Si Complies with GaN to Overcome Thermal Mismatches for the Heteroepitaxy of Thick GaN on Si
Abstract
Heteroepitaxial growth of lattice mismatched materials has advanced through the epitaxy of thin coherently strained layers, the strain sharing in virtual and nanoscale substrates, and the growth of thick films with intermediate strain‐relaxed buffer layers. However, the thermal mismatch is not completely resolved in highly mismatched systems such as in GaN‐on‐Si. Here, geometrical effects and surface faceting to dilate thermal stresses at the surface of selectively grown epitaxial GaN layers on Si are exploited. The growth of thick (19 µm), crack‐free, and pure GaN layers on Si with the lowest threading dislocation density of 1.1 × 10 7 cm −2 achieved to date in GaN‐on‐Si is demonstrated. With these advances, the first vertical GaN metal–insulator–semiconductor field‐effect transistors on Si substrates with low leakage currents and high on/off ratios paving the way for a cost‐effective high power device paradigm on an Si CMOS platform are demonstrated
- Authors:
-
- Materials Science and Engineering Program University of California San Diego La Jolla CA 92093 USA
- Department of Electrical and Computer Engineering University of California San Diego La Jolla CA 92093 USA
- Materials Science and Engineering Program University of California San Diego La Jolla CA 92093 USA, Department of Electrical and Computer Engineering University of California San Diego La Jolla CA 92093 USA, Department of NanoEngineering University of California San Diego La Jolla CA 92093 USA
- Publication Date:
- Sponsoring Org.:
- USDOE
- OSTI Identifier:
- 1375658
- Grant/Contract Number:
- DE‐AC04‐94AL85000
- Resource Type:
- Publisher's Accepted Manuscript
- Journal Name:
- Advanced Materials
- Additional Journal Information:
- Journal Name: Advanced Materials Journal Volume: 29 Journal Issue: 38; Journal ID: ISSN 0935-9648
- Publisher:
- Wiley Blackwell (John Wiley & Sons)
- Country of Publication:
- Germany
- Language:
- English
Citation Formats
Tanaka, Atsunori, Choi, Woojin, Chen, Renjie, and Dayeh, Shadi A. Si Complies with GaN to Overcome Thermal Mismatches for the Heteroepitaxy of Thick GaN on Si. Germany: N. p., 2017.
Web. doi:10.1002/adma.201702557.
Tanaka, Atsunori, Choi, Woojin, Chen, Renjie, & Dayeh, Shadi A. Si Complies with GaN to Overcome Thermal Mismatches for the Heteroepitaxy of Thick GaN on Si. Germany. https://doi.org/10.1002/adma.201702557
Tanaka, Atsunori, Choi, Woojin, Chen, Renjie, and Dayeh, Shadi A. Mon .
"Si Complies with GaN to Overcome Thermal Mismatches for the Heteroepitaxy of Thick GaN on Si". Germany. https://doi.org/10.1002/adma.201702557.
@article{osti_1375658,
title = {Si Complies with GaN to Overcome Thermal Mismatches for the Heteroepitaxy of Thick GaN on Si},
author = {Tanaka, Atsunori and Choi, Woojin and Chen, Renjie and Dayeh, Shadi A.},
abstractNote = {Heteroepitaxial growth of lattice mismatched materials has advanced through the epitaxy of thin coherently strained layers, the strain sharing in virtual and nanoscale substrates, and the growth of thick films with intermediate strain‐relaxed buffer layers. However, the thermal mismatch is not completely resolved in highly mismatched systems such as in GaN‐on‐Si. Here, geometrical effects and surface faceting to dilate thermal stresses at the surface of selectively grown epitaxial GaN layers on Si are exploited. The growth of thick (19 µm), crack‐free, and pure GaN layers on Si with the lowest threading dislocation density of 1.1 × 10 7 cm −2 achieved to date in GaN‐on‐Si is demonstrated. With these advances, the first vertical GaN metal–insulator–semiconductor field‐effect transistors on Si substrates with low leakage currents and high on/off ratios paving the way for a cost‐effective high power device paradigm on an Si CMOS platform are demonstrated},
doi = {10.1002/adma.201702557},
journal = {Advanced Materials},
number = 38,
volume = 29,
place = {Germany},
year = {Mon Aug 21 00:00:00 EDT 2017},
month = {Mon Aug 21 00:00:00 EDT 2017}
}
https://doi.org/10.1002/adma.201702557
Web of Science
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