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Title: Engineered Elastomer Substrates for Guided Assembly of Complex 3D Mesostructures by Spatially Nonuniform Compressive Buckling

Abstract

Approaches capable of creating 3D mesostructures in advanced materials (device-grade semiconductors, electroactive polymers, etc.) are of increasing interest in modern materials research. A versatile set of approaches exploits transformation of planar precursors into 3D architectures through the action of compressive forces associated with release of prestrain in a supporting elastomer substrate. Although a diverse set of 3D structures can be realized in nearly any class of material in this way, all previously reported demonstrations lack the ability to vary the degree of compression imparted to different regions of the 2D precursor, thus constraining the diversity of 3D geometries. This paper presents a set of ideas in materials and mechanics in which elastomeric substrates with engineered distributions of thickness yield desired strain distributions for targeted control over resultant 3D mesostructures geometries. This approach is compatible with a broad range of advanced functional materials from device-grade semiconductors to commercially available thin films, over length scales from tens of micrometers to several millimeters. A large range of 3D structures can be produced in this way, some of which have direct relevance to applications in tunable optics and stretchable electronics.

Authors:
 [1];  [2];  [1];  [1];  [1];  [3];  [1];  [4];  [1];  [2];  [1];  [5];  [2];  [2];  [6];  [1]
  1. Univ. of Illinois at Urbana-Champaign, IL (United States). Dept. of Materials Science and Engineering
  2. Northwestern Univ., Evanston, IL (United States)
  3. Northwestern Univ., Evanston, IL (United States); Tsinghua Univ., Beijing (China)
  4. Peking Univ., Beijing (China)
  5. Univ. of Illinois at Urbana-Champaign, IL (United States)
  6. Tsinghua Univ., Beijing (China)
Publication Date:
Research Org.:
Univ. of Illinois at Urbana-Champaign, IL (United States)
Sponsoring Org.:
USDOE Office of Science (SC)
OSTI Identifier:
1533011
Alternate Identifier(s):
OSTI ID: 1401023
Grant/Contract Number:  
FG02-07ER46471
Resource Type:
Accepted Manuscript
Journal Name:
Advanced Functional Materials
Additional Journal Information:
Journal Volume: 27; Journal Issue: 1; Journal ID: ISSN 1616-301X
Publisher:
Wiley
Country of Publication:
United States
Language:
English
Subject:
36 MATERIALS SCIENCE; chemistry; science & technology; materials science; physics; 3D mesostructures; compressive buckling; soft elastomers; strain engineering

Citation Formats

Nan, Kewang, Luan, Haiwen, Yan, Zheng, Ning, Xin, Wang, Yiqi, Wang, Ao, Wang, Juntong, Han, Mengdi, Chang, Matthew, Li, Kan, Zhang, Yutong, Huang, Wen, Xue, Yeguang, Huang, Yonggang, Zhang, Yihui, and Rogers, John A. Engineered Elastomer Substrates for Guided Assembly of Complex 3D Mesostructures by Spatially Nonuniform Compressive Buckling. United States: N. p., 2016. Web. doi:10.1002/adfm.201604281.
Nan, Kewang, Luan, Haiwen, Yan, Zheng, Ning, Xin, Wang, Yiqi, Wang, Ao, Wang, Juntong, Han, Mengdi, Chang, Matthew, Li, Kan, Zhang, Yutong, Huang, Wen, Xue, Yeguang, Huang, Yonggang, Zhang, Yihui, & Rogers, John A. Engineered Elastomer Substrates for Guided Assembly of Complex 3D Mesostructures by Spatially Nonuniform Compressive Buckling. United States. https://doi.org/10.1002/adfm.201604281
Nan, Kewang, Luan, Haiwen, Yan, Zheng, Ning, Xin, Wang, Yiqi, Wang, Ao, Wang, Juntong, Han, Mengdi, Chang, Matthew, Li, Kan, Zhang, Yutong, Huang, Wen, Xue, Yeguang, Huang, Yonggang, Zhang, Yihui, and Rogers, John A. Wed . "Engineered Elastomer Substrates for Guided Assembly of Complex 3D Mesostructures by Spatially Nonuniform Compressive Buckling". United States. https://doi.org/10.1002/adfm.201604281. https://www.osti.gov/servlets/purl/1533011.
@article{osti_1533011,
title = {Engineered Elastomer Substrates for Guided Assembly of Complex 3D Mesostructures by Spatially Nonuniform Compressive Buckling},
author = {Nan, Kewang and Luan, Haiwen and Yan, Zheng and Ning, Xin and Wang, Yiqi and Wang, Ao and Wang, Juntong and Han, Mengdi and Chang, Matthew and Li, Kan and Zhang, Yutong and Huang, Wen and Xue, Yeguang and Huang, Yonggang and Zhang, Yihui and Rogers, John A.},
abstractNote = {Approaches capable of creating 3D mesostructures in advanced materials (device-grade semiconductors, electroactive polymers, etc.) are of increasing interest in modern materials research. A versatile set of approaches exploits transformation of planar precursors into 3D architectures through the action of compressive forces associated with release of prestrain in a supporting elastomer substrate. Although a diverse set of 3D structures can be realized in nearly any class of material in this way, all previously reported demonstrations lack the ability to vary the degree of compression imparted to different regions of the 2D precursor, thus constraining the diversity of 3D geometries. This paper presents a set of ideas in materials and mechanics in which elastomeric substrates with engineered distributions of thickness yield desired strain distributions for targeted control over resultant 3D mesostructures geometries. This approach is compatible with a broad range of advanced functional materials from device-grade semiconductors to commercially available thin films, over length scales from tens of micrometers to several millimeters. A large range of 3D structures can be produced in this way, some of which have direct relevance to applications in tunable optics and stretchable electronics.},
doi = {10.1002/adfm.201604281},
journal = {Advanced Functional Materials},
number = 1,
volume = 27,
place = {United States},
year = {Wed Nov 02 00:00:00 EDT 2016},
month = {Wed Nov 02 00:00:00 EDT 2016}
}

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