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Title: Synchrotron X-Ray Topography for Encapsulation Stress/Strain and Crack Detection in Crystalline Silicon Modules

Abstract

Here in this article, we present the first experiment to prove the capabilities of X-ray topography for the direct imaging and analysis of defects, stress, and strain affecting the cell within the laminated photovoltaic (PV) module. Cracks originating from grain boundaries structures have been detected, developing along the cleavage planes of the crystal. The strain affecting the cell is clearly visualized through the bending of the metallization line images and can be easily mapped. While the recording conditions need to be optimized to maximize image contrast, this experiment demonstrates how synchrotron facilities can enable PV industry and research to characterize full PV modules. Appropriate development of the technique could also lead to future use of laboratory-level X-ray sources.

Authors:
ORCiD logo [1];  [1];  [2];  [2]
  1. Brookhaven National Lab. (BNL), Upton, NY (United States)
  2. Stony Brook Univ., NY (United States)
Publication Date:
Research Org.:
Brookhaven National Lab. (BNL), Upton, NY (United States)
Sponsoring Org.:
USDOE Office of Energy Efficiency and Renewable Energy (EERE), Solar Energy Technologies Office (EE-4S); BNL Program Development
OSTI Identifier:
1426792
Report Number(s):
BNL-113223-2016-JAAM
Journal ID: ISSN 2156-3381
Grant/Contract Number:  
SC0012704
Resource Type:
Accepted Manuscript
Journal Name:
IEEE Journal of Photovoltaics
Additional Journal Information:
Journal Volume: 6; Journal Issue: 5; Journal ID: ISSN 2156-3381
Publisher:
IEEE
Country of Publication:
United States
Language:
English
Subject:
14 SOLAR ENERGY

Citation Formats

Colli, Alessandra, Attenkofer, Klaus, Raghothamachar, Balaji, and Dudley, Michael. Synchrotron X-Ray Topography for Encapsulation Stress/Strain and Crack Detection in Crystalline Silicon Modules. United States: N. p., 2016. Web. doi:10.1109/JPHOTOV.2016.2585022.
Colli, Alessandra, Attenkofer, Klaus, Raghothamachar, Balaji, & Dudley, Michael. Synchrotron X-Ray Topography for Encapsulation Stress/Strain and Crack Detection in Crystalline Silicon Modules. United States. doi:10.1109/JPHOTOV.2016.2585022.
Colli, Alessandra, Attenkofer, Klaus, Raghothamachar, Balaji, and Dudley, Michael. Thu . "Synchrotron X-Ray Topography for Encapsulation Stress/Strain and Crack Detection in Crystalline Silicon Modules". United States. doi:10.1109/JPHOTOV.2016.2585022. https://www.osti.gov/servlets/purl/1426792.
@article{osti_1426792,
title = {Synchrotron X-Ray Topography for Encapsulation Stress/Strain and Crack Detection in Crystalline Silicon Modules},
author = {Colli, Alessandra and Attenkofer, Klaus and Raghothamachar, Balaji and Dudley, Michael},
abstractNote = {Here in this article, we present the first experiment to prove the capabilities of X-ray topography for the direct imaging and analysis of defects, stress, and strain affecting the cell within the laminated photovoltaic (PV) module. Cracks originating from grain boundaries structures have been detected, developing along the cleavage planes of the crystal. The strain affecting the cell is clearly visualized through the bending of the metallization line images and can be easily mapped. While the recording conditions need to be optimized to maximize image contrast, this experiment demonstrates how synchrotron facilities can enable PV industry and research to characterize full PV modules. Appropriate development of the technique could also lead to future use of laboratory-level X-ray sources.},
doi = {10.1109/JPHOTOV.2016.2585022},
journal = {IEEE Journal of Photovoltaics},
number = 5,
volume = 6,
place = {United States},
year = {2016},
month = {7}
}

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Cited by: 3 works
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