skip to main content
DOE PAGES title logo U.S. Department of Energy
Office of Scientific and Technical Information

Title: Coefficient of thermal expansion and biaxial Young's modulus in Si-rich silicon nitride thin films

Authors:
 [1]
  1. Sandia National Laboratories, P. O Box 5800, MS1084, Albuquerque, New Mexico 87185
Publication Date:
Sponsoring Org.:
USDOE
OSTI Identifier:
1423386
Resource Type:
Publisher's Accepted Manuscript
Journal Name:
Journal of Vacuum Science and Technology A
Additional Journal Information:
Journal Name: Journal of Vacuum Science and Technology A Journal Volume: 36 Journal Issue: 2; Journal ID: ISSN 0734-2101
Publisher:
American Vacuum Society
Country of Publication:
United States
Language:
English

Citation Formats

Habermehl, Scott. Coefficient of thermal expansion and biaxial Young's modulus in Si-rich silicon nitride thin films. United States: N. p., 2018. Web. doi:10.1116/1.5020432.
Habermehl, Scott. Coefficient of thermal expansion and biaxial Young's modulus in Si-rich silicon nitride thin films. United States. doi:10.1116/1.5020432.
Habermehl, Scott. Thu . "Coefficient of thermal expansion and biaxial Young's modulus in Si-rich silicon nitride thin films". United States. doi:10.1116/1.5020432.
@article{osti_1423386,
title = {Coefficient of thermal expansion and biaxial Young's modulus in Si-rich silicon nitride thin films},
author = {Habermehl, Scott},
abstractNote = {},
doi = {10.1116/1.5020432},
journal = {Journal of Vacuum Science and Technology A},
number = 2,
volume = 36,
place = {United States},
year = {2018},
month = {3}
}

Journal Article:
Free Publicly Available Full Text
Publisher's Version of Record
DOI: 10.1116/1.5020432

Save / Share: