Prediction of recrystallization times in electroplated copper thin films

doi:10.1016/j.tsf.2016.06.056

Title: Prediction of recrystallization times in electroplated copper thin films

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Authors:: Treger, Mikhail; Witt, Christian; Cabral, Jr., Cyril; Murray, Conal; Jordan-Sweet, Jean; Rosenberg, Robert; Eisenbraun, Eric; Noyan, I. C.

Publication Date:: 2016-09-01

Sponsoring Org.:: USDOE

OSTI Identifier:: 1359949

Grant/Contract Number:: AC02-98CH10886

Resource Type:: Publisher's Accepted Manuscript

Journal Name:: Thin Solid Films

Additional Journal Information:: Journal Name: Thin Solid Films Journal Volume: 615 Journal Issue: C; Journal ID: ISSN 0040-6090

Publisher:: Elsevier

Country of Publication:: Netherlands

Language:: English

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                    Treger, Mikhail, Witt, Christian, Cabral, Jr., Cyril, Murray, Conal, Jordan-Sweet, Jean, Rosenberg, Robert, Eisenbraun, Eric, and Noyan, I. C. Prediction of recrystallization times in electroplated copper thin films.  Netherlands: N. p., 2016. 
        Web.  doi:10.1016/j.tsf.2016.06.056.

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                    Treger, Mikhail, Witt, Christian, Cabral, Jr., Cyril, Murray, Conal, Jordan-Sweet, Jean, Rosenberg, Robert, Eisenbraun, Eric, & Noyan, I. C. Prediction of recrystallization times in electroplated copper thin films.  Netherlands.  doi:10.1016/j.tsf.2016.06.056.

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                    Treger, Mikhail, Witt, Christian, Cabral, Jr., Cyril, Murray, Conal, Jordan-Sweet, Jean, Rosenberg, Robert, Eisenbraun, Eric, and Noyan, I. C. Thu .  
        "Prediction of recrystallization times in electroplated copper thin films".  Netherlands.  doi:10.1016/j.tsf.2016.06.056.

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@article{osti_1359949,

  title        = {Prediction of recrystallization times in electroplated copper thin films},

  author       = {Treger, Mikhail and Witt, Christian and Cabral, Jr., Cyril and Murray, Conal and Jordan-Sweet, Jean and Rosenberg, Robert and Eisenbraun, Eric and Noyan, I. C.},

  abstractNote = {},

  doi          = {10.1016/j.tsf.2016.06.056},

  journal      = {Thin Solid Films},

  number       = C,

  volume       = 615,

  place        = {Netherlands},

  year         = {2016},

  month        = {9}

}

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DOI: 10.1016/j.tsf.2016.06.056

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Prediction of recrystallization times in electroplated copper thin films

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