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Title: Understanding the Reliability of Solder Joints Used in Advanced Structural and Electronics Applications: Part 2 - Reliability Performance.

Whether structural or electronic, all solder joints must provide the necessary level of reliability for the application. The Part 1 report examined the effects of filler metal properties and the soldering process on joint reliability. Filler metal solderability and mechanical properties, as well as the extents of base material dissolution and interface reaction that occur during the soldering process, were shown to affect reliability performance. The continuation of this discussion is presented in this Part 2 report, which highlights those factors that directly affect solder joint reliability. There is the growth of an intermetallic compound (IMC) reaction layer at the solder/base material interface by means of solid-state diffusion processes. In terms of mechanical response by the solder joint, fatigue remains as the foremost concern for long-term performance. Thermal mechanical fatigue (TMF), a form of low-cycle fatigue (LCF), occurs when temperature cycling is combined with mismatched values of the coefficient of thermal expansion (CTE) between materials comprising the solder joint “system.” Vibration environments give rise to high-cycle fatigue (HCF) degradation. Although accelerated aging studies provide valuable empirical data, too many variants of filler metals, base materials, joint geometries, and service environments are forcing design engineers to embrace computational modeling to predictmore » the long-term reliability of solder joints.« less
Authors:
 [1]
  1. Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)
Publication Date:
Report Number(s):
SAND-2017-1070J
Journal ID: ISSN 0043-2296; 650892
Grant/Contract Number:
AC04-94AL85000
Type:
Accepted Manuscript
Journal Name:
Welding Journal
Additional Journal Information:
Journal Volume: 96; Journal ID: ISSN 0043-2296
Publisher:
American Welding Society
Research Org:
Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)
Sponsoring Org:
USDOE National Nuclear Security Administration (NNSA), Office of Defense Nuclear Security (NA-70)
Country of Publication:
United States
Language:
English
Subject:
42 ENGINEERING
OSTI Identifier:
1356221

Vianco, Paul T. Understanding the Reliability of Solder Joints Used in Advanced Structural and Electronics Applications: Part 2 - Reliability Performance.. United States: N. p., Web.
Vianco, Paul T. Understanding the Reliability of Solder Joints Used in Advanced Structural and Electronics Applications: Part 2 - Reliability Performance.. United States.
Vianco, Paul T. 2017. "Understanding the Reliability of Solder Joints Used in Advanced Structural and Electronics Applications: Part 2 - Reliability Performance.". United States. doi:. https://www.osti.gov/servlets/purl/1356221.
@article{osti_1356221,
title = {Understanding the Reliability of Solder Joints Used in Advanced Structural and Electronics Applications: Part 2 - Reliability Performance.},
author = {Vianco, Paul T.},
abstractNote = {Whether structural or electronic, all solder joints must provide the necessary level of reliability for the application. The Part 1 report examined the effects of filler metal properties and the soldering process on joint reliability. Filler metal solderability and mechanical properties, as well as the extents of base material dissolution and interface reaction that occur during the soldering process, were shown to affect reliability performance. The continuation of this discussion is presented in this Part 2 report, which highlights those factors that directly affect solder joint reliability. There is the growth of an intermetallic compound (IMC) reaction layer at the solder/base material interface by means of solid-state diffusion processes. In terms of mechanical response by the solder joint, fatigue remains as the foremost concern for long-term performance. Thermal mechanical fatigue (TMF), a form of low-cycle fatigue (LCF), occurs when temperature cycling is combined with mismatched values of the coefficient of thermal expansion (CTE) between materials comprising the solder joint “system.” Vibration environments give rise to high-cycle fatigue (HCF) degradation. Although accelerated aging studies provide valuable empirical data, too many variants of filler metals, base materials, joint geometries, and service environments are forcing design engineers to embrace computational modeling to predict the long-term reliability of solder joints.},
doi = {},
journal = {Welding Journal},
number = ,
volume = 96,
place = {United States},
year = {2017},
month = {3}
}