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This content will become publicly available on October 18, 2018

Title: On the importance of electron impact processes in excimer-pumped alkali laser-induced plasmas

We present that the excimer-pumped alkali laser (XPAL) system has recently been demonstrated in several different mixtures of alkali vapor and rare gas. Without special preventive measures, plasma formation during operation of XPAL is unavoidable. Some recent advancements in the availability of reliable data for electron impact collisions with atoms and molecules have enabled development of a complete reaction mechanism to investigate XPAL-induced plasmas. Here, we report on pathways leading to plasma formation in an Ar/C 2H 6/CsAr/C2H6/Cs XPAL sustained at different cell temperatures. We find that depending on the operating conditions, the contribution of electron impact processes can be as little as bringing the excitation of Cs(P 2) states to higher level Cs** states, and can be as high as bringing Cs(P 2) excited states to a full ionization. Increasing the input pumping power or cell temperature, or decreasing the C 2H 6 mole fraction leads to electron impact processes dominating in plasma formation over the energy pooling mechanisms previously reported in literature.
Authors:
ORCiD logo [1]
  1. Univ. of Michigan, Ann Arbor, MI (United States). Dept. of Electrical Engineering and Computer Science; Sandia National Lab. (SNL-CA), Livermore, CA (United States). Scalable Modeling and Analysis
Publication Date:
Report Number(s):
SAND-2016-10244J
Journal ID: ISSN 0146-9592; OPLEDP; 648227
Grant/Contract Number:
AC04-94AL85000
Type:
Accepted Manuscript
Journal Name:
Optics Letters
Additional Journal Information:
Journal Volume: 42; Journal Issue: 21; Journal ID: ISSN 0146-9592
Publisher:
Optical Society of America (OSA)
Research Org:
Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)
Sponsoring Org:
USDOE National Nuclear Security Administration (NNSA)
Country of Publication:
United States
Language:
English
Subject:
70 PLASMA PHYSICS AND FUSION TECHNOLOGY
OSTI Identifier:
1399892