Interfacial Thermal Conductance between Mechanically Exfoliated Black Phosphorus and SiOx : Effect of Thickness and Temperature
Abstract
Black phosphorus (BP) is one of new 2D materials that have attracted wide attention. This work reports the interfacial thermal conductance between BP flake and SiOx using Raman spectroscopy. From 293 K down to the 223 K, eight BP flakes in a thickness range of 16.6–113.7 nm are characterized. At 293 K, the largest interfacial thermal conductance is 1.14 × 108 W m−2 K−1 for a 82.1 nm thick BP flake, and the smallest one is 2.17 × 107 W m−2 K−1 for a 26.6 nm thick BP flake. Such large interfacial thermal conductance can be attributed to the excellent interface contact and strong phonon coupling between BP and SiOx. Furthermore, the measured interfacial thermal conductance has a one‐fold up to around four‐fold increase with decreased temperature from 293 to 223 K, which is a result of thermal‐expansion‐mismatch induced variation in the morphology of BP flakes. Additionally, it demonstrates no thickness‐dependent behavior. It is speculated the intrinsic thickness dependence is weak and is overshadowed by the large variation in the interface contact of different samples. As a new 2D material, BP shows great potential to be a thermal interface material for heat dissipation in electronics.
- Authors:
-
[1]
- Iowa State Univ., Ames, IA (United States)
- Shanghai Univ. of Engineering Science, Shanghai (China)
- Publication Date:
- Research Org.:
- Iowa State Univ., Ames, IA (United States)
- Sponsoring Org.:
- USDOE Office of Energy Efficiency and Renewable Energy (EERE); National Science Foundation (NSF); Iowa Energy Center
- OSTI Identifier:
- 1533051
- Alternate Identifier(s):
- OSTI ID: 1376746
- Grant/Contract Number:
- EE0007686; NE0000671; CBET1235852; CMMI1264399; MG-16-025; OG-17-005
- Resource Type:
- Accepted Manuscript
- Journal Name:
- Advanced Materials Interfaces
- Additional Journal Information:
- Journal Volume: 4; Journal Issue: 16; Journal ID: ISSN 2196-7350
- Publisher:
- Wiley-VCH
- Country of Publication:
- United States
- Language:
- English
- Subject:
- 36 MATERIALS SCIENCE; black phosphorus; interfacial thermal conductance; Raman spectroscopy; thermal expansion
Citation Formats
Wang, Tianyu, Wang, Ridong, Yuan, Pengyu, Xu, Shen, Liu, Jing, and Wang, Xinwei. Interfacial Thermal Conductance between Mechanically Exfoliated Black Phosphorus and SiOx : Effect of Thickness and Temperature. United States: N. p., 2017.
Web. doi:10.1002/admi.201700233.
Wang, Tianyu, Wang, Ridong, Yuan, Pengyu, Xu, Shen, Liu, Jing, & Wang, Xinwei. Interfacial Thermal Conductance between Mechanically Exfoliated Black Phosphorus and SiOx : Effect of Thickness and Temperature. United States. https://doi.org/10.1002/admi.201700233
Wang, Tianyu, Wang, Ridong, Yuan, Pengyu, Xu, Shen, Liu, Jing, and Wang, Xinwei. Mon .
"Interfacial Thermal Conductance between Mechanically Exfoliated Black Phosphorus and SiOx : Effect of Thickness and Temperature". United States. https://doi.org/10.1002/admi.201700233. https://www.osti.gov/servlets/purl/1533051.
@article{osti_1533051,
title = {Interfacial Thermal Conductance between Mechanically Exfoliated Black Phosphorus and SiOx : Effect of Thickness and Temperature},
author = {Wang, Tianyu and Wang, Ridong and Yuan, Pengyu and Xu, Shen and Liu, Jing and Wang, Xinwei},
abstractNote = {Black phosphorus (BP) is one of new 2D materials that have attracted wide attention. This work reports the interfacial thermal conductance between BP flake and SiOx using Raman spectroscopy. From 293 K down to the 223 K, eight BP flakes in a thickness range of 16.6–113.7 nm are characterized. At 293 K, the largest interfacial thermal conductance is 1.14 × 108 W m−2 K−1 for a 82.1 nm thick BP flake, and the smallest one is 2.17 × 107 W m−2 K−1 for a 26.6 nm thick BP flake. Such large interfacial thermal conductance can be attributed to the excellent interface contact and strong phonon coupling between BP and SiOx. Furthermore, the measured interfacial thermal conductance has a one‐fold up to around four‐fold increase with decreased temperature from 293 to 223 K, which is a result of thermal‐expansion‐mismatch induced variation in the morphology of BP flakes. Additionally, it demonstrates no thickness‐dependent behavior. It is speculated the intrinsic thickness dependence is weak and is overshadowed by the large variation in the interface contact of different samples. As a new 2D material, BP shows great potential to be a thermal interface material for heat dissipation in electronics.},
doi = {10.1002/admi.201700233},
journal = {Advanced Materials Interfaces},
number = 16,
volume = 4,
place = {United States},
year = {Mon Jul 10 00:00:00 EDT 2017},
month = {Mon Jul 10 00:00:00 EDT 2017}
}
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