skip to main content
DOE PAGES title logo U.S. Department of Energy
Office of Scientific and Technical Information

Title: Prediction of recrystallization times in electroplated copper thin films

Authors:
; ; ; ; ; ; ;
Publication Date:
Sponsoring Org.:
USDOE
OSTI Identifier:
1359949
Grant/Contract Number:  
AC02-98CH10886
Resource Type:
Publisher's Accepted Manuscript
Journal Name:
Thin Solid Films
Additional Journal Information:
Journal Name: Thin Solid Films Journal Volume: 615 Journal Issue: C; Journal ID: ISSN 0040-6090
Publisher:
Elsevier
Country of Publication:
Netherlands
Language:
English

Citation Formats

Treger, Mikhail, Witt, Christian, Cabral, Jr., Cyril, Murray, Conal, Jordan-Sweet, Jean, Rosenberg, Robert, Eisenbraun, Eric, and Noyan, I. C. Prediction of recrystallization times in electroplated copper thin films. Netherlands: N. p., 2016. Web. doi:10.1016/j.tsf.2016.06.056.
Treger, Mikhail, Witt, Christian, Cabral, Jr., Cyril, Murray, Conal, Jordan-Sweet, Jean, Rosenberg, Robert, Eisenbraun, Eric, & Noyan, I. C. Prediction of recrystallization times in electroplated copper thin films. Netherlands. doi:10.1016/j.tsf.2016.06.056.
Treger, Mikhail, Witt, Christian, Cabral, Jr., Cyril, Murray, Conal, Jordan-Sweet, Jean, Rosenberg, Robert, Eisenbraun, Eric, and Noyan, I. C. Thu . "Prediction of recrystallization times in electroplated copper thin films". Netherlands. doi:10.1016/j.tsf.2016.06.056.
@article{osti_1359949,
title = {Prediction of recrystallization times in electroplated copper thin films},
author = {Treger, Mikhail and Witt, Christian and Cabral, Jr., Cyril and Murray, Conal and Jordan-Sweet, Jean and Rosenberg, Robert and Eisenbraun, Eric and Noyan, I. C.},
abstractNote = {},
doi = {10.1016/j.tsf.2016.06.056},
journal = {Thin Solid Films},
number = C,
volume = 615,
place = {Netherlands},
year = {2016},
month = {9}
}

Journal Article:
Free Publicly Available Full Text
Publisher's Version of Record
DOI: 10.1016/j.tsf.2016.06.056

Citation Metrics:
Cited by: 1 work
Citation information provided by
Web of Science

Save / Share: