Structure and electrochemical properties of copper wires with seamless 1D nanostructures
- Authors:
- Publication Date:
- Sponsoring Org.:
- USDOE
- OSTI Identifier:
- 1419579
- Resource Type:
- Published Article
- Journal Name:
- Data in Brief
- Additional Journal Information:
- Journal Name: Data in Brief; Journal ID: ISSN 2352-3409
- Publisher:
- Elsevier
- Country of Publication:
- United States
- Language:
- English
Citation Formats
Wu, Yutong, Gao, Meiqi, Li, Song, Ren, Yuping, and Qin, Gaowu. Structure and electrochemical properties of copper wires with seamless 1D nanostructures. United States: N. p., 2018.
Web. doi:10.1016/j.dib.2018.01.097.
Wu, Yutong, Gao, Meiqi, Li, Song, Ren, Yuping, & Qin, Gaowu. Structure and electrochemical properties of copper wires with seamless 1D nanostructures. United States. https://doi.org/10.1016/j.dib.2018.01.097
Wu, Yutong, Gao, Meiqi, Li, Song, Ren, Yuping, and Qin, Gaowu. Thu .
"Structure and electrochemical properties of copper wires with seamless 1D nanostructures". United States. https://doi.org/10.1016/j.dib.2018.01.097.
@article{osti_1419579,
title = {Structure and electrochemical properties of copper wires with seamless 1D nanostructures},
author = {Wu, Yutong and Gao, Meiqi and Li, Song and Ren, Yuping and Qin, Gaowu},
abstractNote = {},
doi = {10.1016/j.dib.2018.01.097},
journal = {Data in Brief},
number = ,
volume = ,
place = {United States},
year = {2018},
month = {2}
}
Free Publicly Available Full Text
Publisher's Version of Record
https://doi.org/10.1016/j.dib.2018.01.097
https://doi.org/10.1016/j.dib.2018.01.097
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