Coefficient of thermal expansion and biaxial Young's modulus in Si-rich silicon nitride thin films
- Authors:
-
- Sandia National Laboratories, P. O Box 5800, MS1084, Albuquerque, New Mexico 87185
- Publication Date:
- Sponsoring Org.:
- USDOE
- OSTI Identifier:
- 1423386
- Resource Type:
- Publisher's Accepted Manuscript
- Journal Name:
- Journal of Vacuum Science and Technology A
- Additional Journal Information:
- Journal Name: Journal of Vacuum Science and Technology A Journal Volume: 36 Journal Issue: 2; Journal ID: ISSN 0734-2101
- Publisher:
- American Vacuum Society
- Country of Publication:
- United States
- Language:
- English
Citation Formats
Habermehl, Scott. Coefficient of thermal expansion and biaxial Young's modulus in Si-rich silicon nitride thin films. United States: N. p., 2018.
Web. doi:10.1116/1.5020432.
Habermehl, Scott. Coefficient of thermal expansion and biaxial Young's modulus in Si-rich silicon nitride thin films. United States. https://doi.org/10.1116/1.5020432
Habermehl, Scott. Thu .
"Coefficient of thermal expansion and biaxial Young's modulus in Si-rich silicon nitride thin films". United States. https://doi.org/10.1116/1.5020432.
@article{osti_1423386,
title = {Coefficient of thermal expansion and biaxial Young's modulus in Si-rich silicon nitride thin films},
author = {Habermehl, Scott},
abstractNote = {},
doi = {10.1116/1.5020432},
journal = {Journal of Vacuum Science and Technology A},
number = 2,
volume = 36,
place = {United States},
year = {2018},
month = {3}
}
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https://doi.org/10.1116/1.5020432
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