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Title: Electrodeposited copper foams as substrates for thin film silicon electrodes

Authors:
; ; ;
Publication Date:
Sponsoring Org.:
USDOE Office of Energy Efficiency and Renewable Energy (EERE), Transportation Office. Vehicle Technologies Office
OSTI Identifier:
1338229
Resource Type:
Publisher's Accepted Manuscript
Journal Name:
Solid State Ionics
Additional Journal Information:
Journal Name: Solid State Ionics Journal Volume: 288 Journal Issue: C; Journal ID: ISSN 0167-2738
Publisher:
Elsevier
Country of Publication:
Netherlands
Language:
English

Citation Formats

Dogan, Fulya, Sanjeewa, Liurukara D., Hwu, Shiou-Jyh, and Vaughey, J. T. Electrodeposited copper foams as substrates for thin film silicon electrodes. Netherlands: N. p., 2016. Web. doi:10.1016/j.ssi.2016.02.001.
Dogan, Fulya, Sanjeewa, Liurukara D., Hwu, Shiou-Jyh, & Vaughey, J. T. Electrodeposited copper foams as substrates for thin film silicon electrodes. Netherlands. doi:10.1016/j.ssi.2016.02.001.
Dogan, Fulya, Sanjeewa, Liurukara D., Hwu, Shiou-Jyh, and Vaughey, J. T. Sun . "Electrodeposited copper foams as substrates for thin film silicon electrodes". Netherlands. doi:10.1016/j.ssi.2016.02.001.
@article{osti_1338229,
title = {Electrodeposited copper foams as substrates for thin film silicon electrodes},
author = {Dogan, Fulya and Sanjeewa, Liurukara D. and Hwu, Shiou-Jyh and Vaughey, J. T.},
abstractNote = {},
doi = {10.1016/j.ssi.2016.02.001},
journal = {Solid State Ionics},
number = C,
volume = 288,
place = {Netherlands},
year = {2016},
month = {5}
}

Journal Article:
Free Publicly Available Full Text
Publisher's Version of Record
DOI: 10.1016/j.ssi.2016.02.001

Citation Metrics:
Cited by: 3 works
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