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Title: Ostwald ripening of faceted Si particles in an Al-Si-Cu melt

Abstract

The microstructural evolution of an Al-Si-Cu alloy during Ostwald ripening is imaged via synchrotron-based, four-dimensional (i.e., space and time resolved) X-ray tomography. Samples of composition Al-32 wt%Si-15 wt%Cu were annealed isothermally at 650 °C, in the two-phase solid-liquid regime, while tomographic projections were collected in situ over the course of five hours. Advances in experimental methods and computational approaches enable us to characterize the local interfacial curvatures and velocities during ripening. The sequence of three-dimensional reconstructions and interfacial shape distributions shows highly faceted Si particles in a copper-enriched liquid, that become increasingly isotropic or rounded over time. In addition, we find that the coarsening rate constant is approximately the same in the binary and ternary systems. By coupling these experimental measurements with CALPHAD modeling and ab initio molecular dynamics simulation, we assess the influence of Cu on the coarsening process. Lastly, we find the unusual “pinning” of microstructure at the junction between rough and smooth interfaces and suggest a mechanism for this behavior.

Authors:
 [1];  [2];  [3];  [1];  [1]
  1. Northwestern Univ., Evanston, IL (United States)
  2. Argonne National Lab. (ANL), Lemont, IL (United States)
  3. Dow Corning Corp., Midland, MI (United States)
Publication Date:
Research Org.:
Argonne National Laboratory (ANL), Argonne, IL (United States)
Sponsoring Org.:
Northwestern University; USDOE
OSTI Identifier:
1373408
Grant/Contract Number:  
AC02-06CH11357
Resource Type:
Accepted Manuscript
Journal Name:
Materials Science and Engineering. A, Structural Materials: Properties, Microstructure and Processing
Additional Journal Information:
Journal Volume: 673; Journal Issue: C; Journal ID: ISSN 0921-5093
Publisher:
Elsevier
Country of Publication:
United States
Language:
English
Subject:
36 MATERIALS SCIENCE; 4D materials science; Aluminum-silicon-copper alloys; Ostwald ripening; Facets; Synchrotron-based X-ray tomography

Citation Formats

Shahani, A. J., Xiao, X., Skinner, K., Peters, M., and Voorhees, P. W. Ostwald ripening of faceted Si particles in an Al-Si-Cu melt. United States: N. p., 2016. Web. doi:10.1016/j.msea.2016.06.077.
Shahani, A. J., Xiao, X., Skinner, K., Peters, M., & Voorhees, P. W. Ostwald ripening of faceted Si particles in an Al-Si-Cu melt. United States. https://doi.org/10.1016/j.msea.2016.06.077
Shahani, A. J., Xiao, X., Skinner, K., Peters, M., and Voorhees, P. W. Mon . "Ostwald ripening of faceted Si particles in an Al-Si-Cu melt". United States. https://doi.org/10.1016/j.msea.2016.06.077. https://www.osti.gov/servlets/purl/1373408.
@article{osti_1373408,
title = {Ostwald ripening of faceted Si particles in an Al-Si-Cu melt},
author = {Shahani, A. J. and Xiao, X. and Skinner, K. and Peters, M. and Voorhees, P. W.},
abstractNote = {The microstructural evolution of an Al-Si-Cu alloy during Ostwald ripening is imaged via synchrotron-based, four-dimensional (i.e., space and time resolved) X-ray tomography. Samples of composition Al-32 wt%Si-15 wt%Cu were annealed isothermally at 650 °C, in the two-phase solid-liquid regime, while tomographic projections were collected in situ over the course of five hours. Advances in experimental methods and computational approaches enable us to characterize the local interfacial curvatures and velocities during ripening. The sequence of three-dimensional reconstructions and interfacial shape distributions shows highly faceted Si particles in a copper-enriched liquid, that become increasingly isotropic or rounded over time. In addition, we find that the coarsening rate constant is approximately the same in the binary and ternary systems. By coupling these experimental measurements with CALPHAD modeling and ab initio molecular dynamics simulation, we assess the influence of Cu on the coarsening process. Lastly, we find the unusual “pinning” of microstructure at the junction between rough and smooth interfaces and suggest a mechanism for this behavior.},
doi = {10.1016/j.msea.2016.06.077},
journal = {Materials Science and Engineering. A, Structural Materials: Properties, Microstructure and Processing},
number = C,
volume = 673,
place = {United States},
year = {2016},
month = {7}
}

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