Shock induced damage in copper: A before and after, three-dimensional study
Abstract
We report on the microstructural features associated with the formation of incipient spall and damage in a fully recrystallized, high purity copper sample. Before and after ballistic shock loading, approximately 0.8 mm3 of the sample's crystal lattice orientation field is mapped using non-destructive near-field High Energy Diffraction Microscopy. Absorption contrast tomography is used to image voids after loading. This non-destructive interrogation of damage initiation allows for novel characterization of spall points vis-a-vis microstructural features and a fully 3D examination of microstructural topology and its influence on incipient damage. The spalled region is registered with and mapped back onto the pre-shock orientation field. As expected, the great majority of voids occur at grain boundaries and higher order microstructural features; however, we find no statistical preference for particular grain boundary types. We note the damaged region contains a large volume of $Σ-3$ (60 degrees < 111 >) connected domains with a large area fraction of incoherent $Σ-3$ boundaries.
- Authors:
-
- Carnegie Mellon Univ., Pittsburgh, PA (United States)
- Lawrence Livermore National Lab. (LLNL), Livermore, CA (United States)
- Argonne National Lab. (ANL), Argonne, IL (United States)
- Los Alamos National Lab. (LANL), Los Alamos, NM (United States)
- Deutsches Elektronen-Synchrotron, Hamburg (Germany)
- Publication Date:
- Research Org.:
- Argonne National Laboratory (ANL), Argonne, IL (United States); Lawrence Livermore National Laboratory (LLNL), Livermore, CA (United States)
- Sponsoring Org.:
- USDOE National Nuclear Security Administration (NNSA); USDOE Laboratory Directed Research and Development (LDRD) Program; USDOD; USDOE Office of Science (SC), Basic Energy Sciences (BES). Scientific User Facilities Division
- OSTI Identifier:
- 1390920
- Alternate Identifier(s):
- OSTI ID: 1421092; OSTI ID: 1809181
- Report Number(s):
- LLNL-JRNL-748544
Journal ID: ISSN 0021-8979; 125723
- Grant/Contract Number:
- AC02-06CH11357; AC52-07NA27344
- Resource Type:
- Accepted Manuscript
- Journal Name:
- Journal of Applied Physics
- Additional Journal Information:
- Journal Volume: 119; Journal Issue: 15; Journal ID: ISSN 0021-8979
- Publisher:
- American Institute of Physics (AIP)
- Country of Publication:
- United States
- Language:
- English
- Subject:
- 36 MATERIALS SCIENCE; diffraction microscopy; shock loading; spall voids; synchrotron imaging
Citation Formats
Menasche, David B., Lind, Jonathan, Li, Shiu Fai, Kenesei, Peter, Bingert, John F., Lienert, Ulrich, and Suter, Robert M. Shock induced damage in copper: A before and after, three-dimensional study. United States: N. p., 2016.
Web. doi:10.1063/1.4947270.
Menasche, David B., Lind, Jonathan, Li, Shiu Fai, Kenesei, Peter, Bingert, John F., Lienert, Ulrich, & Suter, Robert M. Shock induced damage in copper: A before and after, three-dimensional study. United States. https://doi.org/10.1063/1.4947270
Menasche, David B., Lind, Jonathan, Li, Shiu Fai, Kenesei, Peter, Bingert, John F., Lienert, Ulrich, and Suter, Robert M. Thu .
"Shock induced damage in copper: A before and after, three-dimensional study". United States. https://doi.org/10.1063/1.4947270. https://www.osti.gov/servlets/purl/1390920.
@article{osti_1390920,
title = {Shock induced damage in copper: A before and after, three-dimensional study},
author = {Menasche, David B. and Lind, Jonathan and Li, Shiu Fai and Kenesei, Peter and Bingert, John F. and Lienert, Ulrich and Suter, Robert M.},
abstractNote = {We report on the microstructural features associated with the formation of incipient spall and damage in a fully recrystallized, high purity copper sample. Before and after ballistic shock loading, approximately 0.8 mm3 of the sample's crystal lattice orientation field is mapped using non-destructive near-field High Energy Diffraction Microscopy. Absorption contrast tomography is used to image voids after loading. This non-destructive interrogation of damage initiation allows for novel characterization of spall points vis-a-vis microstructural features and a fully 3D examination of microstructural topology and its influence on incipient damage. The spalled region is registered with and mapped back onto the pre-shock orientation field. As expected, the great majority of voids occur at grain boundaries and higher order microstructural features; however, we find no statistical preference for particular grain boundary types. We note the damaged region contains a large volume of $Σ-3$ (60 degrees < 111 >) connected domains with a large area fraction of incoherent $Σ-3$ boundaries.},
doi = {10.1063/1.4947270},
journal = {Journal of Applied Physics},
number = 15,
volume = 119,
place = {United States},
year = {Thu Apr 21 00:00:00 EDT 2016},
month = {Thu Apr 21 00:00:00 EDT 2016}
}
Web of Science
Works referenced in this record:
Interpretation of Microstructural Effects on Porosity Evolution Using a Combined Dilatational/Crystal Plasticity Computational Approach
journal, January 2014
- Lebensohn, Ricardo A.; Pokharel, Reeju
- JOM, Vol. 66, Issue 3
Orientation dependence of void formation and substructure deformation in a spalled copper bicrystal
journal, December 2011
- Perez-Bergquist, A. G.; Cerreta, E. K.; Trujillo, C. P.
- Scripta Materialia, Vol. 65, Issue 12
High-strain-rate response of ultra-fine-grained copper
journal, July 2008
- Mishra, A.; Martin, M.; Thadhani, N. N.
- Acta Materialia, Vol. 56, Issue 12
Tensile twin nucleation events coupled to neighboring slip observed in three dimensions
journal, September 2014
- Lind, J.; Li, S. F.; Pokharel, R.
- Acta Materialia, Vol. 76
Effect of loading direction on grain boundary failure under shock loading
journal, February 2014
- Fensin, S. J.; Escobedo-Diaz, J. P.; Brandl, C.
- Acta Materialia, Vol. 64
Observation of annealing twin nucleation at triple lines in nickel during grain growth
journal, October 2015
- Lin, B.; Jin, Y.; Hefferan, C. M.
- Acta Materialia, Vol. 99
Stress hot spots in viscoplastic deformation of polycrystals
journal, September 2010
- Rollett, A. D.; Lebensohn, R. A.; Groeber, M.
- Modelling and Simulation in Materials Science and Engineering, Vol. 18, Issue 7
Three-dimensional plastic response in polycrystalline copper via near-field high-energy X-ray diffraction microscopy
journal, October 2012
- Li, S. F.; Lind, J.; Hefferan, C. M.
- Journal of Applied Crystallography, Vol. 45, Issue 6
High-energy diffraction microscopy at the advanced photon source
journal, July 2011
- Lienert, U.; Li, S. F.; Hefferan, C. M.
- JOM, Vol. 63, Issue 7
Three-Dimensional X-Ray Diffraction Microscopy
book, January 2004
- Poulsen, Henning
- Springer Tracts in Modern Physics
Experimental tests of stereological estimates of grain boundary populations
journal, April 2012
- Reed, B. W.; Adams, B. L.; Bernier, J. V.
- Acta Materialia, Vol. 60, Issue 6-7
Orientation image-based micromechanical modelling of subgrain texture evolution in polycrystalline copper
journal, September 2008
- Lebensohn, Ricardo A.; Brenner, Renald; Castelnau, Olivier
- Acta Materialia, Vol. 56, Issue 15
On the accuracy of the self-consistent approximation for polycrystals: comparison with full-field numerical simulations
journal, October 2004
- Lebensohn, R. A.; Liu, Y.; Ponte Castañeda, P.
- Acta Materialia, Vol. 52, Issue 18
The structure of high-angle grain boundaries
journal, November 1966
- Brandon, D. G.
- Acta Metallurgica, Vol. 14, Issue 11
Statistics of weak grain boundaries for spall damage in polycrystalline copper
journal, November 2010
- Wayne, L.; Krishnan, K.; DiGiacomo, S.
- Scripta Materialia, Vol. 63, Issue 11
Effect of stress triaxiality on void growth in dynamic fracture of metals: A molecular dynamics study
journal, April 2004
- Seppälä, E. T.; Belak, J.; Rudd, R. E.
- Physical Review B, Vol. 69, Issue 13
Deformation and failure of shocked bulk Cu–Nb nanolaminates
journal, January 2014
- Han, W. Z.; Cerreta, E. K.; Mara, N. A.
- Acta Materialia, Vol. 63
Spall behaviors of high purity copper under sweeping detonation
journal, January 2016
- Yang, Yang; Zhi-qiang, Peng; Xing-zhi, Chen
- Materials Science and Engineering: A, Vol. 651
Influence of boundary structure and near neighbor crystallographic orientation on the dynamic damage evolution during shock loading
journal, March 2013
- Escobedo, Juan P.; Cerreta, Ellen K.; Dennis-Koller, Darcie
- Philosophical Magazine, Vol. 93, Issue 7
The role of the structure of grain boundary interfaces during shock loading
conference, January 2012
- Perez-Bergquist, Alejandro Gabriel; Escobedo, Juan P.; Trujillo, Carl P.
- SHOCK COMPRESSION OF CONDENSED MATTER - 2011: Proceedings of the Conference of the American Physical Society Topical Group on Shock Compression of Condensed Matter, AIP Conference Proceedings
Polycrystal Plasticity: Comparison Between Grain - Scale Observations of Deformation and Simulations
journal, March 2014
- Pokharel, Reeju; Lind, Jonathan; Kanjarla, Anand K.
- Annual Review of Condensed Matter Physics, Vol. 5, Issue 1
Left-right loading dependence of shock response of (111)//(112) Cu bicrystals: Deformation and spallation
journal, March 2012
- An, Q.; Han, W. Z.; Luo, S. N.
- Journal of Applied Physics, Vol. 111, Issue 5
Quasi-real-time x-ray microtomography system at the Advanced Photon Source
conference, September 1999
- Wang, Yuxin; De Carlo, Francesco; Foster, Ian
- SPIE's International Symposium on Optical Science, Engineering, and Instrumentation, SPIE Proceedings
Evolution and microstructure of shear bands in nanostructured Fe
journal, August 2002
- Wei, Q.; Jia, D.; Ramesh, K. T.
- Applied Physics Letters, Vol. 81, Issue 7
Far-field high-energy diffraction microscopy: a tool for intergranular orientation and strain analysis
journal, July 2011
- Bernier, J. V.; Barton, N. R.; Lienert, U.
- The Journal of Strain Analysis for Engineering Design, Vol. 46, Issue 7
Validating computed grain boundary energies in fcc metals using the grain boundary character distribution
journal, August 2011
- Holm, Elizabeth A.; Rohrer, Gregory S.; Foiles, Stephen M.
- Acta Materialia, Vol. 59, Issue 13
Early stage dynamic damage and the role of grain boundary type
journal, May 2012
- Cerreta, E. K.; Escobedo, J. P.; Perez-Bergquist, A.
- Scripta Materialia, Vol. 66, Issue 9
Deformation behavior and plastic instabilities of ultrafine-grained titanium
journal, July 2001
- Jia, D.; Wang, Y. M.; Ramesh, K. T.
- Applied Physics Letters, Vol. 79, Issue 5
Shock wave loading and spallation of copper bicrystals with asymmetric Σ3⟨110⟩ tilt grain boundaries
journal, November 2010
- Luo, Sheng-Nian; Germann, Timothy C.; Tonks, Davis L.
- Journal of Applied Physics, Vol. 108, Issue 9
Developments in synchrotron x-ray computed microtomography at the National Synchrotron Light Source
conference, September 1999
- Dowd, Betsy A.; Campbell, Graham H.; Marr, Robert B.
- SPIE's International Symposium on Optical Science, Engineering, and Instrumentation, SPIE Proceedings
In-situ observation of bulk 3D grain evolution during plastic deformation in polycrystalline Cu
journal, April 2015
- Pokharel, Reeju; Lind, Jonathan; Li, Shiu Fai
- International Journal of Plasticity, Vol. 67
In situ assessment of lattice strain in an Al–Li alloy
journal, May 2013
- Beaudoin, A. J.; Obstalecki, M.; Tayon, W.
- Acta Materialia, Vol. 61, Issue 9
Detailed analyses of grain–scale plastic deformation in columnar polycrystalline aluminium using orientation image mapping and crystal plasticity models
journal, July 2004
- Kalidindi, Surya R.; Bhattacharyya, Abhishek; Doherty, Roger D.
- Proceedings of the Royal Society of London. Series A: Mathematical, Physical and Engineering Sciences, Vol. 460, Issue 2047
Measuring the stress field around an evolving crack in tensile deformed Mg AZ31 using three-dimensional X-ray diffraction
journal, May 2012
- Oddershede, Jette; Camin, Bettina; Schmidt, Søren
- Acta Materialia, Vol. 60, Issue 8
Modelling the Shock Response of Polycrystals at the Mesoscale
conference, January 2006
- Case, Simon
- SHOCK COMPRESSION OF CONDENSED MATTER - 2005: Proceedings of the Conference of the American Physical Society Topical Group on Shock Compression of Condensed Matter, AIP Conference Proceedings
Three-dimensional analysis of creep voids in copper by serial sectioning combined with large field EBSD
journal, May 2014
- Abbasi, R.; Dzieciol, K.; Borbély, A.
- Materials Science and Technology, Vol. 31, Issue 5
Effects of grain size and boundary structure on the dynamic tensile response of copper
journal, August 2011
- Escobedo, J. P.; Dennis-Koller, D.; Cerreta, E. K.
- Journal of Applied Physics, Vol. 110, Issue 3
New opportunities for quantitative tracking of polycrystal responses in three dimensions
journal, August 2015
- Schuren, Jay C.; Shade, Paul A.; Bernier, Joel V.
- Current Opinion in Solid State and Materials Science, Vol. 19, Issue 4
Effect of pulse duration and strain rate on incipient spall fracture in copper
journal, November 1999
- Johnson, J. N.; Gray, G. T.; Bourne, N. K.
- Journal of Applied Physics, Vol. 86, Issue 9
Adaptive reconstruction method for three-dimensional orientation imaging
journal, March 2013
- Li, S. F.; Suter, R. M.
- Journal of Applied Crystallography, Vol. 46, Issue 2
Elastoplastic properties under shock compression of Al 2 O 3 single crystal and polycrystal
journal, January 1988
- Mashimo, Tsutomu; Hanaoka, Yasuharu; Nagayama, Kunihito
- Journal of Applied Physics, Vol. 63, Issue 2
The effect of shock-wave profile on dynamic brittle failure
journal, March 2013
- Escobedo, J. P.; Brown, E. N.; Trujillo, C. P.
- Journal of Applied Physics, Vol. 113, Issue 10
Why are some Interfaces in Materials Stronger than others?
journal, June 2014
- Fensin, S. J.; Cerreta, E. K.; Iii, G. T. Gray
- Scientific Reports, Vol. 4, Issue 1
Effect of stress-triaxiality on void growth in dynamic fracture of metals: a molecular dynamics study
text, January 2003
- Seppälä, E. T.; Belak, J.; Rudd, R. E.
- arXiv
Works referencing / citing this record:
Intragranular three-dimensional stress tensor fields in plastically deformed polycrystals
journal, December 2019
- Hayashi, Yujiro; Setoyama, Daigo; Hirose, Yoshiharu
- Science, Vol. 366, Issue 6472