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Title: Platinum Electrodeposition for Supported ALD Templated Foam Hohlraum Liners

Abstract

Two commercially available platinum plating solutions (Platanex III and Platanex Luna) were evaluated for the electrodeposition of platinum layers on gold hohlraums and cylindrically shaped silver-gold ingots. The successful deposition of thin Pt layers on gold hohlraums as well as thick Pt layers on silver-gold alloys will allow for the integration of atomic layer deposition templated foam inside a hohlraum. We found that when the manufacturer’s recommendations for the Pt plating solutions were used, the coatings obtained were unacceptable because of cracking, poor adhesion, or thin and powdery Pt deposits. Therefore, alternative plating parameters were investigated, and the conditions resulting in acceptable coatings are reported here.

Authors:
ORCiD logo [1];  [1];  [1];  [1];  [1];  [1]
  1. Lawrence Livermore National Lab. (LLNL), Livermore, CA (United States)
Publication Date:
Research Org.:
Lawrence Livermore National Lab. (LLNL), Livermore, CA (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
1417270
Report Number(s):
LLNL-JRNL-734851
Journal ID: ISSN 1536-1055; TRN: US1801014
Grant/Contract Number:  
AC52-07NA27344
Resource Type:
Accepted Manuscript
Journal Name:
Fusion Science and Technology
Additional Journal Information:
Journal Volume: 73; Journal Issue: 2; Journal ID: ISSN 1536-1055
Publisher:
American Nuclear Society
Country of Publication:
United States
Language:
English
Subject:
36 MATERIALS SCIENCE; 70 PLASMA PHYSICS AND FUSION; Metal electrodeposition; platinum electroforming; templated atomic layer deposition foams

Citation Formats

Horwood, Corie, Stadermann, Michael, Biener, Monika, Bennett, Don, Bhandarkar, Suhas, and Bunn, Thomas L. Platinum Electrodeposition for Supported ALD Templated Foam Hohlraum Liners. United States: N. p., 2017. Web. doi:10.1080/15361055.2017.1387456.
Horwood, Corie, Stadermann, Michael, Biener, Monika, Bennett, Don, Bhandarkar, Suhas, & Bunn, Thomas L. Platinum Electrodeposition for Supported ALD Templated Foam Hohlraum Liners. United States. doi:10.1080/15361055.2017.1387456.
Horwood, Corie, Stadermann, Michael, Biener, Monika, Bennett, Don, Bhandarkar, Suhas, and Bunn, Thomas L. Wed . "Platinum Electrodeposition for Supported ALD Templated Foam Hohlraum Liners". United States. doi:10.1080/15361055.2017.1387456. https://www.osti.gov/servlets/purl/1417270.
@article{osti_1417270,
title = {Platinum Electrodeposition for Supported ALD Templated Foam Hohlraum Liners},
author = {Horwood, Corie and Stadermann, Michael and Biener, Monika and Bennett, Don and Bhandarkar, Suhas and Bunn, Thomas L.},
abstractNote = {Two commercially available platinum plating solutions (Platanex III and Platanex Luna) were evaluated for the electrodeposition of platinum layers on gold hohlraums and cylindrically shaped silver-gold ingots. The successful deposition of thin Pt layers on gold hohlraums as well as thick Pt layers on silver-gold alloys will allow for the integration of atomic layer deposition templated foam inside a hohlraum. We found that when the manufacturer’s recommendations for the Pt plating solutions were used, the coatings obtained were unacceptable because of cracking, poor adhesion, or thin and powdery Pt deposits. Therefore, alternative plating parameters were investigated, and the conditions resulting in acceptable coatings are reported here.},
doi = {10.1080/15361055.2017.1387456},
journal = {Fusion Science and Technology},
number = 2,
volume = 73,
place = {United States},
year = {2017},
month = {12}
}

Journal Article:
Free Publicly Available Full Text
Publisher's Version of Record

Figures / Tables:

Figure 1 Figure 1: Using Platanex III electroplating solution: (a) Dark, powdery Pt deposit on copper foil using manufacturer’s recommended operating procedures, (b) Bright, shiny Pt deposit on copper rod using modified operating procedures, (c) SEM showing developing cracks in 20-μm thick Pt coating, (d) Pt deposited on a flat Ag-Au (70-30more » at%) ingot is highly stressed and does not adhere well.« less

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