Comparison of dielectric properties of additively manufactured vs. solvent cast polyimide dielectrics

Appelhans, Leah N.; Keicher, David M.; Lavin, Judith Maria

doi:10.1109/CEIDP.2016.7785510

Title: Comparison of dielectric properties of additively manufactured vs. solvent cast polyimide dielectrics

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Abstract

The permittivity, dielectric loss, and DC dielectric breakdown strength of additively manufactured, solvent-cast, and commercial polyimide films are reported As expected, commercial films performed better than both AM and solvent-cast lab-made films. Solvent-cast films generally performed better than AM films, although performance depended on the optimization of the material for the specific deposition technique. The most significant degradation of performance in all the lab-made films was in the dispersion of both the x/Df measurements and the dielectric breakdown strength (Weibull β). Commercial films had a breakdown strength of 4891 kV/cm and β = 13.0 whereas the highest performing lab-made films had a breakdown strength of 4072 kV/cm and β = 3.8. Furthermore, this increase in dispersion in all the lab-made samples is attributed to higher variability in the preparation, a higher defect level related to fabrication in the lab environment and, for some AM samples, to morphology/topology features resulting from the deposition technique.

Authors:

Appelhans, Leah N. ^[1]; Keicher, David M. ^[1]; Lavin, Judith Maria ^[1]

Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)

Publication Date:: Sat Oct 01 00:00:00 EDT 2016

Research Org.:: Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)

Sponsoring Org.:: USDOE National Nuclear Security Administration (NNSA)

OSTI Identifier:: 1344474

Report Number(s):: SAND-2016-6113J
642750

Grant/Contract Number:: AC04-94AL85000

Resource Type:: Accepted Manuscript

Journal Name:: IEEE Transactions on Dielectrics and Electrical Insulation

Additional Journal Information:: Journal Name: IEEE Transactions on Dielectrics and Electrical Insulation

Country of Publication:: United States

Language:: English

Subject:: 36 MATERIALS SCIENCE; films; electrodes; solvents; permittivity; dielectrics; polyimides; dielectric breakdown

Citation Formats


                    Appelhans, Leah N., Keicher, David M., and Lavin, Judith Maria. Comparison of dielectric properties of additively manufactured vs. solvent cast polyimide dielectrics.  United States: N. p., 2016. 
Web.  doi:10.1109/CEIDP.2016.7785510.

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                    Appelhans, Leah N., Keicher, David M., & Lavin, Judith Maria. Comparison of dielectric properties of additively manufactured vs. solvent cast polyimide dielectrics.  United States.  https://doi.org/10.1109/CEIDP.2016.7785510

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                    Appelhans, Leah N., Keicher, David M., and Lavin, Judith Maria. Sat .  
"Comparison of dielectric properties of additively manufactured vs. solvent cast polyimide dielectrics".  United States.  https://doi.org/10.1109/CEIDP.2016.7785510.  https://www.osti.gov/servlets/purl/1344474.

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@article{osti_1344474,

  title        = {Comparison of dielectric properties of additively manufactured vs. solvent cast polyimide dielectrics},

  author       = {Appelhans, Leah N. and Keicher, David M. and Lavin, Judith Maria},

  abstractNote = {The permittivity, dielectric loss, and DC dielectric breakdown strength of additively manufactured, solvent-cast, and commercial polyimide films are reported As expected, commercial films performed better than both AM and solvent-cast lab-made films. Solvent-cast films generally performed better than AM films, although performance depended on the optimization of the material for the specific deposition technique. The most significant degradation of performance in all the lab-made films was in the dispersion of both the x/Df measurements and the dielectric breakdown strength (Weibull β). Commercial films had a breakdown strength of 4891 kV/cm and β = 13.0 whereas the highest performing lab-made films had a breakdown strength of 4072 kV/cm and β = 3.8. Furthermore, this increase in dispersion in all the lab-made samples is attributed to higher variability in the preparation, a higher defect level related to fabrication in the lab environment and, for some AM samples, to morphology/topology features resulting from the deposition technique.},

  doi          = {10.1109/CEIDP.2016.7785510},

  journal      = {IEEE Transactions on Dielectrics and Electrical Insulation},

  number       = ,

  volume       = ,

  place        = {United States},

  year         = {Sat Oct 01 00:00:00 EDT 2016},

  month        = {Sat Oct 01 00:00:00 EDT 2016}

}

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