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Title: Impact of deposition rate, underlayers, and substrates on β-tungsten formation in sputter deposited films

Authors:
 [1] ;  [1]
  1. Department of Applied Physics and Applied Mathematics, Columbia University, New York, New York 10027
Publication Date:
Grant/Contract Number:
SC0012704
Type:
Publisher's Accepted Manuscript
Journal Name:
Journal of Vacuum Science and Technology. A, Vacuum, Surfaces and Films
Additional Journal Information:
Journal Name: Journal of Vacuum Science and Technology. A, Vacuum, Surfaces and Films Journal Volume: 35 Journal Issue: 6; Journal ID: ISSN 0734-2101
Publisher:
American Vacuum Society
Sponsoring Org:
USDOE
Country of Publication:
United States
Language:
English
OSTI Identifier:
1420471

Barmak, Katayun, and Liu, Jiaxing. Impact of deposition rate, underlayers, and substrates on β-tungsten formation in sputter deposited films. United States: N. p., Web. doi:10.1116/1.5003628.
Barmak, Katayun, & Liu, Jiaxing. Impact of deposition rate, underlayers, and substrates on β-tungsten formation in sputter deposited films. United States. doi:10.1116/1.5003628.
Barmak, Katayun, and Liu, Jiaxing. 2017. "Impact of deposition rate, underlayers, and substrates on β-tungsten formation in sputter deposited films". United States. doi:10.1116/1.5003628.
@article{osti_1420471,
title = {Impact of deposition rate, underlayers, and substrates on β-tungsten formation in sputter deposited films},
author = {Barmak, Katayun and Liu, Jiaxing},
abstractNote = {},
doi = {10.1116/1.5003628},
journal = {Journal of Vacuum Science and Technology. A, Vacuum, Surfaces and Films},
number = 6,
volume = 35,
place = {United States},
year = {2017},
month = {11}
}