Prediction of recrystallization times in electroplated copper thin films
- Publication Date:
- Grant/Contract Number:
- AC02-98CH10886
- Type:
- Publisher's Accepted Manuscript
- Journal Name:
- Thin Solid Films
- Additional Journal Information:
- Journal Volume: 615; Journal Issue: C; Related Information: CHORUS Timestamp: 2017-10-04 15:39:29; Journal ID: ISSN 0040-6090
- Publisher:
- Elsevier
- Sponsoring Org:
- USDOE
- Country of Publication:
- Netherlands
- Language:
- English
- OSTI Identifier:
- 1359949