Reflow-oven-processing of pressureless sintered-silver interconnects
Abstract
Here, a method was developed to pressurelessly fabricate strong and consistent sinterable-silver joints or interconnects using reflow oven heating. Circular sinterable-silver interconnects, having nominal diameter of 5 mm and 0.1 mm thickness were stencil printed, contact-dried, and then pressurelessly sinter-bonded to Au-plated direct copper bonded ceramic substrates at 250 °C in ambient air. That sintering was done in either a reflow oven or a convective oven (latter being a conventional heating source for processing sinterable-silver). Consistently strong (>40 MPa) interconnects were produced with reflow oven heating and were as strong as those produced with convective oven heating. This is significant because reflow oven technology affords better potential for continuous mass production and it was shown that strong sintered-silver bonds can indeed be achieved with its use.
- Authors:
-
[2]
- Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States)
- Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States); Oak Ridge Associated Univ., Oak Ridge, TN (United States)
- Publication Date:
- Research Org.:
- Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States)
- Sponsoring Org.:
- USDOE Office of Energy Efficiency and Renewable Energy (EERE), Vehicle Technologies Office (EE-3V)
- OSTI Identifier:
- 1423101
- Grant/Contract Number:
- AC05-00OR22725
- Resource Type:
- Accepted Manuscript
- Journal Name:
- Journal of Materials Processing Technology
- Additional Journal Information:
- Journal Volume: 255; Journal Issue: C; Journal ID: ISSN 0924-0136
- Publisher:
- Elsevier
- Country of Publication:
- United States
- Language:
- English
- Subject:
- 36 MATERIALS SCIENCE; Sintered-silver interconnects; Pressureless sintering; Reflow oven processing
Citation Formats
Wereszczak, Andrew A., Chen, Branndon R., and Oistad, Brian A. Reflow-oven-processing of pressureless sintered-silver interconnects. United States: N. p., 2018.
Web. doi:10.1016/j.jmatprotec.2018.01.001.
Wereszczak, Andrew A., Chen, Branndon R., & Oistad, Brian A. Reflow-oven-processing of pressureless sintered-silver interconnects. United States. https://doi.org/10.1016/j.jmatprotec.2018.01.001
Wereszczak, Andrew A., Chen, Branndon R., and Oistad, Brian A. Thu .
"Reflow-oven-processing of pressureless sintered-silver interconnects". United States. https://doi.org/10.1016/j.jmatprotec.2018.01.001. https://www.osti.gov/servlets/purl/1423101.
@article{osti_1423101,
title = {Reflow-oven-processing of pressureless sintered-silver interconnects},
author = {Wereszczak, Andrew A. and Chen, Branndon R. and Oistad, Brian A.},
abstractNote = {Here, a method was developed to pressurelessly fabricate strong and consistent sinterable-silver joints or interconnects using reflow oven heating. Circular sinterable-silver interconnects, having nominal diameter of 5 mm and 0.1 mm thickness were stencil printed, contact-dried, and then pressurelessly sinter-bonded to Au-plated direct copper bonded ceramic substrates at 250 °C in ambient air. That sintering was done in either a reflow oven or a convective oven (latter being a conventional heating source for processing sinterable-silver). Consistently strong (>40 MPa) interconnects were produced with reflow oven heating and were as strong as those produced with convective oven heating. This is significant because reflow oven technology affords better potential for continuous mass production and it was shown that strong sintered-silver bonds can indeed be achieved with its use.},
doi = {10.1016/j.jmatprotec.2018.01.001},
journal = {Journal of Materials Processing Technology},
number = C,
volume = 255,
place = {United States},
year = {Thu Jan 04 00:00:00 EST 2018},
month = {Thu Jan 04 00:00:00 EST 2018}
}
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Cited by: 5 works
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Figures / Tables:
Figure 1.: Schematic of the contact-drying of the printed silver pad. Red and white arrows represent direction and location of heating, and direction and location of the solvent evaporation, respectively.
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Works referenced in this record:
Review on Joint Shear Strength of Nano-Silver Paste and Its Long-Term High Temperature Reliability
journal, May 2014
- Khazaka, R.; Mendizabal, L.; Henry, D.
- Journal of Electronic Materials, Vol. 43, Issue 7
Effect of interconnection area on shear strength of sintered joint with nano‐silver paste
journal, February 2008
- Qi, Kun; Chen, Xu; Lu, Guo‐Quan
- Soldering & Surface Mount Technology, Vol. 20, Issue 1
Are Sintered Silver Joints Ready for Use as Interconnect Material in Microelectronic Packaging?
journal, January 2014
- Siow, Kim S.
- Journal of Electronic Materials, Vol. 43, Issue 4
Uniqueness and Challenges of Sintered Silver as a Bonded Interface Material
journal, October 2014
- Wereszczak, A. A.; Liang, Z.; Ferber, M. K.
- Journal of Microelectronics and Electronic Packaging, Vol. 11, Issue 4
Works referencing / citing this record:
Failure stress comparison of different pairings of Ag-plating and reflow-oven-processed pressureless-sintered-Ag interconnects
journal, October 2018
- Wereszczak, Andrew A.; Chen, Branndon R.; Oistad, Brian A.
- Journal of Materials Science: Materials in Electronics, Vol. 29, Issue 23
Figures / Tables found in this record:
Figures/Tables have been extracted from DOE-funded journal article accepted manuscripts.