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Title: Coefficient of thermal expansion and biaxial Young's modulus in Si-rich silicon nitride thin films

Authors:
 [1]
  1. Sandia National Laboratories, P. O Box 5800, MS1084, Albuquerque, New Mexico 87185
Publication Date:
Type:
Publisher's Accepted Manuscript
Journal Name:
Journal of Vacuum Science and Technology. A, Vacuum, Surfaces and Films
Additional Journal Information:
Journal Name: Journal of Vacuum Science and Technology. A, Vacuum, Surfaces and Films Journal Volume: 36 Journal Issue: 2; Journal ID: ISSN 0734-2101
Publisher:
American Vacuum Society
Sponsoring Org:
USDOE
Country of Publication:
United States
Language:
English
OSTI Identifier:
1423386

Habermehl, Scott. Coefficient of thermal expansion and biaxial Young's modulus in Si-rich silicon nitride thin films. United States: N. p., Web. doi:10.1116/1.5020432.
Habermehl, Scott. Coefficient of thermal expansion and biaxial Young's modulus in Si-rich silicon nitride thin films. United States. doi:10.1116/1.5020432.
Habermehl, Scott. 2018. "Coefficient of thermal expansion and biaxial Young's modulus in Si-rich silicon nitride thin films". United States. doi:10.1116/1.5020432.
@article{osti_1423386,
title = {Coefficient of thermal expansion and biaxial Young's modulus in Si-rich silicon nitride thin films},
author = {Habermehl, Scott},
abstractNote = {},
doi = {10.1116/1.5020432},
journal = {Journal of Vacuum Science and Technology. A, Vacuum, Surfaces and Films},
number = 2,
volume = 36,
place = {United States},
year = {2018},
month = {3}
}