Brazed Carbon Nanotube Arrays: Decoupling Thermal Conductance and Mechanical Rigidity
Abstract
Bonding two solids at their interface is the most effective way to achieve a mechanically robust and thermally conducting interface. However, for high‐temperature applications, bonded interfaces between dissimilar materials experience high thermomechanical stress that degrades their performance in terms of cyclic stability (under thermal load) and lifetime. The present study shows that integrating a carbon nanotube (CNT) array as a stress‐relief element to a traditional braze joint mitigates the adverse effects of thermomechanical stress while preserving mechanical robustness and excellent heat transfer characteristic at the interface. A substantial reduction in total thermal interface resistance is achieved (from 41 mm 2 K W −1 for bare CNT array to less than 3 mm 2 K W −1 for a CNT array integrated with braze alloy). A brazed metal/insulator interface (between Cu and quartz) with a CNT array between them exhibits low thermal interface resistance even after extreme thermal cycling whereas the same interface delaminates readily when brazed without a CNT array. The reported technique provides a promising route for substantially improving the problematic high‐temperature interface, a major hindrance in achieving stable and efficient operation for systems such as thermoelectric generators that operate at elevated temperatures (above 400 °C).
- Authors:
-
- School of Mechanical Engineering Purdue University West Lafayette IN 47907 USA, Birck Nanotechnology Center Purdue University West Lafayette IN 47907 USA
- Birck Nanotechnology Center Purdue University West Lafayette IN 47907 USA
- School of Mechanical Engineering Purdue University West Lafayette IN 47907 USA, Birck Nanotechnology Center Purdue University West Lafayette IN 47907 USA, State Key Laboratory of Powder Metallurgy Central South University Changsha 410083 China
- Publication Date:
- Sponsoring Org.:
- USDOE
- OSTI Identifier:
- 1400814
- Resource Type:
- Publisher's Accepted Manuscript
- Journal Name:
- Advanced Materials Interfaces
- Additional Journal Information:
- Journal Name: Advanced Materials Interfaces Journal Volume: 4 Journal Issue: 5; Journal ID: ISSN 2196-7350
- Publisher:
- Wiley Blackwell (John Wiley & Sons)
- Country of Publication:
- Germany
- Language:
- English
Citation Formats
Hao, Menglong, Kumar, Anurag, Hodson, Stephen L., Zemlyanov, Dmitry, He, Pingge, and Fisher, Timothy S. Brazed Carbon Nanotube Arrays: Decoupling Thermal Conductance and Mechanical Rigidity. Germany: N. p., 2017.
Web. doi:10.1002/admi.201601042.
Hao, Menglong, Kumar, Anurag, Hodson, Stephen L., Zemlyanov, Dmitry, He, Pingge, & Fisher, Timothy S. Brazed Carbon Nanotube Arrays: Decoupling Thermal Conductance and Mechanical Rigidity. Germany. https://doi.org/10.1002/admi.201601042
Hao, Menglong, Kumar, Anurag, Hodson, Stephen L., Zemlyanov, Dmitry, He, Pingge, and Fisher, Timothy S. Fri .
"Brazed Carbon Nanotube Arrays: Decoupling Thermal Conductance and Mechanical Rigidity". Germany. https://doi.org/10.1002/admi.201601042.
@article{osti_1400814,
title = {Brazed Carbon Nanotube Arrays: Decoupling Thermal Conductance and Mechanical Rigidity},
author = {Hao, Menglong and Kumar, Anurag and Hodson, Stephen L. and Zemlyanov, Dmitry and He, Pingge and Fisher, Timothy S.},
abstractNote = {Bonding two solids at their interface is the most effective way to achieve a mechanically robust and thermally conducting interface. However, for high‐temperature applications, bonded interfaces between dissimilar materials experience high thermomechanical stress that degrades their performance in terms of cyclic stability (under thermal load) and lifetime. The present study shows that integrating a carbon nanotube (CNT) array as a stress‐relief element to a traditional braze joint mitigates the adverse effects of thermomechanical stress while preserving mechanical robustness and excellent heat transfer characteristic at the interface. A substantial reduction in total thermal interface resistance is achieved (from 41 mm 2 K W −1 for bare CNT array to less than 3 mm 2 K W −1 for a CNT array integrated with braze alloy). A brazed metal/insulator interface (between Cu and quartz) with a CNT array between them exhibits low thermal interface resistance even after extreme thermal cycling whereas the same interface delaminates readily when brazed without a CNT array. The reported technique provides a promising route for substantially improving the problematic high‐temperature interface, a major hindrance in achieving stable and efficient operation for systems such as thermoelectric generators that operate at elevated temperatures (above 400 °C).},
doi = {10.1002/admi.201601042},
journal = {Advanced Materials Interfaces},
number = 5,
volume = 4,
place = {Germany},
year = {Fri Jan 27 00:00:00 EST 2017},
month = {Fri Jan 27 00:00:00 EST 2017}
}
https://doi.org/10.1002/admi.201601042
Web of Science
Works referenced in this record:
Four decades of research on thermal contact, gap, and joint resistance in microelectronics
journal, June 2005
- Yovanovich, M. M.
- IEEE Transactions on Components and Packaging Technologies, Vol. 28, Issue 2
Thermal Interface Materials: Historical Perspective, Status, and Future Directions
journal, August 2006
- Prasher, R.
- Proceedings of the IEEE, Vol. 94, Issue 8
Brazing of doped graphite to Cu using stress relief interlayers
journal, March 2009
- Zhong, Zhihong; Zhou, Zhangjian; Ge, Changchun
- Journal of Materials Processing Technology, Vol. 209, Issue 5
Metal/ceramic joining.
journal, January 1990
- Elssner, G.; Petzow, G.
- ISIJ International, Vol. 30, Issue 12
Vacuum brazing of carbon nanotube bundles
journal, December 2008
- Wu, Wei; Hu, Anming; Li, Xiaogang
- Materials Letters, Vol. 62, Issue 30
A Pyrenylpropyl Phosphonic Acid Surface Modifier for Mitigating the Thermal Resistance of Carbon Nanotube Contacts
journal, September 2013
- Taphouse, John H.; Smith, O'Neil L.; Marder, Seth R.
- Advanced Functional Materials, Vol. 24, Issue 4
Organometallic route to the chemical vapor deposition of titanium carbide films at exceptionally low temperatures
journal, March 1987
- Girolami, Gregory S.; Jensen, James A.; Pollina, Deborah M.
- Journal of the American Chemical Society, Vol. 109, Issue 5
Improvement of high-temperature oxidation resistance of titanium nitride and titanium carbide films by aluminum ion implantation
journal, May 1998
- Mitsuo, A.; Uchida, S.; Nihira, N.
- Surface and Coatings Technology, Vol. 103-104
Current status of environmental barrier coatings for Si-Based ceramics
journal, November 2000
- Lee, K. N.
- Surface and Coatings Technology, Vol. 133-134
Stability of solid oxide fuel cell components
journal, June 2001
- Badwal, S.
- Solid State Ionics, Vol. 143, Issue 1
Polymer nanocomposite dielectrics - the role of the interface
journal, August 2005
- Roy, M.; Nelson, J. K.; MacCrone, R. K.
- IEEE Transactions on Dielectrics and Electrical Insulation, Vol. 12, Issue 4
Temperature-Dependent Phonon Conduction and Nanotube Engagement in Metalized Single Wall Carbon Nanotube Films
journal, July 2010
- Panzer, Matthew A.; Duong, Hai M.; Okawa, Jun
- Nano Letters, Vol. 10, Issue 7
Brazing of carbon–carbon composites to Nimonic alloys
journal, January 2010
- Moutis, N. V.; Jimenez, C.; Azpiroz, X.
- Journal of Materials Science, Vol. 45, Issue 1
Thermal Transport Measurements of Individual Multiwalled Nanotubes
journal, October 2001
- Kim, P.; Shi, L.; Majumdar, A.
- Physical Review Letters, Vol. 87, Issue 21
Enhanced thermal transport at covalently functionalized carbon nanotube array interfaces
journal, January 2014
- Kaur, Sumanjeet; Raravikar, Nachiket; Helms, Brett A.
- Nature Communications, Vol. 5, Issue 1
Characterization of vertically oriented carbon nanotube arrays as high-temperature thermal interface materials
journal, March 2017
- Hao, Menglong; Huang, Zhengxing; Saviers, Kimberly R.
- International Journal of Heat and Mass Transfer, Vol. 106
3-Omega Measurements of Vertically Oriented Carbon Nanotubes on Silicon
journal, November 2005
- Hu, X. Jack; Padilla, Antonio A.; Xu, Jun
- Journal of Heat Transfer, Vol. 128, Issue 11
Dense Vertically Aligned Multiwalled Carbon Nanotube Arrays as Thermal Interface Materials
journal, March 2007
- Tong, Tao; Zhao, Yang; Delzeit, Lance
- IEEE Transactions on Components and Packaging Technologies, Vol. 30, Issue 1
A study on the oxidation and carbon diffusion of TiC in alumina–titanium carbide ceramics using XPS and Raman spectroscopy
journal, November 1998
- Zhang, Lihong; Koka, Ramesh V.
- Materials Chemistry and Physics, Vol. 57, Issue 1
High-Quality Vertically Aligned Carbon Nanotubes for Applications as Thermal Interface Materials
journal, February 2014
- Yao, Yagang; Tey, Ju Nie; Li, Zhuo
- IEEE Transactions on Components, Packaging and Manufacturing Technology, Vol. 4, Issue 2
Quality Control of Vertically Aligned Carbon Nanotubes Grown by Chemical Vapor Deposition
journal, November 2013
- Yao, Yagang; Li, Zhuo; Wong, Ching-Ping
- IEEE Transactions on Components, Packaging and Manufacturing Technology, Vol. 3, Issue 11
Thermal conduction phenomena in carbon nanotubes and related nanostructured materials
journal, August 2013
- Marconnet, Amy M.; Panzer, Matthew A.; Goodson, Kenneth E.
- Reviews of Modern Physics, Vol. 85, Issue 3
Thermal Conductance of an Individual Single-Wall Carbon Nanotube above Room Temperature
journal, January 2006
- Pop, Eric; Mann, David; Wang, Qian
- Nano Letters, Vol. 6, Issue 1
Bending and buckling of carbon nanotubes under large strain
journal, October 1997
- Falvo, M. R.; Clary, G. J.; Taylor, R. M.
- Nature, Vol. 389, Issue 6651
Emerging challenges and materials for thermal management of electronics
journal, May 2014
- Moore, Arden L.; Shi, Li
- Materials Today, Vol. 17, Issue 4
Brazing of carbon–carbon composites to Cu-clad molybdenum for thermal management applications
journal, April 2007
- Singh, M.; Asthana, R.; Shpargel, T. P.
- Materials Science and Engineering: A, Vol. 452-453
Thermal to Electrical Energy Conversion of Skutterudite-Based Thermoelectric Modules
journal, October 2012
- Salvador, James R.; Cho, Jung Y.; Ye, Zuxin
- Journal of Electronic Materials, Vol. 42, Issue 7
Photoacoustic characterization of carbon nanotube array thermal interfaces
journal, March 2007
- Cola, Baratunde A.; Xu, Jun; Cheng, Changrui
- Journal of Applied Physics, Vol. 101, Issue 5
Intermetallic catalyst for carbon nanotubes (CNTs) growth by thermal chemical vapor deposition method
journal, August 2006
- Chen, Chia-Ming; Dai, Yong-Ming; Huang, Jenn Gwo
- Carbon, Vol. 44, Issue 9
Carbon nanotube reinforced metal matrix composites - a review
journal, January 2010
- Bakshi, S. R.; Lahiri, D.; Agarwal, A.
- International Materials Reviews, Vol. 55, Issue 1
Enhancement of thermal interface materials with carbon nanotube arrays
journal, May 2006
- Xu, Jun; Fisher, Timothy S.
- International Journal of Heat and Mass Transfer, Vol. 49, Issue 9-10