DOE PAGES title logo U.S. Department of Energy
Office of Scientific and Technical Information

Title: Review Article: Stress in thin films and coatings: Current status, challenges, and prospects

Abstract

The issue of stress in thin films and functional coatings is a persistent problem in materials science and technology that has congregated many efforts, both from experimental and fundamental points of view, to get a better understanding on how to deal with, how to tailor, and how to manage stress in many areas of applications. With the miniaturization of device components, the quest for increasingly complex film architectures and multiphase systems and the continuous demands for enhanced performance, there is a need toward the reliable assessment of stress on a submicron scale from spatially resolved techniques. Also, the stress evolution during film and coating synthesis using physical vapor deposition (PVD), chemical vapor deposition, plasma enhanced chemical vapor deposition (PECVD), and related processes is the result of many interrelated factors and competing stress sources so that the task to provide a unified picture and a comprehensive model from the vast amount of stress data remains very challenging. This article summarizes the recent advances, challenges, and prospects of both fundamental and applied aspects of stress in thin films and engineering coatings and systems, based on recent achievements presented during the 2016 Stress Workshop entitled “Stress Evolution in Thin Films and Coatings: frommore » Fundamental Understanding to Control.” Evaluation methods, implying wafer curvature, x-ray diffraction, or focused ion beam removal techniques, are reviewed. Selected examples of stress evolution in elemental and alloyed systems, graded layers, and multilayer-stacks as well as amorphous films deposited using a variety of PVD and PECVD techniques are highlighted. Based on mechanisms uncovered by in situ and real-time diagnostics, a kinetic model is outlined that is capable of reproducing the dependence of intrinsic (growth) stress on the grain size, growth rate, and deposited energy. The problems and solutions related to stress in the context of optical coatings, inorganic coatings on plastic substrates, and tribological coatings for aerospace applications are critically examined. This review also suggests strategies to mitigate excessive stress levels from novel coating synthesis perspectives to microstructural design approaches, including the ability to empower crack-based fabrication processes, pathways leading to stress relaxation and compensation, as well as management of the film and coating growth conditions with respect to energetic ion bombardment. Future opportunities and challenges for stress engineering and stress modeling are considered and outlined.« less

Authors:
 [1];  [2];  [3];  [4];  [5];  [6];  [7];  [8];  [9];  [10]
  1. CNRS-Université de Poitiers-ENSMA (France)
  2. Brown Univ., Providence, RI (United States)
  3. Montanuniversität Leoben and Erich Schmid Institute for Materials Science, Austrian Academy of Sciences, Leoben (Austria)
  4. University of Rome “ROMA TRE,” (Italy)
  5. Univ. of Alabama, Tuscaloosa, AL (United States)
  6. PSL University, Sorbonne Université, CNRS, Paris (France)
  7. Univ. of Akron, OH (United States)
  8. IBM T.J. Watson Research Center, Yorktown Heights, NY (United States)
  9. Eastman Chemical Co., Palo Alto, CA (United States)
  10. Polytechnique Montréal, Montreal, Quebec (Canada)
Publication Date:
Research Org.:
Brown Univ., Providence, RI (United States)
Sponsoring Org.:
USDOE Office of Science (SC), Basic Energy Sciences (BES)
OSTI Identifier:
1499940
Alternate Identifier(s):
OSTI ID: 1423721
Grant/Contract Number:  
SC0008799
Resource Type:
Accepted Manuscript
Journal Name:
Journal of Vacuum Science and Technology A
Additional Journal Information:
Journal Volume: 36; Journal Issue: 2; Journal ID: ISSN 0734-2101
Publisher:
American Vacuum Society
Country of Publication:
United States
Language:
English
Subject:
36 MATERIALS SCIENCE

Citation Formats

Abadias, Grégory, Chason, Eric, Keckes, Jozef, Sebastiani, Marco, Thompson, Gregory B., Barthel, Etienne, Doll, Gary L., Murray, Conal E., Stoessel, Chris H., and Martinu, Ludvik. Review Article: Stress in thin films and coatings: Current status, challenges, and prospects. United States: N. p., 2018. Web. doi:10.1116/1.5011790.
Abadias, Grégory, Chason, Eric, Keckes, Jozef, Sebastiani, Marco, Thompson, Gregory B., Barthel, Etienne, Doll, Gary L., Murray, Conal E., Stoessel, Chris H., & Martinu, Ludvik. Review Article: Stress in thin films and coatings: Current status, challenges, and prospects. United States. https://doi.org/10.1116/1.5011790
Abadias, Grégory, Chason, Eric, Keckes, Jozef, Sebastiani, Marco, Thompson, Gregory B., Barthel, Etienne, Doll, Gary L., Murray, Conal E., Stoessel, Chris H., and Martinu, Ludvik. Mon . "Review Article: Stress in thin films and coatings: Current status, challenges, and prospects". United States. https://doi.org/10.1116/1.5011790. https://www.osti.gov/servlets/purl/1499940.
@article{osti_1499940,
title = {Review Article: Stress in thin films and coatings: Current status, challenges, and prospects},
author = {Abadias, Grégory and Chason, Eric and Keckes, Jozef and Sebastiani, Marco and Thompson, Gregory B. and Barthel, Etienne and Doll, Gary L. and Murray, Conal E. and Stoessel, Chris H. and Martinu, Ludvik},
abstractNote = {The issue of stress in thin films and functional coatings is a persistent problem in materials science and technology that has congregated many efforts, both from experimental and fundamental points of view, to get a better understanding on how to deal with, how to tailor, and how to manage stress in many areas of applications. With the miniaturization of device components, the quest for increasingly complex film architectures and multiphase systems and the continuous demands for enhanced performance, there is a need toward the reliable assessment of stress on a submicron scale from spatially resolved techniques. Also, the stress evolution during film and coating synthesis using physical vapor deposition (PVD), chemical vapor deposition, plasma enhanced chemical vapor deposition (PECVD), and related processes is the result of many interrelated factors and competing stress sources so that the task to provide a unified picture and a comprehensive model from the vast amount of stress data remains very challenging. This article summarizes the recent advances, challenges, and prospects of both fundamental and applied aspects of stress in thin films and engineering coatings and systems, based on recent achievements presented during the 2016 Stress Workshop entitled “Stress Evolution in Thin Films and Coatings: from Fundamental Understanding to Control.” Evaluation methods, implying wafer curvature, x-ray diffraction, or focused ion beam removal techniques, are reviewed. Selected examples of stress evolution in elemental and alloyed systems, graded layers, and multilayer-stacks as well as amorphous films deposited using a variety of PVD and PECVD techniques are highlighted. Based on mechanisms uncovered by in situ and real-time diagnostics, a kinetic model is outlined that is capable of reproducing the dependence of intrinsic (growth) stress on the grain size, growth rate, and deposited energy. The problems and solutions related to stress in the context of optical coatings, inorganic coatings on plastic substrates, and tribological coatings for aerospace applications are critically examined. This review also suggests strategies to mitigate excessive stress levels from novel coating synthesis perspectives to microstructural design approaches, including the ability to empower crack-based fabrication processes, pathways leading to stress relaxation and compensation, as well as management of the film and coating growth conditions with respect to energetic ion bombardment. Future opportunities and challenges for stress engineering and stress modeling are considered and outlined.},
doi = {10.1116/1.5011790},
journal = {Journal of Vacuum Science and Technology A},
number = 2,
volume = 36,
place = {United States},
year = {Mon Mar 05 00:00:00 EST 2018},
month = {Mon Mar 05 00:00:00 EST 2018}
}

Journal Article:
Free Publicly Available Full Text
Publisher's Version of Record

Citation Metrics:
Cited by: 396 works
Citation information provided by
Web of Science

Save / Share:

Works referenced in this record:

Atomic force microscopy study of the morphological shape of thin film buckling
journal, March 2002


An experimental study of the influence of imperfections on the buckling of compressed thin films
journal, March 2002


How soft substrates affect the buckling delamination of thin films through crack front sink-in
journal, April 2017

  • Boijoux, R.; Parry, G.; Faou, J. -Y.
  • Applied Physics Letters, Vol. 110, Issue 14
  • DOI: 10.1063/1.4979614

From telephone cords to branched buckles: A phase diagram
journal, February 2017


Modelling, production and characterisation of duplex coatings (HVOF and PVD) on Ti–6Al–4V substrate for specific mechanical applications
journal, June 2007


SiN x coatings deposited by reactive high power impulse magnetron sputtering: Process parameters influencing the residual coating stress
journal, May 2017

  • Schmidt, S.; Hänninen, T.; Wissting, J.
  • Journal of Applied Physics, Vol. 121, Issue 17
  • DOI: 10.1063/1.4977812

Comparative study of the mechanical properties of nanostructured thin films on stretchable substrates
journal, September 2014

  • Djaziri, S.; Renault, P. -O.; Le Bourhis, E.
  • Journal of Applied Physics, Vol. 116, Issue 9
  • DOI: 10.1063/1.4894616

Making metallic glasses plastic by control of residual stress
journal, October 2006

  • Zhang, Y.; Wang, W. H.; Greer, A. L.
  • Nature Materials, Vol. 5, Issue 11
  • DOI: 10.1038/nmat1758

Stress analyses of high spatial resolution on TSV and BEoL structures
journal, September 2014


A methodology for determining mechanical properties of freestanding thin films and MEMS materials
journal, January 2003

  • Espinosa, H. D.; Prorok, B. C.; Fischer, M.
  • Journal of the Mechanics and Physics of Solids, Vol. 51, Issue 1
  • DOI: 10.1016/S0022-5096(02)00062-5

Electromigration in thin aluminum films on titanium nitride
journal, April 1976

  • Blech, I. A.
  • Journal of Applied Physics, Vol. 47, Issue 4, p. 1203-1208
  • DOI: 10.1063/1.322842

Growth of whiskers from Sn surfaces: Driving forces and growth mechanisms
journal, May 2013


Direct measurement of residual stress in sub-micron interconnects
journal, August 2003

  • Horsfall, A. B.; Santos, J. M. M. dos; Soare, S. M.
  • Semiconductor Science and Technology, Vol. 18, Issue 11
  • DOI: 10.1088/0268-1242/18/11/315

Quantifying the Effect of Stress on Sn Whisker Nucleation Kinetics
journal, September 2017


Enhanced Proton Conductivity in Y-Doped BaZrO 3 via Strain Engineering
journal, October 2017

  • Fluri, Aline; Marcolongo, Aris; Roddatis, Vladimir
  • Advanced Science, Vol. 4, Issue 12
  • DOI: 10.1002/advs.201700467

Growth stress induced tunability of dielectric permittivity in thin films
journal, January 2016

  • Narayanachari, K. V. L. V.; Chandrasekar, Hareesh; Banerjee, Amiya
  • Journal of Applied Physics, Vol. 119, Issue 1
  • DOI: 10.1063/1.4939466

The correlation between mechanical stress and magnetic anisotropy in ultrathin films
journal, January 1999


The role of surface stress in structural transitions, epitaxial growth and magnetism on the nanoscale
journal, March 2009


Strained Si, SiGe, and Ge channels for high-mobility metal-oxide-semiconductor field-effect transistors
journal, January 2005

  • Lee, Minjoo L.; Fitzgerald, Eugene A.; Bulsara, Mayank T.
  • Journal of Applied Physics, Vol. 97, Issue 1
  • DOI: 10.1063/1.1819976

Tutorial: Understanding residual stress in polycrystalline thin films through real-time measurements and physical models
journal, May 2016

  • Chason, Eric; Guduru, Pradeep R.
  • Journal of Applied Physics, Vol. 119, Issue 19
  • DOI: 10.1063/1.4949263

Stress-related effects in thin films
journal, April 1989


The Tension of Metallic Films Deposited by Electrolysis
journal, May 1909

  • Stoney, G. G.
  • Proceedings of the Royal Society A: Mathematical, Physical and Engineering Sciences, Vol. 82, Issue 553
  • DOI: 10.1098/rspa.1909.0021

Intrinsic Stress in Evaporated Metal Films
journal, January 1968

  • Klokholm, E.; Berry, B. S.
  • Journal of The Electrochemical Society, Vol. 115, Issue 8
  • DOI: 10.1149/1.2411441

Aluminum films deposited by rf sputtering
journal, March 1970

  • D’Heurle, F. M.
  • Metallurgical and Materials Transactions B, Vol. 1, Issue 3
  • DOI: 10.1007/BF02811600

The origins of stress in thin nickel films
journal, September 1972


Structure and internal stress in ultra-thin silver films deposited on MgF2 and SiO substrates
journal, July 1978


The dynamic competition between stress generation and relaxation mechanisms during coalescence of Volmer–Weber thin films
journal, May 2001

  • Floro, J. A.; Hearne, S. J.; Hunter, J. A.
  • Journal of Applied Physics, Vol. 89, Issue 9
  • DOI: 10.1063/1.1352563

Internal interfaces and intrinsic stress in thin amorphous Cu-Ti and Co-Tb films
journal, March 1998

  • Geyer, U.; von Hülsen, U.; Kopf, H.
  • Journal of Applied Physics, Vol. 83, Issue 6
  • DOI: 10.1063/1.367061

Stress in Evaporated and Sputtered Thin Films – A Comparison
journal, March 2010


Quantitative correlation between intrinsic stress and microstructure of thin films
journal, April 2016


Role of atomic migration in nanocrystalline stability: Grain size and thin film stress states
journal, April 2015

  • Kapoor, Monica; Thompson, Gregory B.
  • Current Opinion in Solid State and Materials Science, Vol. 19, Issue 2
  • DOI: 10.1016/j.cossms.2014.11.001

Intrinsic stress response of low and high mobility solute additions to Cu thin films
journal, December 2017

  • Kaub, Tyler; Anthony, Ryan; Thompson, Gregory B.
  • Journal of Applied Physics, Vol. 122, Issue 22
  • DOI: 10.1063/1.5008269

In Situ Thin Film Growth Stresses during Chemical Ordering
journal, August 2010


Influence of Phase Transformation on Stress Evolution during Growth of Metal Thin Films on Silicon
journal, March 2010


Epitaxial growth of Cu(001) thin films onto Si(001) using a single-step HiPIMS process
journal, May 2017


A review of metal-ion-flux-controlled growth of metastable TiAlN by HIPIMS/DCMS co-sputtering
journal, October 2014


Extended metastable Al solubility in cubic VAlN by metal-ion bombardment during pulsed magnetron sputtering: film stress vs subplantation
journal, July 2017

  • Greczynski, G.; Mráz, S.; Ruess, H.
  • Journal of Applied Physics, Vol. 122, Issue 2
  • DOI: 10.1063/1.4991640

Critical ion energy and ion flux in the growth of films by plasma‐enhanced chemical‐vapor deposition
journal, July 1994

  • Martinu, L.; Klemberg‐Sapieha, J. E.; Küttel, O. M.
  • Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films, Vol. 12, Issue 4
  • DOI: 10.1116/1.579322

Microstructure-controlled depth gradients of mechanical properties in thin nanocrystalline films: Towards structure-property gradient functionalization
journal, June 2015

  • Daniel, R.; Zeilinger, A.; Schöberl, T.
  • Journal of Applied Physics, Vol. 117, Issue 23
  • DOI: 10.1063/1.4922666

Nanoscale holographic interferometry for strain measurements in electronic devices
journal, June 2008

  • Hÿtch, Martin; Houdellier, Florent; Hüe, Florian
  • Nature, Vol. 453, Issue 7198
  • DOI: 10.1038/nature07049

High-resolution elastic strain measurement from electron backscatter diffraction patterns: New levels of sensitivity
journal, March 2006


Effect of mesoscopic misfit on growth, morphology, electronic properties and magnetism of nanostructures at metallic surfaces
journal, December 2014


Plasma deposition of optical films and coatings: A review
journal, November 2000

  • Martinu, Ludvik; Poitras, Daniel
  • Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films, Vol. 18, Issue 6
  • DOI: 10.1116/1.1314395

Stresses and deformation processes in thin films on substrates
journal, January 1988

  • Doerner, Mary F.; Nix, William D.
  • Critical Reviews in Solid State and Materials Sciences, Vol. 14, Issue 3
  • DOI: 10.1080/10408438808243734

The intrinsic stress of polycrystalline and epitaxial thin metal films
journal, November 1994


Thin Film Materials
book, July 2010


Intrinsic Compressive Stress in Polycrystalline Films is Localized at Edges of the Grain Boundaries
journal, December 2017


Stresses, curvatures, and shape changes arising from patterned lines on silicon wafers
journal, August 1996

  • Shen, Y. ‐L.; Suresh, S.; Blech, I. A.
  • Journal of Applied Physics, Vol. 80, Issue 3
  • DOI: 10.1063/1.362938

Surface and interface stress effects in thin films
journal, May 1994


Measuring Ge segregation by real‐time stress monitoring during Si 1− x Ge x molecular beam epitaxy
journal, December 1996

  • Floro, J. A.; Chason, E.
  • Applied Physics Letters, Vol. 69, Issue 25
  • DOI: 10.1063/1.117119

Influence of segregation on the measurement of stress in thin films
journal, March 2002

  • Thomas, O.; Müller, P.; Gergaud, P.
  • Journal of Applied Physics, Vol. 91, Issue 5
  • DOI: 10.1063/1.1447327

Origin of Compressive Residual Stress in Polycrystalline Thin Films
journal, March 2002


A UHV‐compatible thin‐film stress‐measuring apparatus based on the cantilever beam principle
journal, December 1990

  • Koch, R.; Leonhard, H.; Thurner, G.
  • Review of Scientific Instruments, Vol. 61, Issue 12
  • DOI: 10.1063/1.1141512

Reversible Stress Relaxation during Precoalescence Interruptions of Volmer-Weber Thin Film Growth
journal, September 2002


Effect of ion bombardment on stress in thin metal films
journal, December 2003


An Apparatus for Measuring Stress in Thin Films
journal, August 1969

  • Klokholm, E.
  • Review of Scientific Instruments, Vol. 40, Issue 8
  • DOI: 10.1063/1.1684149

Full field measurements of curvature using coherent gradient sensing: application to thin film characterization
journal, July 1998


In Situ Stress Measurements during Copper Electrodeposition on (111)-Textured Au
journal, January 2005

  • Kongstein, O. E.; Bertocci, U.; Stafford, G. R.
  • Journal of The Electrochemical Society, Vol. 152, Issue 3
  • DOI: 10.1149/1.1854093

Mechanical stresses in (sub)monolayer epitaxial films
journal, February 1990


Real-time stress evolution during Si1-xGex Heteroepitaxy: Dislocations, islanding, and segregation
journal, September 1997


On the use of a multiple beam optical sensor for in situ curvature monitoring in liquids
journal, April 2010

  • Van Overmeere, Q.; Vanhumbeeck, J. -F.; Proost, J.
  • Review of Scientific Instruments, Vol. 81, Issue 4
  • DOI: 10.1063/1.3385432

Measurements of the Phase and Stress Evolution during Initial Lithiation of Sn Electrodes
journal, January 2017

  • Chen, Chun-Hao; Chason, Eric; Guduru, Pradeep R.
  • Journal of The Electrochemical Society, Vol. 164, Issue 4
  • DOI: 10.1149/2.0381704jes

Simultaneous determination of experimental elastic and thermal strains in thin films
journal, March 2005


The determination of stresses in thin films; modelling elastic grain interaction
journal, January 2003


Berechnung der Fließgrenze von Mischkristallen auf Grund der Plastizitätsbedingung für Einkristalle .
journal, January 1929


The Elastic Behaviour of a Crystalline Aggregate
journal, May 1952


An analysis technique for extraction of thin film stresses from x-ray data
journal, November 1997

  • Cornella, Guido; Lee, Seok-Hee; Nix, William D.
  • Applied Physics Letters, Vol. 71, Issue 20
  • DOI: 10.1063/1.120225

Stress field in sputtered thin films: Ion irradiation as a tool to induce relaxation and investigate the origin of growth stress
journal, June 2004

  • Debelle, A.; Abadias, G.; Michel, A.
  • Applied Physics Letters, Vol. 84, Issue 24
  • DOI: 10.1063/1.1763637

Stress analysis of polycrystalline thin films and surface regions by X-ray diffraction
journal, January 2005


X-ray residual stress measurements on cold-drawn steel wire
journal, October 1982


Directed sputter deposition of AlCu: Film microstructure and microchemistry
journal, November 1994

  • Kim, Y. ‐W.; Moser, J.; Petrov, I.
  • Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films, Vol. 12, Issue 6
  • DOI: 10.1116/1.579233

X-ray residual stress analysis in thin films under grazing incidence – basic aspects and applications
journal, January 2005


X-ray nanodiffraction reveals strain and microstructure evolution in nanocrystalline thin films
journal, November 2012


X-ray analysis of residual stress gradients in TiN coatings by a Laplace space approach and cross-sectional nanodiffraction: a critical comparison
journal, August 2013

  • Stefenelli, Mario; Todt, Juraj; Riedl, Angelika
  • Journal of Applied Crystallography, Vol. 46, Issue 5
  • DOI: 10.1107/S0021889813019535

In-situ Observation of Cross-Sectional Microstructural Changes and Stress Distributions in Fracturing TiN Thin Film during Nanoindentation
journal, March 2016

  • Zeilinger, Angelika; Todt, Juraj; Krywka, Christina
  • Scientific Reports, Vol. 6, Issue 1
  • DOI: 10.1038/srep22670

Implementation and Development of the Incremental Hole Drilling Method for the Measurement of Residual Stress in Thermal Spray Coatings
journal, December 2005

  • Valente, T.; Bartuli, C.; Sebastiani, M.
  • Journal of Thermal Spray Technology, Vol. 14, Issue 4
  • DOI: 10.1361/105996305X76432

A method for in situ measurement of the residual stress in thin films by using the focused ion beam
journal, October 2003


Residual Stress Measurement on a MEMS Structure With High-Spatial Resolution
journal, April 2007

  • Sabate, Neus; Vogel, Dietmar; Gollhardt, Astrid
  • Journal of Microelectromechanical Systems, Vol. 16, Issue 2
  • DOI: 10.1109/JMEMS.2006.879701

Focused ion beam ring drilling for residual stress evaluation
journal, September 2009


Residual stress evaluation at the micrometer scale: Analysis of thin coatings by FIB milling and digital image correlation
journal, December 2010

  • Korsunsky, Alexander M.; Sebastiani, Marco; Bemporad, Edoardo
  • Surface and Coatings Technology, Vol. 205, Issue 7
  • DOI: 10.1016/j.surfcoat.2010.09.033

Depth-resolved residual stress analysis of thin coatings by a new FIB–DIC method
journal, October 2011

  • Sebastiani, Marco; Eberl, Christoph; Bemporad, Edoardo
  • Materials Science and Engineering: A, Vol. 528, Issue 27
  • DOI: 10.1016/j.msea.2011.07.001

Residual stress measurement in thin films at sub-micron scale using Focused Ion Beam milling and imaging
journal, January 2012


High resolution residual stress measurement on amorphous and crystalline plasma-sprayed single-splats
journal, July 2012


A New Methodology For In-Situ Residual Stress Measurement In MEMS Structures
conference, January 2010

  • Sebastiani, M.; Bemporad, E.; Melone, G.
  • STRESS-INDUCED PHENOMENA IN METALLIZATION: 11th International Workshop, AIP Conference Proceedings
  • DOI: 10.1063/1.3527116

Micron-Scale Residual Stress Measurement by Micro-Hole Drilling and Digital Image Correlation
journal, May 2011


A simple method for residual stress measurements in thin films by means of focused ion beam milling and digital image correlation
journal, January 2013


A critical comparison between XRD and FIB residual stress measurement techniques in thin films
journal, December 2014


Focused ion beam four-slot milling for Poisson's ratio and residual stress evaluation at the micron scale
journal, July 2014


A New Methodology to Analyze Instabilities in SEM Imaging
journal, October 2014

  • Mansilla, Catalina; Ocelík, Václav; De Hosson, Jeff T. M.
  • Microscopy and Microanalysis, Vol. 20, Issue 6
  • DOI: 10.1017/S1431927614013282

A state-of-the-art review of micron-scale spatially resolved residual stress analysis by FIB-DIC ring-core milling and other techniques
journal, August 2015

  • Lunt, Alexander JG; Baimpas, Nikolaos; Salvati, Enrico
  • The Journal of Strain Analysis for Engineering Design, Vol. 50, Issue 7
  • DOI: 10.1177/0309324715596700

Nano-scale mapping of lattice strain and orientation inside carbon core SiC fibres by synchrotron X-ray diffraction
journal, November 2014


A review of micro-scale focused ion beam milling and digital image correlation analysis for residual stress evaluation and error estimation
journal, December 2015


A novel pillar indentation splitting test for measuring fracture toughness of thin ceramic coatings
journal, May 2014


Measurement of fracture toughness by nanoindentation methods: Recent advances and future challenges
journal, December 2015

  • Sebastiani, M.; Johanns, K. E.; Herbert, E. G.
  • Current Opinion in Solid State and Materials Science, Vol. 19, Issue 6
  • DOI: 10.1016/j.cossms.2015.04.003

Design, fabrication and characterization of multilayer Cr-CrN thin coatings with tailored residual stress profiles
journal, December 2016


Nanoscale residual stress depth profiling by Focused Ion Beam milling and eigenstrain analysis
journal, May 2018


Variational eigenstrain analysis of synchrotron diffraction measurements of residual elastic strain in a bent titanium alloy bar
journal, January 2006


Uncertainty quantification of residual stress evaluation by the FIB–DIC ring-core method due to elastic anisotropy effects
journal, June 2016


Quantifying eigenstrain distributions induced by focused ion beam damage in silicon
journal, December 2016


Celebrating the 100th anniversary of the Stoney equation for film stress: Developments from polycrystalline steel strips to single crystal silicon wafers
journal, January 2009


Determination of the elastic moduli and residual stresses of freestanding Au-TiW bilayer thin films by nanoindentation
journal, September 2016


Microstructural evolution during film growth
journal, September 2003

  • Petrov, I.; Barna, P. B.; Hultman, L.
  • Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films, Vol. 21, Issue 5
  • DOI: 10.1116/1.1601610

Volmer-Weber growth stages of polycrystalline metal films probed by in situ and real-time optical diagnostics
journal, November 2015

  • Abadias, G.; Simonot, L.; Colin, J. J.
  • Applied Physics Letters, Vol. 107, Issue 18
  • DOI: 10.1063/1.4935034

Measurements of the intrinsic stress in thin metal films
journal, January 1990


Compressive Stress in Polycrystalline Volmer-Weber Films
journal, April 2005


Origins of residual stress in thin films: Interaction between microstructure and growth kinetics
journal, November 2016


Measurements of stress during vapor deposition of copper and silver thin films and multilayers
journal, December 1996

  • Shull, Alison L.; Spaepen, Frans
  • Journal of Applied Physics, Vol. 80, Issue 11
  • DOI: 10.1063/1.363701

Reversible stress changes at all stages of Volmer–Weber film growth
journal, February 2004

  • Friesen, C.; Seel, S. C.; Thompson, C. V.
  • Journal of Applied Physics, Vol. 95, Issue 3
  • DOI: 10.1063/1.1637728

Weak temperature dependence of stress relaxation in as-deposited polycrystalline gold films
journal, September 2010


Fast and slow stress evolution mechanisms during interruptions of Volmer-Weber growth
journal, January 2014

  • Yu, Hang Z.; Leib, Jeffrey S.; Boles, Steven T.
  • Journal of Applied Physics, Vol. 115, Issue 4
  • DOI: 10.1063/1.4863600

Direct Evidence for Effects of Grain Structure on Reversible Compressive Deposition Stresses in Polycrystalline Gold Films
journal, June 2009


Stresses in thin films: The relevance of grain boundaries and impurities
journal, May 1976


Crystallite coalescence: A mechanism for intrinsic tensile stresses in thin films
journal, August 1999


Model for stress generated upon contact of neighboring islands on the surface of a substrate
journal, May 2001

  • Freund, L. B.; Chason, Eric
  • Journal of Applied Physics, Vol. 89, Issue 9
  • DOI: 10.1063/1.1359437

Interfaces and stresses in thin films
journal, January 2000


Kinetic model for dependence of thin film stress on growth rate, temperature, and microstructure
journal, April 2012

  • Chason, E.; Shin, J. W.; Hearne, S. J.
  • Journal of Applied Physics, Vol. 111, Issue 8
  • DOI: 10.1063/1.4704683

A kinetic analysis of residual stress evolution in polycrystalline thin films
journal, December 2012


Growth of patterned island arrays to identify origins of thin film stress
journal, March 2014

  • Chason, E.; Shin, J. W.; Chen, C. -H.
  • Journal of Applied Physics, Vol. 115, Issue 12
  • DOI: 10.1063/1.4870051

Stress evolution during growth of 1-D island arrays: Kinetics and length scaling
journal, March 2015


Grain Growth and Stress Relief in Thin Films
journal, January 1972

  • Chaudhari, P.
  • Journal of Vacuum Science and Technology, Vol. 9, Issue 1
  • DOI: 10.1116/1.1316674

Intrinsic stress in sputter-deposited thin films
journal, January 1992

  • Windischmann, Henry
  • Critical Reviews in Solid State and Materials Sciences, Vol. 17, Issue 6
  • DOI: 10.1080/10408439208244586

Internal stresses in titanium, nickel, molybdenum, and tantalum films deposited by cylindrical magnetron sputtering
journal, January 1977

  • Thornton, John A.; Hoffman, David W.
  • Journal of Vacuum Science and Technology, Vol. 14, Issue 1
  • DOI: 10.1116/1.569113

The compressive stress transition in Al, V, Zr, Nb and W metal films sputtered at low working pressures
journal, September 1977


Internal stresses in Cr, Mo, Ta, and Pt films deposited by sputtering from a planar magnetron source
journal, March 1982

  • Hoffman, D. W.; Thornton, John A.
  • Journal of Vacuum Science and Technology, Vol. 20, Issue 3
  • DOI: 10.1116/1.571463

The influence of discharge current on the intrinsic stress in Mo films deposited using cylindrical and planar magnetron sputtering sources
journal, May 1985

  • Thornton, John A.; Hoffman, D. W.
  • Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films, Vol. 3, Issue 3
  • DOI: 10.1116/1.572997

Compressive stress and inert gas in Mo films sputtered from a cylindrical‐post magnetron with Ne, Ar, Kr, and Xe
journal, January 1980

  • Hoffman, D. W.; Thornton, John A.
  • Journal of Vacuum Science and Technology, Vol. 17, Issue 1
  • DOI: 10.1116/1.570394

Internal stresses in metallic films deposited by cylindrical magnetron sputtering
journal, November 1979


Note on the origin of intrinsic stresses in films deposited via evaporation and sputtering
journal, April 1989


Microstructure of thin tantalum films sputtered onto inclined substrates: Experiments and atomistic simulations
journal, July 2003

  • Dalla Torre, J.; Gilmer, G. H.; Windt, D. L.
  • Journal of Applied Physics, Vol. 94, Issue 1
  • DOI: 10.1063/1.1579112

A simple model for the formation of compressive stress in thin films by ion bombardment
journal, April 1993


On the origin of the metastable β-Ta phase stabilization in tantalum sputtered thin films
journal, March 2017


The metal flux from a rotating cylindrical magnetron: a Monte Carlo simulation
journal, October 2008


A novel pulsed magnetron sputter technique utilizing very high target power densities
journal, December 1999

  • Kouznetsov, Vladimir; Macák, Karol; Schneider, Jochen M.
  • Surface and Coatings Technology, Vol. 122, Issue 2-3
  • DOI: 10.1016/S0257-8972(99)00292-3

High power pulsed magnetron sputtering: A review on scientific and engineering state of the art
journal, February 2010


Tutorial: Reactive high power impulse magnetron sputtering (R-HiPIMS)
journal, March 2017

  • Anders, André
  • Journal of Applied Physics, Vol. 121, Issue 17
  • DOI: 10.1063/1.4978350

The Stopping and Range of Ions in Matter
book, January 1985


On the origin of stress in magnetron sputtered TiN layers
journal, December 2000

  • Kamminga, J. -D.; de Keijser, Th. H.; Delhez, R.
  • Journal of Applied Physics, Vol. 88, Issue 11
  • DOI: 10.1063/1.1319973

Atom insertion into grain boundaries and stress generation in physically vapor deposited films
journal, July 2013

  • Magnfält, D.; Abadias, G.; Sarakinos, K.
  • Applied Physics Letters, Vol. 103, Issue 5
  • DOI: 10.1063/1.4817669

A kinetic model for stress generation in thin films grown from energetic vapor fluxes
journal, April 2016

  • Chason, E.; Karlson, M.; Colin, J. J.
  • Journal of Applied Physics, Vol. 119, Issue 14
  • DOI: 10.1063/1.4946039

Compositional dependent thin film stress states
journal, August 2010

  • Fu, B.; Thompson, G. B.
  • Journal of Applied Physics, Vol. 108, Issue 4
  • DOI: 10.1063/1.3462431

Stress evolution in magnetron sputtered Ti–Zr–N and Ti–Ta–N films studied by in situ wafer curvature: Role of energetic particles
journal, December 2009


Thin film deposition: fundamentals and modeling
journal, November 1998


Effect of adatom surface diffusivity on microstructure and intrinsic stress evolutions during Ag film growth
journal, August 2012

  • Flötotto, D.; Wang, Z. M.; Jeurgens, L. P. H.
  • Journal of Applied Physics, Vol. 112, Issue 4
  • DOI: 10.1063/1.4746739

Stress evolution during and after sputter deposition of thin Cu–Al alloy films
journal, May 2008


Influence of Ni Solute segregation on the intrinsic growth stresses in Cu(Ni) thin films
journal, March 2016


Stress engineering using low oxygen background pressures during Volmer–Weber growth of polycrystalline nickel films
journal, March 2015

  • Yu, Hang Z.; Thompson, Carl V.
  • Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films, Vol. 33, Issue 2
  • DOI: 10.1116/1.4902957

Influence of Fe(Cr) miscibility on thin film grain size and stress
journal, August 2016


Grain Boundary Specific Segregation in Nanocrystalline Fe(Cr)
journal, October 2016

  • Zhou, Xuyang; Yu, Xiao-xiang; Kaub, Tyler
  • Scientific Reports, Vol. 6, Issue 1
  • DOI: 10.1038/srep34642

In situ growth stresses during the phase separation of immiscible FeCu thin films
journal, December 2010


Phase stability and in situ growth stresses in Ti/Nb thin films
journal, November 2014


Interrelationship of in situ growth stress evolution and phase transformations in Ti/W multilayered thin films
journal, June 2016

  • Wan, Li; Yu, Xiao-xiang; Zhou, Xuyang
  • Journal of Applied Physics, Vol. 119, Issue 24
  • DOI: 10.1063/1.4954687

Investigation of the amorphous-to-crystalline transition in Mo/Si multilayers
journal, July 2001

  • Bajt, Saša; Stearns, Daniel G.; Kearney, Patrick A.
  • Journal of Applied Physics, Vol. 90, Issue 2
  • DOI: 10.1063/1.1381559

Polymorphic phase stability in thin multilayers
journal, June 1998


Direct Observation of the Thickness-Induced Crystallization and Stress Build-Up during Sputter-Deposition of Nanoscale Silicide Films
journal, December 2016

  • Krause, Bärbel; Abadias, Gregory; Michel, Anny
  • ACS Applied Materials & Interfaces, Vol. 8, Issue 50
  • DOI: 10.1021/acsami.6b12413

Velocity of propagation in the shock-crystallization of sputtered amorphous germanium
journal, August 1973


Crystallization‐front velocity during scanned laser crystallization of amorphous Ge films
journal, August 1980

  • Chapman, Ralph L.; Fan, John C. C.; Zeiger, Herbert J.
  • Applied Physics Letters, Vol. 37, Issue 3
  • DOI: 10.1063/1.91911

Liquid-phase explosive crystallization of electron-beam-evaporated a-Si films induced by flash lamp annealing
journal, January 2013


Mechanical stresses upon crystallization in phase change materials
journal, November 2001

  • Pedersen, T. P. Leervad; Kalb, J.; Njoroge, W. K.
  • Applied Physics Letters, Vol. 79, Issue 22
  • DOI: 10.1063/1.1415419

The relationship between deposition conditions, the beta to alpha phase transformation, and stress relaxation in tantalum thin films
journal, November 1992

  • Clevenger, L. A.; Mutscheller, A.; Harper, J. M. E.
  • Journal of Applied Physics, Vol. 72, Issue 10
  • DOI: 10.1063/1.352059

Sputtering deposited TiNi films: relationship among processing, stress evolution and phase transformation behaviors
journal, April 2003


Composition, residual stress, and structural properties of thin tungsten nitride films deposited by reactive magnetron sputtering
journal, August 2000

  • Shen, Y. G.; Mai, Y. W.; McKenzie, D. R.
  • Journal of Applied Physics, Vol. 88, Issue 3
  • DOI: 10.1063/1.373827

Phase transformation of thin sputter-deposited tungsten films at room temperature
journal, January 2002

  • Rossnagel, S. M.; Noyan, I. C.; Cabral, C.
  • Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures, Vol. 20, Issue 5
  • DOI: 10.1116/1.1506905

Phase transformation of sputter deposited tungsten thin films with A‐15 structure
journal, June 1996

  • O’Keefe, M. J.; Grant, J. T.
  • Journal of Applied Physics, Vol. 79, Issue 12
  • DOI: 10.1063/1.362584

Growth and characterization of α and β -phase tungsten films on various substrates
journal, March 2016

  • Lee, Jeong-Seop; Cho, Jaehun; You, Chun-Yeol
  • Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films, Vol. 34, Issue 2
  • DOI: 10.1116/1.4936261

Ti segregation in regulating the stress and microstructure evolution in W-Ti nanocrystalline films
journal, August 2017

  • Kaub, Tyler; Thompson, Gregory B.
  • Journal of Applied Physics, Vol. 122, Issue 8
  • DOI: 10.1063/1.4991880

Past achievements and future challenges in the development of three-dimensional photonic metamaterials
journal, July 2011


FinFET-a self-aligned double-gate MOSFET scalable to 20 nm
journal, January 2000

  • Chenming Hu, ; Bokor, J.
  • IEEE Transactions on Electron Devices, Vol. 47, Issue 12
  • DOI: 10.1109/16.887014

Electromigration-induced stress in aluminum conductor lines measured by x-ray microdiffraction
journal, March 1998

  • Wang, P. -C.; Cargill, G. S.; Noyan, I. C.
  • Applied Physics Letters, Vol. 72, Issue 11
  • DOI: 10.1063/1.120604

Deformation Potentials and Mobilities in Non-Polar Crystals
journal, October 1950


Piezoresistance Effect in Germanium and Silicon
journal, April 1954


A Logic Nanotechnology Featuring Strained-Silicon
journal, April 2004

  • Thompson, S. E.; Armstrong, M.; Auth, C.
  • IEEE Electron Device Letters, Vol. 25, Issue 4
  • DOI: 10.1109/LED.2004.825195

Lattice strain analysis of transistor structures with silicon–germanium and silicon–carbon source∕drain stressors
journal, February 2005

  • Ang, Kah-Wee; Chui, King-Jien; Bliznetsov, Vladimir
  • Applied Physics Letters, Vol. 86, Issue 9
  • DOI: 10.1063/1.1871351

Effect of mechanical stress induced by etch-stop nitride: impact on deep-submicron transistor performance
journal, February 2002


Analysis of Bi-Metal Thermostats
journal, January 1925


Impact of Fin Doping and Gate Stack on FinFET (110) and (100) Electron and Hole Mobilities
journal, March 2012

  • Akarvardar, Kerem; Young, Chadwin D.; Baykan, Mehmet O.
  • IEEE Electron Device Letters, Vol. 33, Issue 3
  • DOI: 10.1109/LED.2011.2182603

Mechanical behavior of stressed films on anisotropic substrates
journal, November 2008

  • Murray, Conal E.; Saenger, K. L.
  • Journal of Applied Physics, Vol. 104, Issue 10
  • DOI: 10.1063/1.3020523

Process‐induced mechanical stress in isolation structures studied by micro‐Raman spectroscopy
journal, October 1993

  • De Wolf, I.; Norström, H.; Maes, H. E.
  • Journal of Applied Physics, Vol. 74, Issue 7
  • DOI: 10.1063/1.354365

Effects of laser-induced heating on Raman stress measurements of silicon and silicon-germanium structures
journal, June 2007

  • Georgi, Carsten; Hecker, Michael; Zschech, Ehrenfried
  • Journal of Applied Physics, Vol. 101, Issue 12
  • DOI: 10.1063/1.2743882

Direct Mapping of Strain in a Strained Silicon Transistor by High-Resolution Electron Microscopy
journal, April 2008


Microfabricated strained substrates for Ge epitaxial growth
journal, May 2005

  • Evans, P. G.; Rugheimer, P. P.; Lagally, M. G.
  • Journal of Applied Physics, Vol. 97, Issue 10
  • DOI: 10.1063/1.1894579

High-resolution strain mapping in heteroepitaxial thin-film features
journal, July 2005

  • Murray, C. E.; Yan, H. -F.; Noyan, I. C.
  • Journal of Applied Physics, Vol. 98, Issue 1
  • DOI: 10.1063/1.1938277

Submicron mapping of silicon-on-insulator strain distributions induced by stressed liner structures
journal, July 2008

  • Murray, Conal E.; Saenger, K. L.; Kalenci, O.
  • Journal of Applied Physics, Vol. 104, Issue 1
  • DOI: 10.1063/1.2952044

Mechanics of edge effects in anisotropic thin film∕substrate systems
journal, November 2006

  • Murray, Conal E.
  • Journal of Applied Physics, Vol. 100, Issue 10
  • DOI: 10.1063/1.2369642

Probing strain at the nanoscale with X-ray diffraction in microelectronic materials induced by stressor elements
journal, March 2013


Resistance Monitoring and Effects of Nonadhesion During Electromigration in Aluminum Films
journal, March 1968

  • Rosenberg, R.; Berenbaum, L.
  • Applied Physics Letters, Vol. 12, Issue 5
  • DOI: 10.1063/1.1651951

Effects of overlayers on electromigration reliability improvement for Cu/low K interconnects
conference, January 2004

  • Hu, C. -K.; Canaperi, D.; Chen, S. T.
  • 2004 IEEE International Reliability Physics Symposium. Proceedings
  • DOI: 10.1109/RELPHY.2004.1315327

Electromigration Cu mass flow in Cu interconnections
journal, May 2006


Stress gradients induced in Cu films by capping layers
journal, December 2008

  • Murray, Conal E.; Besser, Paul R.; Witt, Christian
  • Applied Physics Letters, Vol. 93, Issue 22
  • DOI: 10.1063/1.3035853

Surface Studies of Solids by Total Reflection of X-Rays
journal, July 1954


Evanescent absorption in kinematic surface Bragg diffraction
journal, February 1987


Strain distribution in thin aluminum films using x‐ray depth profiling
journal, January 1988

  • Doerner, M. F.; Brennan, S.
  • Journal of Applied Physics, Vol. 63, Issue 1
  • DOI: 10.1063/1.340503

Origin of stress gradients induced in capped, copper metallization
journal, February 2014


Optical and mechanical characterization of evaporated SiO_2 layers Long-term evolution
journal, January 1996


Stress in porous thin films through absorption of polar molecules (and relevance to optical coatings)
journal, November 1980


Mechanical Properties of Optical Dielectric Thin Films Deposited by the Ion Plating Technique
journal, January 1997

  • Mahodaux, Christine; Rigneault, Hervé; Giovannini, Hugues
  • Microscopy Microanalysis Microstructures, Vol. 8, Issue 4-5
  • DOI: 10.1051/mmm:1997120

The multilayer-modified Stoney’s formula for laminated polymer composites on a silicon substrate
journal, November 1999

  • Kim, Jin S.; Paik, Kyung W.; Oh, Seung H.
  • Journal of Applied Physics, Vol. 86, Issue 10
  • DOI: 10.1063/1.371548

Mechanical stress and thermal-elastic properties of oxide coatings for use in the deep-ultraviolet spectral region
journal, January 2002

  • Thielsch, Roland; Gatto, Alexandre; Kaiser, Norbert
  • Applied Optics, Vol. 41, Issue 16
  • DOI: 10.1364/AO.41.003211

Stability and performance of organic-inorganic thin films on polymer substrates
journal, March 2017


Influence of internal stress in optical thin films on their failure modes assessed by in situ real-time scratch analysis
journal, May 2017


The microstructure of sputter‐deposited coatings
journal, November 1986

  • Thornton, John A.
  • Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films, Vol. 4, Issue 6
  • DOI: 10.1116/1.573628

Revised structure zone model for thin film physical structure
journal, April 1984

  • Messier, R.; Giri, A. P.; Roy, R. A.
  • Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films, Vol. 2, Issue 2
  • DOI: 10.1116/1.572604

A structure zone diagram including plasma-based deposition and ion etching
journal, May 2010


Plasma deposition of low‐stress electret films for electroacoustic and solar cell applications
journal, September 1996

  • Klemberg‐Sapieha, J. E.; Martinu, L.; Wertheimer, M. R.
  • Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films, Vol. 14, Issue 5
  • DOI: 10.1116/1.580199

Interface engineering during plasma-enhanced chemical vapor deposition of porous/dense SiN1.3 optical multilayers
journal, December 2004


Fabrication and testing of nanoporous Si3N4 optical filters for gas sensing applications
journal, August 2013

  • Vernhes, R.; Klemberg-Sapieha, J. E.; Martinu, L.
  • Sensors and Actuators B: Chemical, Vol. 185
  • DOI: 10.1016/j.snb.2013.04.064

Properties and stability of diamond-like carbon films related to bonded and unbonded hydrogen
journal, April 1993


Formation and behavior of unbonded hydrogen in a-C:H of various compositions and densities
journal, September 2009


Mechanical characteristics of optical coatings prepared by various techniques: a comparative study
journal, January 2004

  • Klemberg-Sapieha, Jolanta E.; Oberste-Berghaus, Jörg; Martinu, Ludvik
  • Applied Optics, Vol. 43, Issue 13
  • DOI: 10.1364/AO.43.002670

Reactive HiPIMS deposition of SiO 2 /Ta 2 O 5 optical interference filters
journal, December 2014

  • Hála, Matěj; Vernhes, Richard; Zabeida, Oleg
  • Journal of Applied Physics, Vol. 116, Issue 21
  • DOI: 10.1063/1.4903285

Growth and properties of high index Ta2O5 optical coatings prepared by HiPIMS and other methods
journal, February 2014


Design and fabrication of stress-compensated optical coatings: Fabry–Perot filters for astronomical applications
journal, January 2014

  • de Denus-Baillargeon, Marie-Maude; Schmitt, Thomas; Larouche, Stéphane
  • Applied Optics, Vol. 53, Issue 12
  • DOI: 10.1364/AO.53.002616

Ultra-low-stress thin-film interference filters
journal, January 2006

  • Ockenfuss, Georg J.; Klinger, Robert E.
  • Applied Optics, Vol. 45, Issue 7
  • DOI: 10.1364/AO.45.001364

Rapid flash annealing of thermally reactive copolymers in a roll-to-roll process for polymer solar cells
journal, January 2012

  • Helgesen, Martin; Carlé, Jon Eggert; Andreasen, Birgitta
  • Polymer Chemistry, Vol. 3, Issue 9
  • DOI: 10.1039/c2py20429k

Thin-Film Permeation-Barrier Technology for Flexible Organic Light-Emitting Devices
journal, January 2004

  • Lewis, J.S.; Weaver, M.S.
  • IEEE Journal of Selected Topics in Quantum Electronics, Vol. 10, Issue 1, p. 45-57
  • DOI: 10.1109/JSTQE.2004.824072

Transparent thermoplastic polymers in plasma-assisted coating processes
journal, September 2003


Method for the Vacuum Deposition of Optical Coatings on Polymethyl Methacrylate
journal, April 2007

  • Munzert, Peter; Schulz, Ulrike; Kaiser, Norbert
  • Plasma Processes and Polymers, Vol. 4, Issue S1
  • DOI: 10.1002/ppap.200732401

Effect of process parameters on injection compression molding of pickup lens
journal, October 2005


Comparative study of ALD SiO_2 thin films for optical applications
journal, January 2016

  • Pfeiffer, Kristin; Shestaeva, Svetlana; Bingel, Astrid
  • Optical Materials Express, Vol. 6, Issue 2
  • DOI: 10.1364/OME.6.000660

Structure of the interfacial region between polycarbonate and plasma-deposited SiN1.3 and SiO2 optical coatings studied by ellipsometry
journal, November 1998

  • Bergeron, A.; Klemberg-Sapieha, J. E.; Martinu, L.
  • Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films, Vol. 16, Issue 6
  • DOI: 10.1116/1.581527

Tailoring the adhesion of optical films on polymethyl-methacrylate by plasma-induced surface stabilization
journal, April 2005

  • Klemberg-Sapieha, J. E.; Martinu, L.; Yamasaki, N. L. S.
  • Thin Solid Films, Vol. 476, Issue 1
  • DOI: 10.1016/j.tsf.2004.09.050

Effect of interface on the characteristics of functional films deposited on polycarbonate in dual-frequency plasma
journal, May 1997

  • Klemberg-Sapieha, J. E.; Poitras, D.; Martinu, L.
  • Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films, Vol. 15, Issue 3
  • DOI: 10.1116/1.580792

Deposition of wear resistant coatings based on diamond like carbon by unbalanced magnetron sputtering
journal, October 1993


Tribology of diamond-like carbon films: recent progress and future prospects
journal, September 2006


Tribological and electrical properties of metal‐containing hydrogenated carbon films
journal, April 1987

  • Dimigen, H.; Hübsch, H.; Memming, R.
  • Applied Physics Letters, Vol. 50, Issue 16
  • DOI: 10.1063/1.97968

Attaining High Levels of Bearing Performance with a Nanocomposite Diamond-Like Carbon Coating
journal, May 2013


Effects of normal and shear stresses in rolling and mixed mode contact on the micropitting wear of a WC/a-C:H tribological coating
journal, December 2015


Technical note: A gyro spin axis bearing performance using titanium carbide coated balls
journal, December 1987


Estimation of the Molecular Junction Temperatures in Four-Ball Contacts by Chemical Reaction Rate Studies
journal, January 1978


Wear-resistant hard titanium carbide coatings for space applications
journal, April 1990


Wear-resistant coatings for bearing applications
journal, June 1978


Properties and performance of chemical-vapour- deposited TiC-coated ball-bearing components
journal, October 1987


Residual stress measurement of refractory coatings as a nondestructive evaluation
journal, March 1985

  • Chollet, L.; Boving, H.; Hintermann, H. E.
  • Journal of Materials for Energy Systems, Vol. 6, Issue 4
  • DOI: 10.1007/BF02833519

Thermodynamics of deposition flux-dependent intrinsic film stress
journal, February 2016

  • Saedi, Amirmehdi; Rost, Marcel J.
  • Nature Communications, Vol. 7, Issue 1
  • DOI: 10.1038/ncomms10733

Correlation of shape changes of grain surfaces and reversible stress evolution during interruptions of polycrystalline film growth
journal, April 2014

  • Yu, Hang Z.; Thompson, Carl V.
  • Applied Physics Letters, Vol. 104, Issue 14
  • DOI: 10.1063/1.4871214

Size effect of thermal expansion and thermal/intrinsic stresses in nanostructured thin films: Experiment and model
journal, October 2011


Effects of oblique-angle deposition on intrinsic stress evolution during polycrystalline film growth
journal, September 2014


Compressive intrinsic stress originates in the grain boundaries of dense refractory polycrystalline thin films
journal, February 2016

  • Magnfält, D.; Fillon, A.; Boyd, R. D.
  • Journal of Applied Physics, Vol. 119, Issue 5
  • DOI: 10.1063/1.4941271

Influence of phase stability on the in situ growth stresses in Cu/Nb multilayered films
journal, June 2017


Investigations on macroscopic intrinsic stress in amorphous binary-alloy films
journal, January 1992


A comprehensive model of stress generation and relief processes in thin films deposited with energetic ions
journal, April 2006


Metal versus rare-gas ion irradiation during Ti 1− x Al x N film growth by hybrid high power pulsed magnetron/dc magnetron co-sputtering using synchronized pulsed substrate bias
journal, November 2012

  • Greczynski, Grzegorz; Lu, Jun; Jensen, Jens
  • Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films, Vol. 30, Issue 6
  • DOI: 10.1116/1.4750485

Benefits of energetic ion bombardment for tailoring stress and microstructural evolution during growth of Cu thin films
journal, December 2017


Self-Replicating Cracks: A Collaborative Fracture Mode in Thin Films
journal, August 2014


Telephone cord buckles—A relation between wavelength and adhesion
journal, February 2015

  • Faou, Jean-Yvon; Parry, Guillaume; Grachev, Sergey
  • Journal of the Mechanics and Physics of Solids, Vol. 75
  • DOI: 10.1016/j.jmps.2014.11.008

Mechanisms of reversible stretchability of thin metal films on elastomeric substrates
journal, May 2006

  • Lacour, Stephanie P.; Chan, Donald; Wagner, Sigurd
  • Applied Physics Letters, Vol. 88, Issue 20, Article No. 204103
  • DOI: 10.1063/1.2201874

Stretchable and Foldable Silicon Integrated Circuits
journal, April 2008


Cracking-assisted fabrication of nanoscale patterns for micro/nanotechnological applications
journal, January 2016

  • Kim, Minseok; Kim, Dong-Joo; Ha, Dogyeong
  • Nanoscale, Vol. 8, Issue 18
  • DOI: 10.1039/C5NR06266G

A new failure mechanism in thin film by collaborative fracture and delamination: Interacting duos of cracks
journal, November 2015

  • Marthelot, Joël; Bico, José; Melo, Francisco
  • Journal of the Mechanics and Physics of Solids, Vol. 84
  • DOI: 10.1016/j.jmps.2015.07.010

Mixed Mode Cracking in Layered Materials
book, January 1991


Growth and configurational stability of circular, buckling-driven film delaminations
journal, February 1992


How Does Adhesion Induce the Formation of Telephone Cord Buckles?
journal, March 2012


Works referencing / citing this record:

Structural and Thermal Characterisation of Nanofilms by Time-Resolved X-ray Scattering
journal, April 2019

  • Plech, Anton; Krause, Bärbel; Baumbach, Tilo
  • Nanomaterials, Vol. 9, Issue 4
  • DOI: 10.3390/nano9040501

Structural and Thermal Characterisation of Nanofilms by Time-Resolved X-ray Scattering
text, January 2019


The effect of kinetics on intrinsic stress generation and evolution in sputter-deposited films at conditions of high atomic mobility
journal, January 2020

  • Jamnig, A.; Pliatsikas, N.; Sarakinos, K.
  • Journal of Applied Physics, Vol. 127, Issue 4
  • DOI: 10.1063/1.5130148

Surface modification of Ti64-Alloy with silver silicon nitride thin films
journal, August 2019

  • Zaidi, Umi Zalilah; Mahmoodian, Reza; Bushroa, Abd Razak
  • Journal of Adhesion Science and Technology, Vol. 33, Issue 22
  • DOI: 10.1080/01694243.2019.1646462

Stress-tailoring magnetic anisotropy of V$_2$O$_3$/Ni bilayers
text, January 2021


2019 Topical Meeting on Optical Interference Coatings: Manufacturing Problem Contest [invited]
journal, December 2019

  • Poitras, Daniel; Li, Li; Jacobson, Michael R.
  • Applied Optics, Vol. 59, Issue 5
  • DOI: 10.1364/ao.59.000a31

Biofilm Rupture by Laser-Induced Stress Waves Increases with Loading Amplitude, Independent of Location
journal, February 2020

  • Kearns, Kaitlyn L.; Boyd, James D.; Grady, Martha E.
  • ACS Applied Bio Materials, Vol. 3, Issue 3
  • DOI: 10.1021/acsabm.9b01085

Understanding the microstructural evolution and mechanical properties of transparent Al-O-N and Al-Si-O-N films
journal, November 2019

  • Fischer, Maria; Trant, Mathis; Thorwarth, Kerstin
  • Science and Technology of Advanced Materials, Vol. 20, Issue 1
  • DOI: 10.1080/14686996.2019.1666425

Thin-film coating; historical evolution, conventional deposition technologies, stress-state micro/nano-level measurement/models and prospects projection: a critical review
journal, November 2019

  • Mbam, Stephen Ogbonna; Nwonu, Sunday Emmanuel; Orelaja, Oluseyi Adewale
  • Materials Research Express, Vol. 6, Issue 12
  • DOI: 10.1088/2053-1591/ab52cd

Understanding the microstructural evolution and mechanical properties of transparent Al-O-N and Al-Si-O-N films
text, January 2019


Adhesion properties of 2D materials
journal, July 2019

  • Megra, Yonas Tsegaye; Suk, Ji Won
  • Journal of Physics D: Applied Physics, Vol. 52, Issue 36
  • DOI: 10.1088/1361-6463/ab27ad

Cathode/Electrolyte Interface-Dependent Changes in Stress and Strain in Lithium Iron Phosphate Composite Cathodes
journal, January 2019

  • Bassett, Kimberly L.; Özgür Çapraz, Ö.; Özdogru, Bertan
  • Journal of The Electrochemical Society, Vol. 166, Issue 12
  • DOI: 10.1149/2.1391912jes

In situ XRD measurements to explore phase formation in the near surface region
journal, November 2019

  • Manova, Darina; Mändl, Stephan
  • Journal of Applied Physics, Vol. 126, Issue 20
  • DOI: 10.1063/1.5126636

Structural and Thermal Characterisation of Nanofilms by Time-Resolved X-ray Scattering
text, January 2019


High-performance thin-film optical filters with stress compensation
journal, January 2019

  • Begou, Thomas; Lemarchand, Fabien; Lemarquis, Frédéric
  • Journal of the Optical Society of America A, Vol. 36, Issue 11
  • DOI: 10.1364/josaa.36.00c113

In-situ studies of silicide formation during growth of molybdenum-silicon interfaces
journal, October 2019

  • Reinink, J.; Zameshin, A.; van de Kruijs, R. W. E.
  • Journal of Applied Physics, Vol. 126, Issue 13
  • DOI: 10.1063/1.5092876

Crystallization kinetics and role of stress in Al induced layer exchange crystallization process of amorphous SiGe thin film on glass
journal, September 2019

  • Sain, Twisha; Singh, Ch. Kishan; Ilango, S.
  • Journal of Applied Physics, Vol. 126, Issue 12
  • DOI: 10.1063/1.5115539

Understanding the microstructural evolution and mechanical properties of transparent Al-O-N and Al-Si-O-N films
text, January 2019


Ion energy control via the electrical asymmetry effect to tune coating properties in reactive radio frequency sputtering
journal, November 2019

  • Ries, Stefan; Banko, Lars; Hans, Marcus
  • Plasma Sources Science and Technology, Vol. 28, Issue 11
  • DOI: 10.1088/1361-6595/ab504b

Influence of the Thickness of a Nanolayer Composite Coating on Values of Residual Stress and the Nature of Coating Wear
journal, January 2020


Amorphous Silicon Self‐Rolling Micro Electromechanical Systems: From Residual Stress Control to Complex 3D Structures
journal, August 2019

  • Pinto, Rui M. R.; Chu, Virginia; Conde, João Pedro
  • Advanced Engineering Materials, Vol. 21, Issue 9
  • DOI: 10.1002/adem.201900663

Organ-on-e-chip: Three-dimensional self-rolled biosensor array for electrical interrogations of human electrogenic spheroids
journal, August 2019

  • Kalmykov, Anna; Huang, Changjin; Bliley, Jacqueline
  • Science Advances, Vol. 5, Issue 8
  • DOI: 10.1126/sciadv.aax0729

Meyer-Rod Coated 2D Single-Crystalline Copper Nanoplate Film with Intensive Pulsed Light for Flexible Electrode
journal, January 2020