Prediction of recrystallization times in electroplated copper thin films

doi:10.1016/j.tsf.2016.06.056

Title: Prediction of recrystallization times in electroplated copper thin films

Article Details
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Authors:: Treger, Mikhail ; Witt, Christian ; Cabral, Jr., Cyril ; Murray, Conal ; Jordan-Sweet, Jean ; Rosenberg, Robert ; Eisenbraun, Eric ; Noyan, I. C.

Publication Date:: 2016-09-01

Grant/Contract Number:: AC02-98CH10886

Type:: Publisher's Accepted Manuscript

Journal Name:: Thin Solid Films

Additional Journal Information:: Journal Volume: 615; Journal Issue: C; Related Information: CHORUS Timestamp: 2018-09-10 16:54:54; Journal ID: ISSN 0040-6090

Publisher:: Elsevier

Sponsoring Org:: USDOE

Country of Publication:: Netherlands

Language:: English

OSTI Identifier:: 1359949


                    Treger, Mikhail, Witt, Christian, Cabral, Jr., Cyril, Murray, Conal, Jordan-Sweet, Jean, Rosenberg, Robert, Eisenbraun, Eric, and Noyan, I. C.. Prediction of recrystallization times in electroplated copper thin films.  Netherlands: N. p.,  
        Web.  doi:10.1016/j.tsf.2016.06.056.

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                    Treger, Mikhail, Witt, Christian, Cabral, Jr., Cyril, Murray, Conal, Jordan-Sweet, Jean, Rosenberg, Robert, Eisenbraun, Eric, & Noyan, I. C.. Prediction of recrystallization times in electroplated copper thin films.  Netherlands.  doi:10.1016/j.tsf.2016.06.056.

Copy to clipboard


                    Treger, Mikhail, Witt, Christian, Cabral, Jr., Cyril, Murray, Conal, Jordan-Sweet, Jean, Rosenberg, Robert, Eisenbraun, Eric, and Noyan, I. C.. 2016.  
        "Prediction of recrystallization times in electroplated copper thin films".  Netherlands.  
        doi:10.1016/j.tsf.2016.06.056.

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@article{osti_1359949,

  title        = {Prediction of recrystallization times in electroplated copper thin films},

  author       = {Treger, Mikhail and Witt, Christian and Cabral, Jr., Cyril and Murray, Conal and Jordan-Sweet, Jean and Rosenberg, Robert and Eisenbraun, Eric and Noyan, I. C.},

  abstractNote = {},

  doi          = {10.1016/j.tsf.2016.06.056},

  journal      = {Thin Solid Films},

  number       = C,

  volume       = 615,

  place        = {Netherlands},

  year         = {2016},

  month        = {9}

}

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10.1016/j.tsf.2016.06.056
https://doi.org/10.1016/j.tsf.2016.06.056

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Title: Prediction of recrystallization times in electroplated copper thin films

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