Triple junction drag effects during topological changes in the evolution of polycrystalline microstructures
Abstract
Experiments, theory and atomistic simulations show that finite triple junction mobility results in non-equilibrium triple junction angles in evolving polycrystalline systems. These angles have been predicted and verified for cases where grain boundary migration is steady-state. Yet, steady-state never occurs during the evolution of polycrystalline microstructures as a result of changing grain size and topological events (e.g., grain face/edge switching - “T1” process, or grain disappearance “T2” or “T3” processes). We examine the non-steady evolution of the triple junction angle in the vicinity of topological events and show that large deviations from equilibrium and/or steady-state angles occur. We analyze $$\tau$$ the characteristic relaxation time of triple junction angles τ by consideration of a pair of topological events, beginning from steady-state migration. Using numerical results and theoretical analysis we predict how the triple junction angle varies with time and how τ varies with triple junction mobility. We argue that it is precisely those cases where grain boundaries are moving quickly (e.g., topological process in nanocrystalline materials), that the classical steady-state prediction of the triple junction angle about finite triple junction mobility is inapplicable and may only be applied qualitatively.
- Authors:
-
[2];
[3];
- National Univ. of Singapore (Singapore). Dept. of Mathematics
- Wuhan Univ. (China). School of Mathematics and Statistics. Computational Science Hubei Key Lab.
- Univ. of Pennsylvania, Philadelphia, PA (United States). Dept. of Materials Science and Engineering. Dept. of Mechanical Engineering and Applied Mechanics
- Publication Date:
- Research Org.:
- Energy Frontier Research Centers (EFRC) (United States). Center for Complex Materials from First Principles (CCM); Temple Univ., Philadelphia, PA (United States)
- Sponsoring Org.:
- USDOE Office of Science (SC), Basic Energy Sciences (BES)
- OSTI Identifier:
- 1533468
- Alternate Identifier(s):
- OSTI ID: 1397793
- Grant/Contract Number:
- SC0012575
- Resource Type:
- Accepted Manuscript
- Journal Name:
- Acta Materialia
- Additional Journal Information:
- Journal Volume: 128; Journal ID: ISSN 1359-6454
- Publisher:
- Elsevier
- Country of Publication:
- United States
- Language:
- English
- Subject:
- 36 MATERIALS SCIENCE; triple junction motion; drag effect; triple junction angle; grain boundary; T1 process; T3 process
Citation Formats
Zhao, Quan, Jiang, Wei, Srolovitz, David J., and Bao, Weizhu. Triple junction drag effects during topological changes in the evolution of polycrystalline microstructures. United States: N. p., 2017.
Web. doi:10.1016/j.actamat.2017.02.010.
Zhao, Quan, Jiang, Wei, Srolovitz, David J., & Bao, Weizhu. Triple junction drag effects during topological changes in the evolution of polycrystalline microstructures. United States. https://doi.org/10.1016/j.actamat.2017.02.010
Zhao, Quan, Jiang, Wei, Srolovitz, David J., and Bao, Weizhu. Mon .
"Triple junction drag effects during topological changes in the evolution of polycrystalline microstructures". United States. https://doi.org/10.1016/j.actamat.2017.02.010. https://www.osti.gov/servlets/purl/1533468.
@article{osti_1533468,
title = {Triple junction drag effects during topological changes in the evolution of polycrystalline microstructures},
author = {Zhao, Quan and Jiang, Wei and Srolovitz, David J. and Bao, Weizhu},
abstractNote = {Experiments, theory and atomistic simulations show that finite triple junction mobility results in non-equilibrium triple junction angles in evolving polycrystalline systems. These angles have been predicted and verified for cases where grain boundary migration is steady-state. Yet, steady-state never occurs during the evolution of polycrystalline microstructures as a result of changing grain size and topological events (e.g., grain face/edge switching - “T1” process, or grain disappearance “T2” or “T3” processes). We examine the non-steady evolution of the triple junction angle in the vicinity of topological events and show that large deviations from equilibrium and/or steady-state angles occur. We analyze $\tau$ the characteristic relaxation time of triple junction angles τ by consideration of a pair of topological events, beginning from steady-state migration. Using numerical results and theoretical analysis we predict how the triple junction angle varies with time and how τ varies with triple junction mobility. We argue that it is precisely those cases where grain boundaries are moving quickly (e.g., topological process in nanocrystalline materials), that the classical steady-state prediction of the triple junction angle about finite triple junction mobility is inapplicable and may only be applied qualitatively.},
doi = {10.1016/j.actamat.2017.02.010},
journal = {Acta Materialia},
number = ,
volume = 128,
place = {United States},
year = {Mon Feb 06 00:00:00 EST 2017},
month = {Mon Feb 06 00:00:00 EST 2017}
}
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Works referencing / citing this record:
Structure and Atomic Profile of Grain Boundary Triple Junctions in Tungsten
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