Surface Profile and Stress Field Evaluation using Digital Gradient Sensing Method

Miao, C.; Sundaram, B. M.; Huang, L.; Tippur, H. V.

doi:10.1088/0957-0233/27/9/095203

Title: Surface Profile and Stress Field Evaluation using Digital Gradient Sensing Method

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Abstract

Shape and surface topography evaluation from measured orthogonal slope/gradient data is of considerable engineering significance since many full-field optical sensors and interferometers readily output accurate data of that kind. This has applications ranging from metrology of optical and electronic elements (lenses, silicon wafers, thin film coatings), surface profile estimation, wave front and shape reconstruction, to name a few. In this context, a new methodology for surface profile and stress field determination based on a recently introduced non-contact, full-field optical method called digital gradient sensing (DGS) capable of measuring small angular deflections of light rays coupled with a robust finite-difference-based least-squares integration (HFLI) scheme in the Southwell configuration is advanced here. The method is demonstrated by evaluating (a) surface profiles of mechanically warped silicon wafers and (b) stress gradients near growing cracks in planar phase objects.

Authors:

Miao, C. ^[1]; Sundaram, B. M. ^[1]; Huang, L. ^[2]; Tippur, H. V. ^[1]

Auburn Univ., AL (United States)
Brookhaven National Lab. (BNL), Upton, NY (United States)

Publication Date:: Tue Aug 09 00:00:00 EDT 2016

Research Org.:: Brookhaven National Lab. (BNL), Upton, NY (United States)

Sponsoring Org.:: USDOE Office of Science (SC), Basic Energy Sciences (BES)

OSTI Identifier:: 1340426

Report Number(s):: BNL-113341-2016-JA
Journal ID: ISSN 0957-0233

Grant/Contract Number:: SC00112704

Resource Type:: Accepted Manuscript

Journal Name:: Measurement Science and Technology

Additional Journal Information:: Journal Volume: 27; Journal ID: ISSN 0957-0233

Publisher:: IOP Publishing

Country of Publication:: United States

Language:: English

Subject:: 42 ENGINEERING; Optical Metrology; Surface Slopes; Stress Gradients; Digital Gradient Sensing; Surface Topography; Stress Evaluation

Citation Formats


                    Miao, C., Sundaram, B. M., Huang, L., and Tippur, H. V. Surface Profile and Stress Field Evaluation using Digital Gradient Sensing Method.  United States: N. p., 2016. 
Web.  doi:10.1088/0957-0233/27/9/095203.

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                    Miao, C., Sundaram, B. M., Huang, L., & Tippur, H. V. Surface Profile and Stress Field Evaluation using Digital Gradient Sensing Method.  United States.  https://doi.org/10.1088/0957-0233/27/9/095203

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                    Miao, C., Sundaram, B. M., Huang, L., and Tippur, H. V. Tue .  
"Surface Profile and Stress Field Evaluation using Digital Gradient Sensing Method".  United States.  https://doi.org/10.1088/0957-0233/27/9/095203.  https://www.osti.gov/servlets/purl/1340426.

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@article{osti_1340426,

  title        = {Surface Profile and Stress Field Evaluation using Digital Gradient Sensing Method},

  author       = {Miao, C. and Sundaram, B. M. and Huang, L. and Tippur, H. V.},

  abstractNote = {Shape and surface topography evaluation from measured orthogonal slope/gradient data is of considerable engineering significance since many full-field optical sensors and interferometers readily output accurate data of that kind. This has applications ranging from metrology of optical and electronic elements (lenses, silicon wafers, thin film coatings), surface profile estimation, wave front and shape reconstruction, to name a few. In this context, a new methodology for surface profile and stress field determination based on a recently introduced non-contact, full-field optical method called digital gradient sensing (DGS) capable of measuring small angular deflections of light rays coupled with a robust finite-difference-based least-squares integration (HFLI) scheme in the Southwell configuration is advanced here. The method is demonstrated by evaluating (a) surface profiles of mechanically warped silicon wafers and (b) stress gradients near growing cracks in planar phase objects.},

  doi          = {10.1088/0957-0233/27/9/095203},

  journal      = {Measurement Science and Technology},

  number       = ,

  volume       = 27,

  place        = {United States},

  year         = {Tue Aug 09 00:00:00 EDT 2016},

  month        = {Tue Aug 09 00:00:00 EDT 2016}

}

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