Journal Name:
IEEE Journal of Photovoltaics
Additional Journal Information:
Journal Volume: 6; Journal Issue: 5; Journal ID: ISSN 2156-3381
Publisher:
IEEE
Country of Publication:
United States
Language:
English
Subject:
14 SOLAR ENERGY; 36 MATERIALS SCIENCE; Crystalline silicon; photovoltaic modules; reliability; X-ray topography

Citation Formats

Colli, Alessandra, Attenkofer, Klaus, Raghothamachar, Balaji, and Dudley, Michael. Synchrotron X-Ray Topography for Encapsulation Stress/Strain and Crack Detection in Crystalline Silicon Modules. United States: N. p., 2016. Web. https://doi.org/10.1109/JPHOTOV.2016.2585022.
Colli, Alessandra, Attenkofer, Klaus, Raghothamachar, Balaji, & Dudley, Michael. Synchrotron X-Ray Topography for Encapsulation Stress/Strain and Crack Detection in Crystalline Silicon Modules. United States. https://doi.org/10.1109/JPHOTOV.2016.2585022
Colli, Alessandra, Attenkofer, Klaus, Raghothamachar, Balaji, and Dudley, Michael. Thu . "Synchrotron X-Ray Topography for Encapsulation Stress/Strain and Crack Detection in Crystalline Silicon Modules". United States. https://doi.org/10.1109/JPHOTOV.2016.2585022. https://www.osti.gov/servlets/purl/1426792.
@article{osti_1426792,
title = {Synchrotron X-Ray Topography for Encapsulation Stress/Strain and Crack Detection in Crystalline Silicon Modules},
author = {Colli, Alessandra and Attenkofer, Klaus and Raghothamachar, Balaji and Dudley, Michael},
abstractNote = {},
doi = {10.1109/JPHOTOV.2016.2585022},
journal = {IEEE Journal of Photovoltaics},
number = 5,
volume = 6,
place = {United States},
year = {2016},
month = {7}
}

Journal Article:
Free Publicly Available Full Text
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Cited by: 4 works
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