50-GHz-spaced comb of high-dimensional frequency-bin entangled photons from an on-chip silicon nitride microresonator
Abstract
Quantum frequency combs from chip-scale integrated sources are promising candidates for scalable and robust quantum information processing (QIP). However, to use these quantum combs for frequency domain QIP, demonstration of entanglement in the frequency basis, showing that the entangled photons are in a coherent superposition of multiple frequency bins, is required. We present a verification of qubit and qutrit frequency-bin entanglement using an on-chip quantum frequency comb with 40 mode pairs, through a two-photon interference measurement that is based on electro-optic phase modulation. Our demonstrations provide an important contribution in establishing integrated optical microresonators as a source for high-dimensional frequency-bin encoded quantum computing, as well as dense quantum key distribution.
- Authors:
- Publication Date:
- Research Org.:
- Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States)
- Sponsoring Org.:
- USDOE
- OSTI Identifier:
- 1417425
- Alternate Identifier(s):
- OSTI ID: 1422582
- Grant/Contract Number:
- AC05-00OR22725
- Resource Type:
- Published Article
- Journal Name:
- Optics Express
- Additional Journal Information:
- Journal Name: Optics Express Journal Volume: 26 Journal Issue: 2; Journal ID: ISSN 1094-4087
- Publisher:
- Optical Society of America
- Country of Publication:
- United States
- Language:
- English
- Subject:
- 97 MATHEMATICS AND COMPUTING; 36 MATERIALS SCIENCE; Quantum optics; Quantum information and processing; Nonlinear optics; parametric processes
Citation Formats
Imany, Poolad, Jaramillo-Villegas, Jose A., Odele, Ogaga D., Han, Kyunghun, Leaird, Daniel E., Lukens, Joseph M., Lougovski, Pavel, Qi, Minghao, and Weiner, Andrew M. 50-GHz-spaced comb of high-dimensional frequency-bin entangled photons from an on-chip silicon nitride microresonator. United States: N. p., 2018.
Web. doi:10.1364/OE.26.001825.
Imany, Poolad, Jaramillo-Villegas, Jose A., Odele, Ogaga D., Han, Kyunghun, Leaird, Daniel E., Lukens, Joseph M., Lougovski, Pavel, Qi, Minghao, & Weiner, Andrew M. 50-GHz-spaced comb of high-dimensional frequency-bin entangled photons from an on-chip silicon nitride microresonator. United States. https://doi.org/10.1364/OE.26.001825
Imany, Poolad, Jaramillo-Villegas, Jose A., Odele, Ogaga D., Han, Kyunghun, Leaird, Daniel E., Lukens, Joseph M., Lougovski, Pavel, Qi, Minghao, and Weiner, Andrew M. Thu .
"50-GHz-spaced comb of high-dimensional frequency-bin entangled photons from an on-chip silicon nitride microresonator". United States. https://doi.org/10.1364/OE.26.001825.
@article{osti_1417425,
title = {50-GHz-spaced comb of high-dimensional frequency-bin entangled photons from an on-chip silicon nitride microresonator},
author = {Imany, Poolad and Jaramillo-Villegas, Jose A. and Odele, Ogaga D. and Han, Kyunghun and Leaird, Daniel E. and Lukens, Joseph M. and Lougovski, Pavel and Qi, Minghao and Weiner, Andrew M.},
abstractNote = {Quantum frequency combs from chip-scale integrated sources are promising candidates for scalable and robust quantum information processing (QIP). However, to use these quantum combs for frequency domain QIP, demonstration of entanglement in the frequency basis, showing that the entangled photons are in a coherent superposition of multiple frequency bins, is required. We present a verification of qubit and qutrit frequency-bin entanglement using an on-chip quantum frequency comb with 40 mode pairs, through a two-photon interference measurement that is based on electro-optic phase modulation. Our demonstrations provide an important contribution in establishing integrated optical microresonators as a source for high-dimensional frequency-bin encoded quantum computing, as well as dense quantum key distribution.},
doi = {10.1364/OE.26.001825},
journal = {Optics Express},
number = 2,
volume = 26,
place = {United States},
year = {Thu Jan 18 00:00:00 EST 2018},
month = {Thu Jan 18 00:00:00 EST 2018}
}
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https://doi.org/10.1364/OE.26.001825
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