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This content will become publicly available on March 1, 2019

Title: Coefficient of thermal expansion and biaxial Young's modulus in Si-rich silicon nitride thin films

Authors:
 [1]
  1. Sandia National Laboratories, P. O Box 5800, MS1084, Albuquerque, New Mexico 87185
Publication Date:
Type:
Publisher's Accepted Manuscript
Journal Name:
Journal of Vacuum Science and Technology. A, Vacuum, Surfaces and Films
Additional Journal Information:
Journal Volume: 36; Journal Issue: 2; Related Information: CHORUS Timestamp: 2018-03-01 09:40:13; Journal ID: ISSN 0734-2101
Publisher:
American Vacuum Society
Sponsoring Org:
USDOE
Country of Publication:
United States
Language:
English
OSTI Identifier:
1423386