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Title: Role of neutral transport in aspect ratio dependent plasma etching of three-dimensional features

Authors:
 [1] ;  [2] ;  [2] ;  [2] ;  [1]
  1. Department of Electrical Engineering and Computer Science, University of Michigan, 1301 Beal Ave., Ann Arbor, Michigan 48109-2122
  2. Lam Research Corp., 4650 Cushing Parkway, Fremont, California 94538
Publication Date:
Grant/Contract Number:
SC000319
Type:
Publisher's Accepted Manuscript
Journal Name:
Journal of Vacuum Science and Technology. A, Vacuum, Surfaces and Films
Additional Journal Information:
Journal Name: Journal of Vacuum Science and Technology. A, Vacuum, Surfaces and Films Journal Volume: 35 Journal Issue: 5; Journal ID: ISSN 0734-2101
Publisher:
American Vacuum Society
Sponsoring Org:
USDOE
Country of Publication:
United States
Language:
English
OSTI Identifier:
1420714

Huard, Chad M., Zhang, Yiting, Sriraman, Saravanapriyan, Paterson, Alex, and Kushner, Mark J.. Role of neutral transport in aspect ratio dependent plasma etching of three-dimensional features. United States: N. p., Web. doi:10.1116/1.4973953.
Huard, Chad M., Zhang, Yiting, Sriraman, Saravanapriyan, Paterson, Alex, & Kushner, Mark J.. Role of neutral transport in aspect ratio dependent plasma etching of three-dimensional features. United States. doi:10.1116/1.4973953.
Huard, Chad M., Zhang, Yiting, Sriraman, Saravanapriyan, Paterson, Alex, and Kushner, Mark J.. 2017. "Role of neutral transport in aspect ratio dependent plasma etching of three-dimensional features". United States. doi:10.1116/1.4973953.
@article{osti_1420714,
title = {Role of neutral transport in aspect ratio dependent plasma etching of three-dimensional features},
author = {Huard, Chad M. and Zhang, Yiting and Sriraman, Saravanapriyan and Paterson, Alex and Kushner, Mark J.},
abstractNote = {},
doi = {10.1116/1.4973953},
journal = {Journal of Vacuum Science and Technology. A, Vacuum, Surfaces and Films},
number = 5,
volume = 35,
place = {United States},
year = {2017},
month = {9}
}