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Title: Interplay between grain boundary segregation and electrical resistivity in dilute nanocrystalline Cu alloys

Authors:
; ; ; ;
Publication Date:
Sponsoring Org.:
USDOE
OSTI Identifier:
1337760
Grant/Contract Number:  
SC0008135
Resource Type:
Publisher's Accepted Manuscript
Journal Name:
Scripta Materialia
Additional Journal Information:
Journal Name: Scripta Materialia Journal Volume: 123 Journal Issue: C; Journal ID: ISSN 1359-6462
Publisher:
Elsevier
Country of Publication:
United States
Language:
English

Citation Formats

Kim, Gyuseok, Chai, Xuzhao, Yu, Le, Cheng, Xuemei, and Gianola, Daniel S. Interplay between grain boundary segregation and electrical resistivity in dilute nanocrystalline Cu alloys. United States: N. p., 2016. Web. doi:10.1016/j.scriptamat.2016.06.008.
Kim, Gyuseok, Chai, Xuzhao, Yu, Le, Cheng, Xuemei, & Gianola, Daniel S. Interplay between grain boundary segregation and electrical resistivity in dilute nanocrystalline Cu alloys. United States. doi:10.1016/j.scriptamat.2016.06.008.
Kim, Gyuseok, Chai, Xuzhao, Yu, Le, Cheng, Xuemei, and Gianola, Daniel S. Sat . "Interplay between grain boundary segregation and electrical resistivity in dilute nanocrystalline Cu alloys". United States. doi:10.1016/j.scriptamat.2016.06.008.
@article{osti_1337760,
title = {Interplay between grain boundary segregation and electrical resistivity in dilute nanocrystalline Cu alloys},
author = {Kim, Gyuseok and Chai, Xuzhao and Yu, Le and Cheng, Xuemei and Gianola, Daniel S.},
abstractNote = {},
doi = {10.1016/j.scriptamat.2016.06.008},
journal = {Scripta Materialia},
number = C,
volume = 123,
place = {United States},
year = {2016},
month = {10}
}

Journal Article:
Free Publicly Available Full Text
Publisher's Version of Record
DOI: 10.1016/j.scriptamat.2016.06.008

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Cited by: 1 work
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