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Title: Using Synchrotron Radiation Microtomography to Investigate Multi-scale Three-dimensional Microelectronic Packages

For this study synchrotron radiation micro-­tomography, a non-destructive three-dimensional imaging technique, is employed to investigate an entire microelectronic package with a cross-sectional area of 16 x 16 mm. Due to the synchrotron’s high flux and brightness the sample was imaged in just 3 minutes with an 8.7 μm spatial resolution.
Authors:
 [1] ;  [1] ;  [2] ;  [3] ;  [2] ;  [4] ;  [4]
  1. Lawrence Livermore National Lab. (LLNL), Livermore, CA (United States). Materials Engineering Division
  2. Intel Corporation, Chandler, AZ (United States). Assembly Test and Technology Development Failure Analysis Labs
  3. Intel Corporation, Chandler, AZ (United States). Assembly Test and Technology Development Failure Analysis Labs
  4. Lawrence Berkeley National Lab. (LBNL), Berkeley, CA (United States). Advanced Light Source (ALS)
Publication Date:
Report Number(s):
LLNL-JRNL-670598
Journal ID: ISSN 1940-087X;
Grant/Contract Number:
AC52-07NA27344; AC02-­‐05CH11231; AC02-05CH11231
Type:
Accepted Manuscript
Journal Name:
Journal of Visualized Experiments
Additional Journal Information:
Journal Issue: 110; Journal ID: ISSN 1940-087X
Publisher:
MyJoVE Corp.
Research Org:
Lawrence Livermore National Lab. (LLNL), Livermore, CA (United States); Lawrence Berkeley National Lab. (LBNL), Berkeley, CA (United States)
Sponsoring Org:
USDOE Office of Science (SC), Basic Energy Sciences (BES) (SC-22)
Country of Publication:
United States
Language:
English
Subject:
42 ENGINEERING; 36 MATERIALS SCIENCE
OSTI Identifier:
1341977
Alternate Identifier(s):
OSTI ID: 1426722