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Title: Climate specific thermomechanical fatigue of flat plate photovoltaic module solder joints

Authors:
; ;
Publication Date:
Sponsoring Org.:
USDOE
OSTI Identifier:
1359564
Grant/Contract Number:  
DE AC36-08G028308; IUSSTF/JCERDC-SERIIUS/2012
Resource Type:
Publisher's Accepted Manuscript
Journal Name:
Microelectronics and Reliability
Additional Journal Information:
Journal Name: Microelectronics and Reliability Journal Volume: 62 Journal Issue: C; Journal ID: ISSN 0026-2714
Publisher:
Elsevier
Country of Publication:
United Kingdom
Language:
English

Citation Formats

Bosco, Nick, Silverman, Timothy J., and Kurtz, Sarah. Climate specific thermomechanical fatigue of flat plate photovoltaic module solder joints. United Kingdom: N. p., 2016. Web. https://doi.org/10.1016/j.microrel.2016.03.024.
Bosco, Nick, Silverman, Timothy J., & Kurtz, Sarah. Climate specific thermomechanical fatigue of flat plate photovoltaic module solder joints. United Kingdom. https://doi.org/10.1016/j.microrel.2016.03.024
Bosco, Nick, Silverman, Timothy J., and Kurtz, Sarah. Fri . "Climate specific thermomechanical fatigue of flat plate photovoltaic module solder joints". United Kingdom. https://doi.org/10.1016/j.microrel.2016.03.024.
@article{osti_1359564,
title = {Climate specific thermomechanical fatigue of flat plate photovoltaic module solder joints},
author = {Bosco, Nick and Silverman, Timothy J. and Kurtz, Sarah},
abstractNote = {},
doi = {10.1016/j.microrel.2016.03.024},
journal = {Microelectronics and Reliability},
number = C,
volume = 62,
place = {United Kingdom},
year = {2016},
month = {7}
}

Journal Article:
Free Publicly Available Full Text
Publisher's Version of Record
https://doi.org/10.1016/j.microrel.2016.03.024

Citation Metrics:
Cited by: 7 works
Citation information provided by
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Works referenced in this record:

Applying Anand Model to Represent the Viscoplastic Deformation Behavior of Solder Alloys
journal, October 1998

  • Wang, G. Z.; Cheng, Z. N.; Becker, K.
  • Journal of Electronic Packaging, Vol. 123, Issue 3
  • DOI: 10.1115/1.1371781

Reliability of Controlled Collapse Interconnections
journal, May 1969

  • Norris, K. C.; Landzberg, A. H.
  • IBM Journal of Research and Development, Vol. 13, Issue 3
  • DOI: 10.1147/rd.133.0266

Generic reliability figures of merit design tools for surface mount solder attachments
journal, January 1993

  • Engelmaier, W.
  • IEEE Transactions on Components, Hybrids, and Manufacturing Technology, Vol. 16, Issue 1
  • DOI: 10.1109/33.214866