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Title: Electrodeposited copper foams as substrates for thin film silicon electrodes

Authors:
; ; ;
Publication Date:
Type:
Publisher's Accepted Manuscript
Journal Name:
Solid State Ionics
Additional Journal Information:
Journal Volume: 288; Journal Issue: C; Related Information: CHORUS Timestamp: 2018-09-14 20:53:37; Journal ID: ISSN 0167-2738
Publisher:
Elsevier
Sponsoring Org:
USDOE
Country of Publication:
Netherlands
Language:
English
OSTI Identifier:
1338229

Dogan, Fulya, Sanjeewa, Liurukara D., Hwu, Shiou-Jyh, and Vaughey, J. T.. Electrodeposited copper foams as substrates for thin film silicon electrodes. Netherlands: N. p., Web. doi:10.1016/j.ssi.2016.02.001.
Dogan, Fulya, Sanjeewa, Liurukara D., Hwu, Shiou-Jyh, & Vaughey, J. T.. Electrodeposited copper foams as substrates for thin film silicon electrodes. Netherlands. doi:10.1016/j.ssi.2016.02.001.
Dogan, Fulya, Sanjeewa, Liurukara D., Hwu, Shiou-Jyh, and Vaughey, J. T.. 2016. "Electrodeposited copper foams as substrates for thin film silicon electrodes". Netherlands. doi:10.1016/j.ssi.2016.02.001.
@article{osti_1338229,
title = {Electrodeposited copper foams as substrates for thin film silicon electrodes},
author = {Dogan, Fulya and Sanjeewa, Liurukara D. and Hwu, Shiou-Jyh and Vaughey, J. T.},
abstractNote = {},
doi = {10.1016/j.ssi.2016.02.001},
journal = {Solid State Ionics},
number = C,
volume = 288,
place = {Netherlands},
year = {2016},
month = {5}
}