DOE PAGES title logo U.S. Department of Energy
Office of Scientific and Technical Information

Title: Recent progress of RD53 Collaboration towards next generation Pixel Read-Out Chip for HL-LHC

Abstract

This paper is a review of recent progress of RD53 Collaboration. Results obtained on the study of the radiation effects on 65 nm CMOS have matured enough to define first strategies to adopt in the design of analog and digital circuits. Critical building blocks and analog very front end chains have been designed, tested before and after 5–800 Mrad. Small prototypes of 64×64 pixels with complex digital architectures have been produced, and point to address the main issues of dealing with extremely high pixel rates, while operating at very small in-time thresholds in the analog front end. Lastly, the collaboration is now proceeding at full speed towards the design of a large scale prototype, called RD53A, in 65 nm CMOS technology.

Authors:
 [1]
  1. INFN Torino (Italy).et al
Publication Date:
Research Org.:
Fermi National Accelerator Lab. (FNAL), Batavia, IL (United States)
Sponsoring Org.:
USDOE Office of Science (SC), High Energy Physics (HEP)
OSTI Identifier:
1339126
Report Number(s):
FERMILAB-CONF-16-622-PPD
Journal ID: ISSN 1748-0221; 1506504; TRN: US1701107
Grant/Contract Number:  
AC02-07CH11359
Resource Type:
Accepted Manuscript
Journal Name:
Journal of Instrumentation
Additional Journal Information:
Journal Volume: 11; Journal Issue: 12; Journal ID: ISSN 1748-0221
Publisher:
Institute of Physics (IOP)
Country of Publication:
United States
Language:
English
Subject:
46 INSTRUMENTATION RELATED TO NUCLEAR SCIENCE AND TECHNOLOGY; Front-end electronics for detector readout; Particle tracking detectors (Solid-state detectors); Radiation-hard electronics; VLSI circuits

Citation Formats

Demaria, N. Recent progress of RD53 Collaboration towards next generation Pixel Read-Out Chip for HL-LHC. United States: N. p., 2016. Web. doi:10.1088/1748-0221/11/12/C12058.
Demaria, N. Recent progress of RD53 Collaboration towards next generation Pixel Read-Out Chip for HL-LHC. United States. https://doi.org/10.1088/1748-0221/11/12/C12058
Demaria, N. Wed . "Recent progress of RD53 Collaboration towards next generation Pixel Read-Out Chip for HL-LHC". United States. https://doi.org/10.1088/1748-0221/11/12/C12058. https://www.osti.gov/servlets/purl/1339126.
@article{osti_1339126,
title = {Recent progress of RD53 Collaboration towards next generation Pixel Read-Out Chip for HL-LHC},
author = {Demaria, N.},
abstractNote = {This paper is a review of recent progress of RD53 Collaboration. Results obtained on the study of the radiation effects on 65 nm CMOS have matured enough to define first strategies to adopt in the design of analog and digital circuits. Critical building blocks and analog very front end chains have been designed, tested before and after 5–800 Mrad. Small prototypes of 64×64 pixels with complex digital architectures have been produced, and point to address the main issues of dealing with extremely high pixel rates, while operating at very small in-time thresholds in the analog front end. Lastly, the collaboration is now proceeding at full speed towards the design of a large scale prototype, called RD53A, in 65 nm CMOS technology.},
doi = {10.1088/1748-0221/11/12/C12058},
journal = {Journal of Instrumentation},
number = 12,
volume = 11,
place = {United States},
year = {Wed Dec 21 00:00:00 EST 2016},
month = {Wed Dec 21 00:00:00 EST 2016}
}

Journal Article:
Free Publicly Available Full Text
Publisher's Version of Record

Citation Metrics:
Cited by: 13 works
Citation information provided by
Web of Science

Save / Share: