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Title: Origins of residual stress in thin films: Interaction between microstructure and growth kinetics

Authors:
; ;
Publication Date:
Type:
Publisher's Accepted Manuscript
Journal Name:
Materials & Design
Additional Journal Information:
Journal Volume: 110; Journal Issue: C; Related Information: CHORUS Timestamp: 2018-09-10 06:20:10; Journal ID: ISSN 0264-1275
Publisher:
Elsevier
Sponsoring Org:
USDOE
Country of Publication:
United Kingdom
Language:
English
OSTI Identifier:
1399021

Engwall, A. M., Rao, Z., and Chason, E.. Origins of residual stress in thin films: Interaction between microstructure and growth kinetics. United Kingdom: N. p., Web. doi:10.1016/j.matdes.2016.07.089.
Engwall, A. M., Rao, Z., & Chason, E.. Origins of residual stress in thin films: Interaction between microstructure and growth kinetics. United Kingdom. doi:10.1016/j.matdes.2016.07.089.
Engwall, A. M., Rao, Z., and Chason, E.. 2016. "Origins of residual stress in thin films: Interaction between microstructure and growth kinetics". United Kingdom. doi:10.1016/j.matdes.2016.07.089.
@article{osti_1399021,
title = {Origins of residual stress in thin films: Interaction between microstructure and growth kinetics},
author = {Engwall, A. M. and Rao, Z. and Chason, E.},
abstractNote = {},
doi = {10.1016/j.matdes.2016.07.089},
journal = {Materials & Design},
number = C,
volume = 110,
place = {United Kingdom},
year = {2016},
month = {11}
}