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Title: Electrical resistivity of solid and liquid Cu up to 5 GPa: Decrease along the melting boundary

Authors:
; ; ; ;
Publication Date:
Type:
Published Article
Journal Name:
Journal of Physics and Chemistry of Solids
Additional Journal Information:
Journal Name: Journal of Physics and Chemistry of Solids Journal Volume: 110 Journal Issue: C; Journal ID: ISSN 0022-3697
Publisher:
Elsevier
Sponsoring Org:
USDOE
Country of Publication:
United Kingdom
Language:
English
OSTI Identifier:
1367930

Ezenwa, Innocent C., Secco, Richard A., Yong, Wenjun, Pozzo, Monica, and Alfè, Dario. Electrical resistivity of solid and liquid Cu up to 5 GPa: Decrease along the melting boundary. United Kingdom: N. p., Web. doi:10.1016/j.jpcs.2017.06.030.
Ezenwa, Innocent C., Secco, Richard A., Yong, Wenjun, Pozzo, Monica, & Alfè, Dario. Electrical resistivity of solid and liquid Cu up to 5 GPa: Decrease along the melting boundary. United Kingdom. doi:10.1016/j.jpcs.2017.06.030.
Ezenwa, Innocent C., Secco, Richard A., Yong, Wenjun, Pozzo, Monica, and Alfè, Dario. 2017. "Electrical resistivity of solid and liquid Cu up to 5 GPa: Decrease along the melting boundary". United Kingdom. doi:10.1016/j.jpcs.2017.06.030.
@article{osti_1367930,
title = {Electrical resistivity of solid and liquid Cu up to 5 GPa: Decrease along the melting boundary},
author = {Ezenwa, Innocent C. and Secco, Richard A. and Yong, Wenjun and Pozzo, Monica and Alfè, Dario},
abstractNote = {},
doi = {10.1016/j.jpcs.2017.06.030},
journal = {Journal of Physics and Chemistry of Solids},
number = C,
volume = 110,
place = {United Kingdom},
year = {2017},
month = {11}
}