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Title: Prediction of recrystallization times in electroplated copper thin films

Authors:
; ; ; ; ; ; ;
Publication Date:
Grant/Contract Number:
AC02-98CH10886
Type:
Publisher's Accepted Manuscript
Journal Name:
Thin Solid Films
Additional Journal Information:
Journal Volume: 615; Journal Issue: C; Related Information: CHORUS Timestamp: 2018-09-10 16:54:54; Journal ID: ISSN 0040-6090
Publisher:
Elsevier
Sponsoring Org:
USDOE
Country of Publication:
Netherlands
Language:
English
OSTI Identifier:
1359949

Treger, Mikhail, Witt, Christian, Cabral, Jr., Cyril, Murray, Conal, Jordan-Sweet, Jean, Rosenberg, Robert, Eisenbraun, Eric, and Noyan, I. C.. Prediction of recrystallization times in electroplated copper thin films. Netherlands: N. p., Web. doi:10.1016/j.tsf.2016.06.056.
Treger, Mikhail, Witt, Christian, Cabral, Jr., Cyril, Murray, Conal, Jordan-Sweet, Jean, Rosenberg, Robert, Eisenbraun, Eric, & Noyan, I. C.. Prediction of recrystallization times in electroplated copper thin films. Netherlands. doi:10.1016/j.tsf.2016.06.056.
Treger, Mikhail, Witt, Christian, Cabral, Jr., Cyril, Murray, Conal, Jordan-Sweet, Jean, Rosenberg, Robert, Eisenbraun, Eric, and Noyan, I. C.. 2016. "Prediction of recrystallization times in electroplated copper thin films". Netherlands. doi:10.1016/j.tsf.2016.06.056.
@article{osti_1359949,
title = {Prediction of recrystallization times in electroplated copper thin films},
author = {Treger, Mikhail and Witt, Christian and Cabral, Jr., Cyril and Murray, Conal and Jordan-Sweet, Jean and Rosenberg, Robert and Eisenbraun, Eric and Noyan, I. C.},
abstractNote = {},
doi = {10.1016/j.tsf.2016.06.056},
journal = {Thin Solid Films},
number = C,
volume = 615,
place = {Netherlands},
year = {2016},
month = {9}
}