Coefficient of thermal expansion and biaxial Young's modulus in Si-rich silicon nitride thin films

Habermehl, Scott

doi:10.1116/1.5020432

Title: Coefficient of thermal expansion and biaxial Young's modulus in Si-rich silicon nitride thin films

Journal Article · 01 March 2018 · Journal of Vacuum Science and Technology A

DOI: https://doi.org/10.1116/1.5020432 · OSTI ID:1423386

Habermehl, Scott ^[1]

Sandia National Laboratories, P. O Box 5800, MS1084, Albuquerque, New Mexico 87185

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Sponsoring Organization:: USDOE

OSTI ID:: 1423386

Journal Information:: Journal of Vacuum Science and Technology A, Journal Name: Journal of Vacuum Science and Technology A Vol. 36 Journal Issue: 2; ISSN 0734-2101

Publisher:: American Vacuum SocietyCopyright Statement

Country of Publication:: United States

Language:: English

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