Prediction of recrystallization times in electroplated copper thin films
Journal Article
·
· Thin Solid Films
- Sponsoring Organization:
- USDOE
- Grant/Contract Number:
- AC02-98CH10886
- OSTI ID:
- 1359949
- Journal Information:
- Thin Solid Films, Journal Name: Thin Solid Films Vol. 615 Journal Issue: C; ISSN 0040-6090
- Publisher:
- ElsevierCopyright Statement
- Country of Publication:
- Netherlands
- Language:
- English
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