Superplastic creep of AuSn eutectic solder alloy

Elmer, J. W.; Mulay, R. P.

doi:10.1016/j.scriptamat.2016.03.031

Title: Superplastic creep of AuSn eutectic solder alloy

Full Record
Other Related Research

Authors:: Elmer, J. W.; Mulay, R. P.

Publication Date:: Fri Jul 01 00:00:00 EDT 2016

Sponsoring Org.:: USDOE

OSTI Identifier:: 1346262

Grant/Contract Number:: AC52-07NA27344

Resource Type:: Publisher's Accepted Manuscript

Journal Name:: Scripta Materialia

Additional Journal Information:: Journal Name: Scripta Materialia Journal Volume: 120 Journal Issue: C; Journal ID: ISSN 1359-6462

Publisher:: Elsevier

Country of Publication:: United States

Language:: English

Citation Formats


                    Elmer, J. W., and Mulay, R. P. Superplastic creep of AuSn eutectic solder alloy.  United States: N. p., 2016. 
Web.  doi:10.1016/j.scriptamat.2016.03.031.

Copy to clipboard


                    Elmer, J. W., & Mulay, R. P. Superplastic creep of AuSn eutectic solder alloy.  United States.  https://doi.org/10.1016/j.scriptamat.2016.03.031

Copy to clipboard


                    Elmer, J. W., and Mulay, R. P. Fri .  
"Superplastic creep of AuSn eutectic solder alloy".  United States.  https://doi.org/10.1016/j.scriptamat.2016.03.031.

Copy to clipboard


                    
@article{osti_1346262,

  title        = {Superplastic creep of AuSn eutectic solder alloy},

  author       = {Elmer, J. W. and Mulay, R. P.},

  abstractNote = {},

  doi          = {10.1016/j.scriptamat.2016.03.031},

  journal      = {Scripta Materialia},

  number       = C,

  volume       = 120,

  place        = {United States},

  year         = {Fri Jul 01 00:00:00 EDT 2016},

  month        = {Fri Jul 01 00:00:00 EDT 2016}

}

Copy to clipboard

Journal Article:

Free Publicly Available Full Text

Accepted Manuscript (Publisher)

Publisher's Version of Record
https://doi.org/10.1016/j.scriptamat.2016.03.031

Other availability

Search WorldCat to find libraries that may hold this journal

Citation Metrics:

Cited by: 21 works

Citation information provided by
Web of Science

Save / Share:

Export Metadata

Save to My Library

Similar Records in DOE PAGES and OSTI.GOV collections:

Superplastic Creep of Eutectic Tin-Lead Solder Joints

Conference Mei, Z. ; Shine, M. C. ; Morris, Jr., J. W. - Journal of Electronic Packaging

The creep behavior of air-cooled and liquid nitrogen-quenched soldered joints of 60/40 Sn-Pb at 65°C has been studied. The stress exponent, n, in the power law, γ˙ (steady state strain rate) ∝σⁿ (applied stress), changes from a value of about 6 to values of 2 to 3, as γ˙ decreases below 10^-4 in/in per second. This result, combined with the authors’ previous stepped load creep test results, indicates a transition of the creep deformation mechanism from conventional dislocation climb to superplastic grain boundary sliding. The superplastic creep of the soldered joints is ascribed to their non-lamellar microstructure due to theirmore »« less
https://doi.org/10.1115/1.2905375

Full Text Available
Effect of microalloying on the creep strength and microstructure of an eutectic Sn-Pb solder alloy

Journal Article Wade, Noboru ; Akuzawa, Tatsuo ; Yamada, Seiji ; ... - Journal of Electronic Materials

The present research aims to improve the creep strength of Sn-Pb eutectic solder by the addition of small amount of effective elements, such as Sb, Ag, Cu, and Ga, which are selected by preliminary experiments and analysis. Creep tests were conducted at the stress and temperature range of 5 N/m to 15 N/m m{sup 2} and 313 K to 378 K, respectively. The microalloying treatment increased significantly the creep-rupture time by one order at the same condition of creep stress and temperature, comparing with that of the regular Sn-Pb eutectic solder alloy. Microstructural observation indicated that the excellent creep propertiesmore »« less
https://doi.org/10.1007/s11664-999-0169-9
Creep-fatigue interactions in eutectic tin-lead-based solder alloys. Ph.D. Thesis

Thesis/Dissertation Kuo, C W

Eutectic tin-lead solder alloys subjected to cyclic loading at room temperature experience creep-fatigue interactions due to high homologous temperature. At temperature above 0.5 melting point, the dominant damage mechanism can be cavity nucleation and growth, especially for alloys that have fine grain structure and a large volume fraction of dispersoids. The objective of the present study is to model the damage evolution during creep-fatigue interactions and experimentally validate the damage evolution based life predictions in rapidly solidified solder alloys. Four types of solder alloys were considered in this research, namely, conventional 63Sn-37Pb, rapidly solidified 63Sn-37Pb, dispersion-strengthened eutectic solders, and solidmore »« less
Reflow of AuSnSolder Creates Strong Joints [Local Reflow of AuSn Solder: Relating Strength to Microstructure]

Journal Article Golosker, Ilya V. ; Florando, Jeff N. - Welding Journal

Local heating of AuSn solder creates reliable bonds. However, small changes in the heat schedule result in significant changes to bond strength and microstructure.
Full Text Available
X-ray reflectivity studies of atomic-level surface-segregation in a liquid eutectic alloy of AuSn

Journal Article Balagurusamy, Venkatachalapathy S. K. ; Streitel, Reinhard ; Pershan, P S ; ... - Physical Review. B, Condensed Matter and Materials Physics

X-ray reflectivity studies reveal atomic-level surface-segregation at the free surface of the eutectic Au{sub 71}Sn{sub 29} liquid alloy. The surface-segregation extends up to three layers, in which the top layer is almost a pure monolayer of Sn, the second layer is almost a pure monolayer of Au and the third layer appears to be slightly enhanced in Au. Although the surface-segregation concentration profiles can be qualitatively accounted for by the theories of Defay-Prigogine and Strohl-King, they cannot satisfactorily account for the measured surface tension.
https://doi.org/10.1103/PHYSREVB.75.104209

Similar Records