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Title: Electrodeposited copper foams as substrates for thin film silicon electrodes

Authors:
; ; ;
Publication Date:
Type:
Publisher's Accepted Manuscript
Journal Name:
Solid State Ionics
Additional Journal Information:
Journal Volume: 288; Journal Issue: C; Related Information: CHORUS Timestamp: 2018-09-14 20:53:37; Journal ID: ISSN 0167-2738
Publisher:
Elsevier
Sponsoring Org:
USDOE
Country of Publication:
Netherlands
Language:
English
OSTI Identifier:
1338229